Thermal Compounds and Thermal Interface Materials Specifications

Industry Applications & Features


	Industry
	Your choices are...
	Electronics		Products are designed for electronics applications. For example, they can be used in potting or encapsulating compounds, conductive adhesives, and dielectric sealants.
	Electrical Power / HV		Products are resins, compounds and plastic composites suitable for electrical power or high voltage applications such as generator or motor assemblies, coil or transformer manufacturing, and switch or circuit breaker insulation.
	Optoelectronics / Photonics		Products are designed for optoelectronics or photonics applications such as cements for bonding simple lenses into compound structures.
	Semiconductors / IC Packaging		Products are designed or suitable for semiconductor or semiconductor packaging applications.
	Aerospace		Products are designed for aerospace applications. For example, they can be used to bond composite structures to other composite or metallic frame components.
	Automotive		Products are designed for automotive applications. For example, they can be used to bond panels and seal windows.
	Military / Government (MIL-SPEC / GG)		Products adhere to U.S. military specifications (MIL-SPEC).
	OEM / Industrial		Products are designed for use by original equipment manufacturers (OEMs) for the assembly, sealing or fabrication of products.
	Optical Grade / Material		Polymers or elastomers designed for optical or photonics applications such as transparent polycarbonate or acrylic lens materials.
	Other		Other unlisted industry.
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	Features
	Your choices are...
	Electrically Conductive		Resins or compounds with a high degree of electrical conductivity (low resistivity) for applications such as anti-static or ESD control, EMI / RFI shielding, thick film metallization and device and board electrical interconnection.
	Electrical Insulation / Dielectric		Dielectric compounds and electrical insulation materials are used to form a barrier or isolator between electrical or electronic components. The voltage potential between the conductor and conductive components will influence material selection based on the dielectric strength in order to reduce shorting. Dielectric constant and loss tangent are important parameters in minimizing crosstalk between insulated circuit paths.
	EMI / RFI Shielding Material		Polymers or elastomers designed to provide shielding from electromagnetic interference (EMI) or radio frequency interference (RFI). Typically, these compounds have a high degree of electrical conductivity.
	ESD Control / Anti-static		Material designed with relatively high electrically conductivity or low electrical resistivity for electronic, anti-static or electrostatic discharge (ESD) applications.
	Flame Retardant / UL 94V-0 Rated		Products are flame retardant in accordance to Underwriters Laboratories, Inc. (UL) Flame Class 94V-0 or other equivalent ISO standards. These materials reduce the spread of flame or resist ignition when exposed to high temperatures. They also insulate the substrate and delay damage to the substrate.
	Flexible / Dampening		Products are designed to provide flexibility or dampening of sound, vibration or shock in suitable applications. Flexible adhesives or sealants form a layer that can bend or flex without cracking or delaminating.
	Non-corrosive Cure		Silicone or reactive systems use a non-corrosive cure system such as a metal or oxime catalyst.
	Phase Change		Thermal interface materials use a phase change to enhance thermal characteristics or heat absorption from electronic devices or electrical components.
	Solvent Based (Volatile Organic)		Solvent-based adhesive resins use a volatile organic solvent (VOC) to thin or alter viscosity. Typically, solvent-based adhesive resins result in greater environmental or regulatory control problems. Solvents can also present a fire hazard or risk explosion, depending on the plant or job site.
	UL Approved		Products are approved to or recognized under the requirements of Underwriters Laboratories, Inc. (UL).
	Water Based / Latex Dispersion		Water-based or water borne adhesive resins are water soluble or water emulsion-based resin systems that typically do not contain any VOC solvents. Water-based adhesive resins usually present fewer environmental or regulatory control problems.
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Material System


