Data sheet for EP21TDCNFL from Master Bond, Inc. on GlobalSpec

EP21TDCNFL Polyurethane Adhesives and Sealants Data Sheets Master Bond, Inc.

EP21TDCNFL

SPECIFICATIONS

Compound Type	Adhesive; Sealant; Thermally Conductive
Substrate Compatibility	CeramicGlass; ConcreteMasonry; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Wood; Dissimilar Substrates; Metal/Plastic/Glass/Ceramic/Elast.&Wood
Cure / Technology	Two Component
Features	Anti-static or ESD Control; Electrical Insulation; Electrically Conductive Compound; EMI / RFI Shielding Material; Filled; Flexible or Dampening; Laminating; Metal or MIM
Industry	Aerospace; Automotive; Electronics; Electrical Power or High Voltage; Marine; OEM or Industrial; Semiconductors or IC Packaging; Chemical/Oil Processing/Metal Working
Notes	Nickel conductive epoxy for bonding & sealing, good electrical conductivity

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