| Product Name |
Notes |
|
Ablebond® -- A-16-1LV
|
Works at room temperature while providing a moderate work life
|
|
Ablebond® -- A-84-1LMISR4
|
Excellent dispensability with minimal tailing, box oven cure
|
|
Ablebond® -- A-8510AA
|
Suitable for bonding of wide range of die sizes
|
|
Ablebond® -- A-8700E
|
Excellent adhesion to component termination surfaces
|
|
Ablebond® -- A-8900NC
|
In-line snap cure, moderately stress absorbing, low resin bleed
|
|
Ablebond® -- A-GA-1ELV
|
Offers low weight loss properties characteristic of epoxy based adhesives
|
|
Ablebond® -- A-GA-5
|
Features improved dispensability and low temperature cure options
|
|
Ablebond® -- E&C-967-1
|
Low temperature cure
|
|
Ablebond® -- E&C-976-1
|
Flexible, low viscosity
|
|
Ablefilm™ -- A-5020K
|
Flows consistently without voids on die sizes over 20x20 mm
|
|
Ablefilm™ -- A-561K
|
Flexible for bonding mismatched adherents, thermally conductive
|
|
Ablefilm® -- E&C-5025E
|
An unsupported silver bearing, epoxy film adhesive
|
|
Ablefilm® -- E&C-5662
|
Polyimide carrier provides high electrical insulation
|
|
Ablefilm® -- E&C-ECF550X
|
Best thermal performance in glass supported film
|
|
Ableflex® -- A-6201
|
Ideal for use in flex or laminate-based packages
|
|
Ableflex® -- A-6202C
|
Ideal for chip scale packages, where tolerance and bleed are minimized
|
|
AMICON® -- E&C-E 6001
|
Low temperature curing, pin transfer capabilities
|
|
AMICON® -- E&C-E 6752
|
Low CTE, low shrinkage, high speed dispense
|
|
Bondmaster® -- B-4E90A/B
|
Offers a long pot life and features low viscosity
|
|
Bondmaster® -- B-4E93
|
Formulated for bonding needles into hubs
|
|
Bondmaster® -- B-4E98
|
Ideal for bonding heat sensitive substrates used in medical device industry
|
|
Bondmaster® -- B-4E99
|
Offers low temperature cure which is ideal for heat sensitive substrates
|
|
Bondmaster® -- B-531
|
Rapid room temperature cure, fixture parts in 15 to 30 seconds
|
|
Bondmaster® -- B-E01
|
Environmentally friendly-100 % solids, low shrinkage, nonflammable
|
|
Bondmaster® -- B-E04
|
Full cure at room temperature, easy to use and apply, low shrinkage
|