	Chemical / Polymer System Type
	Your choices are...
	Acrylic / Polyacrylate		Acrylic polymers are formed by polymerizing acrylic acids through a reaction with a suitable catalyst. Acrylics are known for excellent environmental resistance and fast-setting times compared to other resin systems.
	Bismaleimide (BMI)		Material based on thermoset bismaleimide (BMI) resin. Aromatic polyimides are among the most thermally stable organic materials known. BMI thermoset resins have high temperature resistance. Bismaleimide (BMI) resins have processing characteristics similar to epoxy resins and are used as laminating resins, prepregs, adhesives and other composite applications.
	Cellulosic / Cellulose		Polymers are based on a cellulosic or cellulose chemical system. Cellulosic thermoplastics are often used to form plastic films for packaging applications.
	Epoxy (EP)		Epoxy resins exhibit high strength and low shrinkage during curing. Epoxies are known for their toughness and resistance to chemical and environmental damage. Most epoxies are two-part resins cured at room temperature. Some thermally cured or thermoset one-part epoxies are also available. Depending on the formulation, epoxy resins are used as casting resins, potting agents, resin binders or laminating resins in fiberglass or composite construction. They are also used as encapsulants, electrical conductors in microelectronic packaging, and adhesives in structural bonding applications.
	Fluoropolymer (PTFE / PVDF)		Polymers are based on fluoropolymer chemical systems such as polytetrafluoroethylene (PTFE) or polyvinylidene fluoride (PVDF). Fluoropolymers are used in applications requiring superior chemical resistance. PTFE is used in applications requiring superior chemical resistance or low friction.
	Isoprene / Polyisoprene		Natural rubber is based on the polyisoprene or isoprene chemical system. Synthetic or man-made versions of isoprene are also available.
	Liquid Crystal Polymer (LCP)		Liquid crystal polymers (LCP) are thermoplastics with high strength and temperature resistance. Liquid crystal polymers are used in electrical, electronic and medical applications where the high cost of the material is not an issue.
	Phenolics / Formaldehyde Resins (Melamine, Furan, etc.)		Phenolic and formaldehyde resins are thermosetting molding compounds and adhesives that offer strong bonds and good resistance to high temperatures. Phenolic or phenol formaldehyde, urea formaldehyde, furan and melamine resins fit into this category. Phenolic resin adhesives made from chemicals of the phenol group and formaldehyde are generally are the most durable. Phenolic resins are available in liquid, powder, and film form. Special phenolic resins are available that harden at moderate temperatures when mixed with suitable accelerators. Phenol-formaldehyde, resorcinol-formaldehyde, resol and novalac resins are types of phenolic resins. Urea resin adhesives are made from urea, formaldehyde and catalysts or hardeners. Urea formaldehyde resins can harden rapidly at moderate temperatures, but generally do not have the properties of phenolic resins. Melamine resins are made through a reaction of dicyandiamide with formaldehyde. Most of the resins in this group have excellent dielectric properties. Furan formaldehyde (FF) resins are made by the polymerization or poly-condensation of furfural, furfural alcohol, or other compounds containing a furan ring, or by the reaction of these furan compounds with other compounds (not over 50%). Fire-retardant furans are used in hand lay-up, spray-up and filament winding operations. Furans are commonly used in foundry binders, grinding wheels, refractories and other high temperature applications. Furan resins and chemicals are also used in fiberglass composites, hybrid resins combined with epoxy or phenolics, and in corrosion-resistant cements.
	Polyamide		Polyamide is a commonly used system for molding high-strength engineered components. Polyamides are also used to produce strong hot-melt adhesives. Polyamides provide higher strength than polyethylenes or other commodity-type polymers. Nylon is a well-known example of a polyamide engineering resin that is also used to mold plastic parts.
	Polyamide-imide (PAI)		Polyamide-imides are amorphous thermoplastic materials with excellent mechanical properties, especially at elevated temperatures. Trimellitic anhydrides react with aromatic diamines to produce polyamide-imides. Polyamide-imides are applied in demanding engineering applications. Solvay Advanced Polymer's Torlon® is a well-known example of a polyamide-imide engineering resin that is also used to mold, extrude or machine plastic parts, or shape stock.
	Polybutadiene		Polybutadiene is a commonly used polymer system with dielectric potting compounds and coatings. It can be combined with other rubber polymers to form flexible sealants. Polybutadiene remains flexible even at low temperatures.
	Polycarbonate (PC)		Polycarbonate is an amorphous material with excellent impact strength, clarity, and optical properties. Polycarbonate has excellent mechanical properties, and can be molded to tight tolerances. Polycarbonates can be attacked by solvents and petrochemicals. Brand names include Caliber® (Dow) and Lexan® (GE) as well as Makrofol® and Makrolon® (Bayer).
	Polyethylene (PE)		Polymers or resins are based on the polyethylene chemical system. Low density polyethylene polymers are used to form a variety of common or commodity-plastic components. High density (HDPE) and ultra-high molecular weight polyethylene (UHMW PE) have good friction and mechanical properties. They are used in medical devices, wear parts, and engineered components.
	PET / PBT (Thermoplastic Polyester)		The polyethylene terphthalate (PET) and polybutylene terphthalate (PBT) polymer systems are based on a thermoplastic polyester or terphthalate system.
	Polyester / Vinyl Ester		Thermosetting resins or plastics are based on the polyester (alkyd) or vinyl ester system. These materials should not be confused with thermoplastic polyesters or PET resins.
	Polyolefin		Polyolefin is broad term encompassing several specific linear polymer types.
	Polypropylene (PP)		Polypropylene (PP) is commonly used in hot-melt adhesive systems. PP is a polymer based on polypropylene chemical bonds.
	Polysulphide		Polymer resins or compounds are based on polysulphide or polyphenylene sulphide (PPS) chemical systems.
	Polyurethane (PU, PUR)		Polyurethane (PUR) resins provide excellent flexibility, impact resistance and durability. Polyurethanes are formed through the reaction of an isocyanate component with polyols or other active hydroxyl group compounds. Polyurethanes require a catalyst, heat, or air evaporation to initiate and complete curing.
	Silicone		Plastic compounds, elastomer resins or polymers are based on the silicone chemical system. Silicones are produced through the hydrolysis and polymerization of silanes and siloxanes.
	Styrene / Polystyrene		Polymers are based on a styrene or polystyrene chemical system.
	Vinyl (PVC / PVA / PVDC)		Polymers are based on the vinyl chemical system. Examples include polyvinyl chloride (PVC), polyvinylidene chloride (PVDF), polyvinyl vinyl acetate (PVA), and polyvinyl alcohol (PVOH).
	Specialty / Other		Other specialty, proprietary or unlisted resin, chemical system or compound or polymer type.
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	Rubber Based / Elastomeric?		Products use a rubbery or elastomeric bond system. Elastomers and rubber materials are characterized by their high degree of flexibility and elasticity (high reversible elongation). Natural rubber, synthetic rubber or elastomer sealants and adhesives can be based on a variety of systems such silicone, polyurethane, chloroprene, butyl, polybutadiene, isoprene or neoprene.
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	Filler Material:
	Your choices are...
	Unfilled		Raw materials or unfilled resins do not contain any additional modifiers such as fillers, colorants, dispersants, plasticizers, wetting agents, levelers or defoamers. Theses products are used as starting components or raw materials for the production of finished plastic resins, elastomers, adhesives, sealant, coatings or other polymer-based products.
	Filled / Reinforced		Filled or reinforced compounds consist of resins with additional modifiers such as fillers, pigments, or chopped fiber reinforcements. Filled compounds are typically ready to use.
	Aramid Fiber		Polyimide (polyphthalamide) fiber based reinforcements such as DuPont’s Kevlar® fiber material. Aromatic polyimides are among the most thermally stable organic materials known.
	Carbon / Graphite		Compounded polymers or elastomers that use carbon or graphite powder, or fiber filler. Depending on the structure, carbon can strengthen or provide some improvement in electrical and thermal conductivity.
	Fibers - Chopped		Polymer or elastomer products using chopped fiber reinforcement to provide improved strength and/or stiffness. Sheet molding compounds (SMC) are provided in the form of sheets, usually with a carrier or release liner. Bulk molding compound (BMC) is provided in larger, bulk shapes.
	Glass Filler		Compounded polymer or elastomer products using glass powder, fibers or cloth to provide improved strength and/or stiffness.
	Metal Filler		Compounds using metal powder or fiber filler.
	Mineral / Inorganic		Compounded polymers or elastomers that are filled with a mineral, ceramic, silicate or other inorganic powder or fiber.
	Other		Other unlisted, specialized, or proprietary filler type.
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Cure Type / Technology


