| Product Name |
Notes |
|
Bondmaster® -- B-ETP 350
|
Room temperature curable, accelerated by heat, easy to use and apply
|
|
Conductive Adhesive -- Electrodag® 5810
|
Good electrical and thermal conductivity, high strength
|
|
E&C-56C/ Catalyst 11
|
Two component, general purpose, high temperature
|
|
E&C-56C/ Catalyst 9
|
Two component, general purpose
|
|
E&C-CF3350
|
High electrical and thermal conductivity ideal for RF power applications
|
|
E&C-CF3352
|
Gold filled version of CF 3550, eliminates migration and corrosion concerns
|
|
E&C-XCE 3050
|
Microelectronic grade, stress absorbing
|
|
E&C-XCE 3051
|
Microelectronic grade, superior dispense performance
|
|
E&C-XCE 3104XL
|
Lead free, solder alternative, screen and stencil printing
|
|
ECCOBOND® -- E&C-56 C/ Catalyst 11
|
Epoxy adhesive featuring extremely low electrical resistance
|
|
ECCOBOND® -- E&C-56 C/ Catalyst 9
|
Epoxy adhesive featuring extremely low electrical resistance
|
|
ECCOBOND® -- E&C-57 C
|
Cure is accomplished in a few hours at room temperature
|
|
ECCOBOND® -- E&C-57 C A/B
|
Yield good electrical and thermal conductivity
|
|
ECCOBOND® -- E&C-83 C/ Catalyst 9
|
Supplied as a smooth, creamy that is easier to mix
|
|
ECCOBOND® -- E&C-83C/ Catalyst B 97
|
Supplied as a smooth, creamy that is easier to mix
|
|
ECCOBOND® -- E&C-CS 6000
|
Silver filled, one component silicone adhesive
|
|
ECCOBOND® -- E&C-CS6000
|
Designed for adhering electrical components in demanding applications
|
|
ECCOBOND® -- E&C-CT 5047-2 A/B
|
Two component, general purpose, room temperature cure
|
|
ECCOBOND® -- E&C-CT5047-2A/B
|
Two component, silver filled, electronically conductive, epoxy adhesive
|
|
Part A Gray Electrically Epoxy Adhesive -- EC60L QT PART A
|
Carbon filled, electrically conductive epoxy adheisve
|
|
SMD Conductive Epoxy -- Electrodag® 5915
|
High tensile strength, good electrical and thermal conductivity
|
|
Stycast 280FT BLK -- EC2850FT QT BLK
|
2 Component, thermally conductive epoxy encapsulant
|
|
Stycast 2850FT-FR Black -- EC2850FT-FR QT
|
Two component, fire resistant, thermally conductive epoxy encapsulant
|
