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Ablebond® -- A-GA-1ELV Conductive Adhesives and Compounds Data Sheets National Starch and Chemical Co.


Available from: National Starch and Chemical Co.
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Ablebond® -- A-GA-1ELV
SPECIFICATIONS View Entire Datasheet
Type Electrically Conductive Compound
Chemical System Epoxy
Filler Filled; Metal or MIM
Cure / Technology Thermoset; Single Component
Form / Shape Adhesive; Grease / Paste
Notes Offers low weight loss properties characteristic of epoxy based adhesives
Abstract ABLEBOND® GA-1ELV low stress, snap cure adhesive is snap cured using directed heat energy or hot plate curing designed for high throughput bonding applications. This techniques. In conventional box or convection conveyor adhesive exhibits low weight loss properties characteristic oven curing, it will cure rapidly at temperatures as low as of epoxy-based adhesives making it ideal for low out-gas- 110ºC. sing applications in disk drive and optoelectronic assem- bly applications. ABLEBOND GA-1ELV adhesive is a lower viscosity ver- sion o...
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