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Gel Elastomers Specifications

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Material Type / Grade




   Material Type / Grade       
   Your choices are...
 
      
 
   Thermoplastic / TPE
 
     Thermoplastics can be repeatably softened by heat and then hardened, or set by cooling, which allows parts to be injection molded or thermoformed and scrap to be reprocessed.
 
   Thermoset (Crosslinked / Vulcanized)
 
     Thermoset plastics and thermoset resins are crosslinked polymeric resins cured using heat or heat and pressure. Cured thermoset resins generally have higher resistance to heat compared to thermoplastics, but melting cannot reprocess them.
 
   Semi-finished / Shape
 
     Semi-finished or shaped stock forms of plastics or elastomers include bar, sheet, film, profiles, or other shapes suited for part fabrication by machining, forming, welding, mechanical assembly or other processes.
 
   Film / Sheet
 
     Material supplied or available in the form of sheet or film. Sheet has thickness between 0.006" and 0.250" and is 24 inches (609.6 mm) or over in width. Sheet is typically formed to precise thicknesses and/or width requirements.
 
   Fabricated Shape / Part (Molded, Cast)
 
     Polymers or elastomers fabricated into finished shapes or parts using molding, casting, extrusion, pultrusion, machining, thermal forming, plastic welding, blow molding, rapid prototyping techniques, grinding and/or other specialized processes. The exact dimensions and tolerances of the finished molded or cast parts are typically made-to-print based on the OEMs requirements and the supplier's in-house capabilities.
 
   Resin / Compound Raw Material (Pellets, Liquid)
 
     Polymer material is a resin or compounded raw or unfinished material such as pellets, liquids, bulk molding compounds, or other forms.
 
   Monomer / Intermediate
 
     Resin component, monomer, intermediate, oligomer, pre-polymer or other building blocks and raw materials for plastic or elastomer polymer production.
 
   Binder / Base Polymer
 
     Base polymers or binders, binding agents and film formers are starting components mixed with other fillers and additives by compounders to produce plastic resins, elastomers, adhesives, sealants, coatings, paints or other polymer based products.

Binders are also adhesives used to hold together particulates such as polyvinyl alcohol, waxes, phenolics or other compounds.  They are used in fabricating powder metal compacts, ceramic binders, fuel pellets, brake pads, particle board, and pharmaceuticals pills or preparations.
 
   Optical Grade / Material
 
     Polymers or elastomers designed for optical or photonics applications such as transparent polycarbonate or acrylic lens materials.
 
   Composite Material
 
     Material filled with a strengthening phase, reinforcement fibers, toughening phase or other specialty fillers that provide unique properties.
 
   Specialty / Other
 
     Other unlisted, specialized and proprietary polymers, resins, monomers or intermediates. These materials are based on a unique chemical or polymer systems, novel curing technologies or have properties tailored for specific applications.
 
   Search Logic:      All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches.
   Silicone?
 
     Plastic compounds, elastomer resins or polymers are based on the silicone chemical system. Silicones are produced through the hydrolysis and polymerization of silanes and siloxanes.
 
   Search Logic:      "Required" and "Must Not Have" criteria limit returned matches as specified. Products with optional attributes will be returned for either choice.
Features & Industry




   Features       
   Your choices are...
 
      
 
   Anti-static / ESD Control
 
     Material designed with relatively high electrically conductivity or low electrical resistivity for electronic, anti-static or electrostatic discharge (ESD) applications.
 
   Electrical / Electronic Material
 
     Polymers, elastomers or resins specialized for electronics applications such as thermal interface materials, electrical insulation, potting or encapsulating compounds, conductive adhesives and dielectric sealants.
 
   Electrically Conductive Compound
 
     Resins or compounds with a high degree of electrical conductivity (low resistivity) for applications such as anti-static or ESD control, EMI / RFI shielding, thick film metallization and device and board electrical interconnection.
 