	Cure Type / Technology
	Your choices are...
	Thermoplastic / Hot Melt		Thermoplastics can be repeatably softened by heat and then hardened, or set by cooling, which allows parts to be injection molded or thermoformed and scrap to be reprocessed. Thermoplastic or hot melt adhesives can be repeatably softened by heat and then hardened, or set by cooling, which allows parts to be removed or repositioned during assembly. Hot melt adhesives are typically solvent-free thermoplastics that melt or drop in viscosity above 180°F, and then rapidly set upon cooling. They are used in a variety of manufacturing processes, including bookbinding, woodworking, construction, product assembly, and box and carton heat sealing. Hot melt adhesive technology stemmed from the previous use of molten wax for bonding. Thermoplastic systems were introduced to satisfy performance needs. Typically, a pure hot melt system will not have the heat resistance of two-part, catalyst or thermoset adhesives. Hybrid hot melt systems are available that have exhibit a degree of reactive curing. Polyethylenes, polyamides and ethylene-vinyl acetates are common types of hot melt adhesives. Heat activated adhesives become sticky or tacky when warmed, and are used in contact or PSA type applications.
	Thermosetting (Crosslinking/ Vulcanizing)		Thermoset plastics and thermoset resins are crosslinked polymeric resins cured using heat or heat and pressure. Cured thermoset resins generally have higher resistance to heat when compared to thermoplastics, but they cannot be melted down and reprocessed. Thermoset adhesives are crosslinked polymeric resins cured using heat or heat and pressure. Cured thermoset resins do not melt and flow when heated, but they may soften. Phenolic, melamine and urea formaldehyde resins are thermosetting adhesives that offer strong bonds and good resistance to high temperatures. Vulcanization is a thermosetting reaction involving the use of heat and/or pressure in conjunction with a vulcanizing agent, resulting in greatly increased strength, stability and elasticity in rubber-like materials. RTV silicone rubbers are room temperature vulcanizing materials. The vulcanizing agent is a crosslinking compound or catalyst. Sulfur is the traditional vulcanizing agent used with natural rubber. Silicones use moisture, acetic acid and other compounds as curing agents.
	Room Temp. Cure / Vulcanizing		Polymer resin or compounds that either cure or vulcanize at room temperature. Vulcanization is a thermosetting reaction involving the use of heat and/or pressure in conjunction with a vulcanizing agent, resulting in greatly increased strength, stability and elasticity in rubber-like materials. The vulcanizing agent is a crosslinking compound or catalyst. Silicones use moisture, acetic acid and other compounds as curing or vulcanizing agents.
	UV / Radiation Cured (also EB, Light)		UV or radiation cured adhesives use ultraviolet light, visible light or electron bean irradiation to initiate curing, which allows a permanent bond without heating or excessive heat generation. One disadvantage of UV curing adhesives is the requirement that one substrate is UV transparent. Some UV resin systems employ a secondary curing mechanism to complete curing of adhesive regions shielded from the UV light. EB curable adhesives use electron beam radiation to cure or initiate curing. The electron beam can penetrate through material that is opaque to UV light.
	Single Component System		Single component adhesives or sealant systems consist of one resin that hardens by reaction with surface moisture, a surface applied activator-primer, or through the application of heat.
	Two Component System		Two or multi-component adhesive or sealant systems consist of two or more resins or a resin and a hardener, crosslinker, activator or catalyst that when combined react and cure into a polyermized compound or bond. Two component systems are mixed and then applied.
	Specialty / Other		Other unlisted, specialty, proprietary technology or cure type.
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Thermal Properties


