| Product Name |
Notes |
|
1264 A Clear Epxoy Encapsulant 45LB Pail -- EC1264 GL5 PART A
|
2 component, room temperature curable, transparent epoxy casting resin
|
|
2072 Part A 5GAL/PAIL -- EC2072 5GL PTA
|
Two component, filled, low viscosity, epoxy encapsulant
|
|
2651 Black Epoxy Encapsulant 60LB Pail -- EC2651 GL5 BLK
|
Filled, general purpose, dielectric grade epoxy encapsulant
|
|
2651-40 Epoxy Encapsulant Black -- EC2651-40 GL5
|
General purpose, dielectric grade epoxy encapsulant.
|
|
Bondmaster® -- B-E14
|
Exhibits excellent arc-track resistance and fire retardancy
|
|
LITE-LOK® -- B-4001
|
Ultra violet based adhesive designed for sealing
|
|
LITE-LOK® -- B-4002
|
100% solids, solvent free, cures low shrinkage, transparent solid
|
|
LITE-LOK® -- B-463
|
Fast cure under long wavelength UV light, versatile adhesion
|
|
LITE-LOK® -- B-465
|
Fast cure under UV light, good thermal cycling resistance
|
|
LITE-LOK® -- B-476
|
Fast cure under long wavelength UV light, versatile adhesion
|
|
LITE-LOK® -- B-482
|
Fast cure under long wavelength UV light, versatile adhesion
|
|
LITE-LOK® -- B-490
|
Fast cure under long wavelength UV light, versatile adhesion
|
|
SMD Conductive Epoxy -- Electrodag® 5915
|
High tensile strength, good electrical and thermal conductivity
|
|
Stycast 2651-40 BLK 2LB Quart -- EC2651-40 QT
|
A filled, general purpose, dielectric grade epoxy encapsulant
|
|
Stycast 280FT BLK -- EC2850FT QT BLK
|
2 Component, thermally conductive epoxy encapsulant
|
|
Stycast 2850FT-FR Black -- EC2850FT-FR QT
|
Two component, fire resistant, thermally conductive epoxy encapsulant
|
|
Stycast 5954 RED PART A -- EC5954 QT PART A
|
A highly filled, addition cured, silicone encapsulant
|
|
Stycast 5954 WHT PART B -- EC5954 QT PART B
|
A highly filled, addition cured, silicone encapsulant
|