   Electrical Insulation / Dielectric Material
 
     Dielectric compounds and electrical insulation materials are used to form a barrier or isolator between electrical or electronic components. The voltage potential between the conductor and conductive components will influence material selection based on the dielectric strength in order to reduce shorting.  Dielectric constant and loss tangent are important parameters in minimizing crosstalk between insulated circuit paths.
 
   EMI / RFI Shielding Material
 
     Polymers or elastomers designed to provide shielding from electromagnetic interference (EMI) or radio frequency interference (RFI). Typically, these compounds have a high degree of electrical conductivity.
 
   Filled / Reinforced
 
     Filled or reinforced compounds consist of resins with additional modifiers such as fillers, pigments, or chopped fiber reinforcements.  Filled compounds are typically ready to use.
 
   Flame Retardant / UL 94V-0 Rated
 
     Products are flame retardant in accordance to Underwriters Laboratories, Inc. (UL) Flame Class 94V-0 or other equivalent ISO standards. These materials reduce the spread of flame or resist ignition when exposed to high temperatures. They also insulate the substrate and delay damage to the substrate.
 
   Flexible / Dampening
 
     Products are designed to provide flexibility or dampening of sound, vibration or shock in suitable applications. Flexible adhesives or sealants form a layer that can bend or flex without cracking or delaminating.
 
   Non-corrosive Cure
 
     Silicone or reactive systems use a non-corrosive cure system such as a metal or oxime catalyst.
 
   Phase Change
 
     Thermal interface materials use a phase change to enhance thermal characteristics or heat absorption from electronic devices or electrical components.
 
   Solvent Based (Volatile Organic)
 
     Solvent-based adhesive resins use a volatile organic solvent (VOC) to thin or alter viscosity. Typically, solvent-based adhesive resins result in greater environmental or regulatory control problems. Solvents can also present a fire hazard or risk explosion, depending on the plant or job site.
 
   Thermal Compound / Interface (Thermally Conductive)
 
     Material designed to form a thermally conductive layer on the substrate, between components or within a finished electronic product.  Thermally conductive resins, thermoplastics, encapsulants, potting compounds, tapes, pads, adhesives and greases are often used between a heat-generating electrical device and a heat sink to improve heat dissipation.
 
   Thermal Insulation / Heat Insulating
 
     Thermally insulating resins, plastics, compounds and encapsulants provide a thermal barrier between components and a hot or cold source.
 
   Unfilled
 
     Raw materials or unfilled resins do not contain any additional modifiers such as fillers, colorants, dispersants, plasticizers, wetting agents, levelers or defoamers. Theses products are used as starting components or raw materials for the production of finished plastic resins, elastomers, adhesives, sealant, coatings or other polymer-based products.
 
   UL Approved
 
     Products are approved to or recognized under the requirements of Underwriters Laboratories, Inc. (UL).
 
   Water Based / Latex Dispersion
 
     Water-based or water borne adhesive resins are water soluble or water emulsion-based resin systems that typically do not contain any VOC solvents. Water-based adhesive resins usually present fewer environmental or regulatory control problems.
 
   Search Logic:      All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches.
   Industry:       
   Your choices are...
 
      
 
   Aerospace
 
     Products are designed for aerospace applications. For example, they can be used to bond composite structures to other composite or metallic frame components.
 
   Automotive
 
     Products are designed for automotive applications. For example, they can be used to bond panels and seal windows.
 
   Electronics
 
     Products are designed for electronics applications. For example, they can be used in potting or encapsulating compounds, conductive adhesives, and dielectric sealants.
 
   Electrical Power / HV
 
     Products are resins, compounds and plastic composites suitable for electrical power or high voltage applications such as generator or motor assemblies, coil or transformer manufacturing, and switch or circuit breaker insulation.
 
   Optoelectronics / Photonics
 
     Products are designed for optoelectronics or photonics applications such as cements for bonding simple lenses into compound structures.
 
   Semiconductors / IC Packaging
 
     Products are designed or suitable for semiconductor or semiconductor packaging applications.
 
