| Product Name |
Notes |
|
50+ Shore D Polyurethane System -- RF-1731
|
50+ Shore D polyurethane system, ideal for electrical potting
|
|
Clear Epoxy Encapsulant -- RF 2461-1
|
Excellent against water, alkali solutions, and aqueous detergent solutions
|
|
Conductive Epoxy System -- RF 713
|
Epoxy adhesive, good physical strength & high electrical conductivity
|
|
Electrical Sealing Compound -- RFC-2275
|
Sealing compound for insulation and reinforcement of electrical components
|
|
Electrically Conductive Adhesive -- RFC-2869 Mod 2
|
This adhesive will have high thermal & electrical conductive properties
|
|
Electrically Conductive Epoxy System -- RF 2969 Mod 4
|
Easy to use, high electrical conductivity & good chemical resistance
|
|
Epoxy Adhesive & Potting Compound -- RF-5185
|
Easy-to-use, one part liquid epoxy adhesive and potting material
|
|
Epoxy Adhesive & Potting Material -- RF 2452 Mod 1
|
Two-part, room temperature curing adhesive and potting material
|
|
Epoxy Encapsulant System -- RF-1261
|
Low viscosity, fast curing, modified epoxy encapsulant
|
|
Epoxy Encapsulating & Potting System -- RF-1591
|
Has good thermal conductivity, chemical and thermal shock resistance
|
|
Epoxy Encapsulating & Potting System -- RF-1591BF
|
Low viscosity, fast curing epoxy encapsulating & potting system
|
|
Epoxy Potting System -- RF 2871 Mod 2
|
It is formulated to resist thermal cycling, while maintaining adhesive char
|
|
Epoxy Potting System -- RF-5407
|
Combine with suitable curing agents to produce epoxy plastics for potting
|
|
Epoxy Resin -- RF 1340 Mod 1
|
Designed for electrical potting/encapsulating of electrical components
|
|
Epoxy Resin -- RF 4407
|
Various curing agents can be used to achieve particular end properties
|
|
Epoxy Resin -- RF 4407AS Mod 13
|
Epoxy resin system for electrical potting or encapsulating applications
|
|
Epoxy System -- RF-5130
|
Easy-to-use, one-part, liquid epoxy requiring only a moderate temp cure
|
|
Filled Epoxy Resin System -- RF 1348 Mod 1
|
For high temperature resistant potting or encapsulating apps up to 160¦C
|
|
Liquid Epoxy Resin -- RF 4010
|
Combine with suitable curing agents to produce epoxy plastics for potting
|
|
Liquid Epoxy Resin -- RF-3000
|
Combine with suitable curing agents to produce epoxy plastics for potting
|
|
Liquid Epoxy Resin -- RF-3500
|
May be combined with suitable curing agents to produce epoxy plastics
|
|
Liquid Epoxy Resin -- RF-4000
|
Combine with suitable curing agents to produce epoxy plastics for potting
|
|
Liquid Epoxy Resin -- RF-5000
|
Combine with suitable curing agents to produce epoxy plastics for potting
|
|
Low Density Epoxy System -- RF-1902
|
Low density epoxy system designed for potting and encapsulating
|
|
Low Viscosity Polyurethane Adhesive -- RF 1350
|
Convenient mix ratio, low viscosity, contains no solvents & quick curing
|
