| Product Name |
Notes |
|
Ablebond® -- A-2000
|
Ultra-low moisture absorption, fast cure no voids, minimal resin bleed
|
|
Ablebond® -- A-2000T
|
Ultra-low moisture absorption, fast cure no voids, minimal resin bleed
|
|
Ablebond® -- A-2025D
|
Fast or snap cure, minimum bleed, good adhesion to substrates
|
|
Ablebond® -- A-2100A
|
Fast cure with no voids, high hot/ wet adhesion, low stress
|
|
Ablebond® -- A-2815A
|
Good dispensability and good filley formation, low moisture absorption
|
|
Ablebond® -- A-3003
|
Designed for thermally enhanced FCBGA applications
|
|
Ablebond® -- A-3230
|
Fast oven cure, excellent adhesion to copper, low stress
|
|
Ablebond® -- A-3280T
|
Improved MRT levels, fast cure formulation, snap cure option
|
|
Ablebond® -- A-8290
|
Low stress, improved JEDEC performance, used for a variety of die sizes
|
|
Ablebond® -- A-8340A
|
Excellent hot wet adhesion, reduced moisture absorption, low stress
|
|
Ablebond® -- A-8355F
|
Minimal voiding, low stress for large die in thin packages
|
|
Ablebond® -- A-8360
|
Excellent dispensability, box oven cure, minimal resin bleed
|
|
Ablebond® -- A-8361J
|
Improved electrical conductivity, excellent dispensability, minimal voiding
|
|
Ablebond® -- A-8390A
|
Excellent dispensability, flexible processing options, minimal resin bleed
|
|
Ablebond® -- A-84-1LMISR4
|
Excellent dispensability with minimal tailing, box oven cure
|
|
Ablebond® -- A-84-3J
|
Box oven cure, engineered for accurate bondline control
|
|
Ablebond® -- A-84-3MVBTI
|
Low bleed, longer work life, good dispensability
|
|
Ablebond® -- A-8510AA
|
Suitable for bonding of wide range of die sizes
|
|
Ablebond® -- A-8700E
|
Excellent adhesion to component termination surfaces
|
|
Ablebond® -- A-8900NC
|
In-line snap cure, moderately stress absorbing, low resin bleed
|
|
Ablebond® -- A-979-1AS
|
Rapidly develops bond strength, snap cure, solvent-free
|
|
Ablebond® -- A-GA-1ELV
|
Offers low weight loss properties characteristic of epoxy based adhesives
|
|
Ablebond® -- A-GA-5
|
Features improved dispensability and low temperature cure options
|
|
Ablebond® -- A-MC723
|
Adhesive has ultra low moisture absorption at environmental conditions
|
|
Ablebond® -- A-OA-1E
|
Features low temperature cure, excellent stress absorption
|