   Marine
 
     Products are designed for marine applications. They can be immersed in water and withstand exposure to marine atmospheres.
 
   Medical / Food (Sanitary / FDA)
 
     Products are suitable for medical or food-contact applications. They typically comply with requirements from regulatory agencies such as the Food and Drug Administration (FDA), U.S. Department of Agriculture (USDA), National Science Foundation (NSF), 3A-Dairy, Canada AG, or USP Class VI.
 
   Military / Government (MIL-SPEC / GG)
 
     Products adhere to U.S. military specifications (MIL-SPEC).
 
   OEM / Industrial
 
     Products are designed for use by original equipment manufacturers (OEMs) for the assembly, sealing or fabrication of products.
 
   Repair (MRO) / Construction
 
     Products are designed for use by construction contractors and in maintenance, repair and operation (MRO) applications. Adhesives or sealants can be designed for general-purpose construction or architectural applications. Construction materials include wood, wood products, glass, cement products (mortar, concrete, masonry), plaster board, metal trim, flooring tile, sub-floor or underlayment, plaster board, sheet metal roofing or flash, metal ties, insulation materials (fiberglass, foam) and bitumen-based roofing materials. 
 
   Tooling / Mold Material
 
     Products are designed for tooling or mold fabrication such as polyurethane shapes or castable silicones.
 
   Other
 
     Other unlisted industry.
 
   Search Logic:      All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches.
Thermal Properties




   Use Temperature
 
     Use temperature is the range of temperatures to which products can be exposed without the degradation of structural or other required end-use properties.
 
   Search Logic:      User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria.
   Deflection Temperature (@ 264 psi, 1.8 MPa)
 
     The temperature range that the material can be exposed to without the degradation of structural or other required end-use properties at 264 psi or 1.8 MPa.
.
 
   Search Logic:      User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria.
   Thermal Conductivity
 
     Thermal conductivity is the linear heat transfer per unit area through a material for a given applied temperature gradient. Heat flux (h) = [thermal conductivity (k) ] x [temperature gradient (Delta T)]
 
   Search Logic:      User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria.
   Coeff. of Thermal Expansion (CTE)
 
     Coefficient of linear expansion (CFE) is the amount of linear expansion or shrinkage that occurs in a material with a change in temperature.
 
   Search Logic:      User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria.
Mechanical Properties




   Tensile Strength (Break)
 
     Tensile strength at break is the maximum amount of stress required to fail or break the material under tension loading test conditions. Tensile tests are typically performed according to test procedure standards such as ASTM D-638 or ISO 527-1, ASTM D-1708, ASTM D-2289 (plastics at high strain rates), and ASTM D-882 (thin plastic sheets) as well as other OEM proprietary standards. 
 
   Search Logic:      User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria.
   Tensile Modulus
 
     Young's modulus or the modulus of elasticity is a material constant that indicates the variation is strain produced under an applied tensile load. Materials with a higher modulus of elasticity have higher stiffness or rigidity.
 
   Search Logic:      User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria.
   Elongation
 
     Elongation is the percent amount of deformation occurring during a tensile test or other mechanical test.
 
   Search Logic:      User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria.
Electrical Properties




   Electrical Resistivity
 
     Resistivity is the longitudinal electrical resistance (ohm-cm) of a uniform rod of unit length and unit cross-sectional area. Resistivity is the inverse of conductivity. 
 
   Search Logic:      User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria.
   Dielectric Strength
 
     Dielectric strength is the maximum voltage field that the material can withstand before electrical breakdown occurs.
 
   Search Logic:      User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria.
   Dielectric Constant (Relative Permittivity)
 
     The dielectric constant is the relative permittivity of a material compared to a vacuum or free space.  k = epsilonr epsilon / epsilono= where epsilon is the absolute permittivity of the material and epsilono is the absolute permittivity of a vacuum 8.85 x 10-12 F/m. 
 
   Search Logic:      User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria.
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