	Use Temperature		Use temperature is the range of temperatures to which products can be exposed without the degradation of structural or other required end-use properties.
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	Deflection Temperature (@ 264 psi, 1.8 MPa)		The temperature range that the material can be exposed to without the degradation of structural or other required end-use properties at 264 psi or 1.8 MPa. .
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	Thermal Conductivity		Thermal conductivity is the linear heat transfer per unit area through a material for a given applied temperature gradient. Heat flux (h) = [thermal conductivity (k) ] x [temperature gradient ( T)]
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	Coeff. of Thermal Expansion (CTE)		Coefficient of linear expansion (CFE) is the amount of linear expansion or shrinkage that occurs in a material with a change in temperature.
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Mechanical Properties


	Tensile Strength (Break)		Tensile strength at break is the maximum amount of stress required to fail or break the material under tension loading test conditions. Tensile tests are typically performed according to test procedure standards such as ASTM D-638 or ISO 527-1, ASTM D-1708, ASTM D-2289 (plastics at high strain rates), and ASTM D-882 (thin plastic sheets) as well as other OEM proprietary standards.
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	Tensile Modulus		Young's modulus or the modulus of elasticity is a material constant that indicates the variation is strain produced under an applied tensile load. Materials with a higher modulus of elasticity have higher stiffness or rigidity.
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	Elongation		Elongation is the percent amount of deformation occurring during a tensile test or other mechanical test.
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Electrical & Optical Properties


	Electrical Resistivity		Resistivity is the longitudinal electrical resistance (ohm-cm) of a uniform rod of unit length and unit cross-sectional area. Resistivity is the inverse of conductivity.
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	Dielectric Strength		Dielectric strength is the maximum voltage field that the material can withstand before electrical breakdown occurs.
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	Dielectric Constant (Relative Permittivity)		The dielectric constant is the relative permittivity of a material compared to a vacuum or free space. k = _r= / _o= where is the absolute permittivity of the material and _ois the absolute permittivity of a vacuum 8.85 x 10^-12 F/m.
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	Index of Refraction		The index of refraction is a measure of the speed of light in a material.
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	Transmission		This is the amount of light transmitted through a material.
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Processing & Physical Properties


	Gap Fill		Gap fill is the spacing or gap between the substrate that the adhesive or sealant can accommodate.
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	Viscosity		Viscosity is a measurement of a fluid's resistance to flow. Water is lower in viscosity than motor oil or honey. Oil is lower in viscosity than tar or molasses. Depending on the application method, viscosity determines how well a resin fills the cavities or voids in a mold.
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	Melt Flow Index (MFI)		Melt flow index (MFI) is the output flow rate in grams that occurs in 10 minutes period through a standard die of 2.0955 mm diameter and 8.000 mm in length while a fixed pressure is applied to a 190°C melt via a piston. Blow molding and extrusion processes tend to use resins with lower MFI values. Injection molding typically utilizes higher MFI polymers.
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	Water Absorption		The amount of water absorbed by the material.
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