| Product Name |
Notes |
|
Clear Encapsulant -- RTVS-61
|
Thermal conductivity rating, .11, addition cure systems
|
|
Electronic Encapsulant -- RTVS-27
|
Thermal conductivity rating, .18, addition cure systems
|
|
Gen. Purpose MIL AA 56023 -- RTVS-11
|
Thermal conductivity rating, .18, addition cure systems
|
|
High DURO. MIL 56023 -- RTVS-13
|
Thermal conductivity rating, .18, addition cure systems
|
|
High Temp. MIL 56093 -- RTVS-16
|
Thermal conductivity rating, .18, addition cure systems
|
|
High Thermal Conductivity -- RTVS-3-95-1
|
Thermal conductivity rating, .83, addition cure systems
|
|
High Thermal. Conductivity. -- RTVS-49
|
Thermal conductivity rating, .83, addition cure systems
|
|
High Voltage Potting -- RTVS-27-17
|
Thermal conductivity rating, .18, addition cure systems
|
|
High Voltage Potting -- RTVS-27HTC
|
Thermal conductivity rating, .58, addition cure systems
|
|
High Voltage Power Supply -- RTVS-25
|
Thermal conductivity rating, .21, addition cure systems
|
|
Low CTE, Low Temp. -- RTVS-1-289-3
|
Thermal conductivity rating, .17, addition cure systems
|
|
Low Density -- RTVS-46
|
Thermal conductivity rating, .15, addition cure systems
|
|
Low Temp. Applications -- RTVS-51
|
Thermal conductivity rating, .18, addition cure systems
|
|
Low Temp. Applications -- RTVS-56
|
Thermal conductivity rating, .18, addition cure systems
|
|
MIIL AA 56023 -- RTVS-12
|
Thermal conductivity rating, .18, addition cure systems
|
|
Self Priming -- RTVS-142 A/B
|
Thermal conductivity rating, .38, addition cure systems
|
|
Self Priming -- RTVS-287
|
Thermal conductivity rating, .18, addition cure systems
|
|
Self Priming -- RTVS-570
|
Thermal conductivity rating, .21, addition cure systems
|
|
THIXOTROPIC -- RTVS-18
|
Thermal conductivity rating, .18, addition cure systems
|
|
UL 94 V-0 Listed -- RTVS-42
|
Thermal conductivity rating, .38, addition cure systems
|
|
UL94 VO -- RTVS-69
|
Thermal conductivity rating, .27, addition cure systems
|
