Molding compounds and resins are industrial plastics and polymers that are suitable for forming. They are available as pellets, liquids, and powders and are used in processes such as injection molding, compression molding, reaction injection molding (RIM), resin transfer molding (RTM), and blow molding. Examples of molding compounds and resins include thermoset resins, gel elastomers, encapsulants, potting compounds, composites, and optical grade materials. Electrically conductive molding compounds and resins provide low resistivity and are used to prevent electrostatic discharge (ESD), electromagnetic interference (EMI), and radio frequency interference (RFI). Dielectric compounds and insulation materials are also available. Thermally conductive products are applied between a heat-generating electrical device and a heat sink. Dampening products form layers that can bend or flex without cracking or delaminating. Film grade, extrusion grade, and flame retardant molding compounds and resins are also available. Molding compounds and resins use many different chemical systems and filler materials. Some chemical systems contain acetals, acrylics, elastomers, natural or synthetic rubbers, epoxy resins, silicone compounds, vinyl systems, polyamides, polyimides, ketones, or styrenes. Other chemical systems contain bismaleimide (BMI) resins, cellulosic or cellulose compounds, cyanoacrylates, ionomers, ethylene copolymers, fluoropolymers, or liquid crystal polymers (LCPs). Commonly used chemical systems also include polybutadiene, polycarbonate (PC), polyethylene (PE), polyester, polyether block amide (PEBA), polyetherimide, polyolefin, polypropylene (PP), polypropylene oxide (PPO), polysulphide, polyphthalamide (PPA), and polyurethane (PU, PUR). For filler materials, some molding compounds and resins contain aramid, chopped, or wound fiber; carbon or graphite powder; or self-lubricated materials. Other products contain glass fillers, metal fillers, or inorganic compounds. Unfilled products are also available. Typically, these raw materials are used as starting components for the production of finished adhesives and compounds.
Molding compounds and resins are industrial plastics and polymers that are suitable for forming. They are available as pellets, liquids, and powders and are used in processes such as injection molding, compression molding, reaction injection molding (RIM), resin transfer molding (RTM), and blow molding. Examples of molding compounds and resins include thermoset resins, gel elastomers, encapsulants, potting compounds, composites, and optical grade materials. Electrically conductive molding compounds and resins provide low resistivity and are used to prevent electrostatic discharge (ESD), electromagnetic interference (EMI), and radio frequency interference (RFI). Dielectric compounds and insulation materials are also available. Thermally conductive products are applied between a heat-generating electrical device and a heat sink. Dampening products form layers that can bend or flex without cracking or delaminating. Film grade, extrusion grade, and flame retardant molding compounds and resins are also available. Molding compounds and resins use many different chemical systems and filler materials. Some chemical systems contain acetals, acrylics, elastomers, natural or synthetic rubbers, epoxy resins, silicone compounds, vinyl systems, polyamides, polyimides, ketones, or styrenes. Other chemical systems contain bismaleimide (BMI) resins, cellulosic or cellulose compounds, cyanoacrylates, ionomers, ethylene copolymers, fluoropolymers, or liquid crystal polymers (LCPs). Commonly used chemical systems also include polybutadiene, polycarbonate (PC), polyethylene (PE), polyester, polyether block amide (PEBA), polyetherimide, polyolefin, polypropylene (PP), polypropylene oxide (PPO), polysulphide, polyphthalamide (PPA), and polyurethane (PU, PUR). For filler materials, some molding compounds and resins contain aramid, chopped, or wound fiber; carbon or graphite powder; or self-lubricated materials. Other products contain glass fillers, metal fillers, or inorganic compounds. Unfilled products are also available. Typically, these raw materials are used as starting components for the production of finished adhesives and compounds. There are several curing technologies for molding compounds and resins. Most thermoplastics, hot melt adhesives, and thermoset resins are cured using heat or heat and pressure. Vulcanization, a thermosetting reaction, uses heat and/or pressure in conjunction with a vulcanizing agent to produce materials with greatly increased strength, stability, and elasticity. Some products cure or vulcanize at room temperature. Others cure with radiation, electron beam irradiation, visible light, or ultraviolet (UV) light. Single component curing systems consist of a resin that hardens through the application of heat or a reaction with surface moisture. Two-component and multi-component curing systems consist of two or more resins and a hardener, crosslinker, activator or catalyst. Selecting molding compounds and resins requires an analysis of physical, mechanical, thermal, electrical, and optical properties. Physical properties include viscosity, melt flow index (MFI), and water absorption. MFI is the output flow occurring in a 10-minute period through a standard die while a fixed pressure is applied via a piston to a 190° C melt. Mechanical properties include tensile strength, tensile modulus, and elongation. Use temperature, deflection temperature, thermal conductivity, and the coefficient of thermal expansion (CTE) are important thermal properties. Resistivity, dielectric strength, and dielectric constant are important electrical properties. Optical properties for molding compounds and resins include index of refraction, a measure of the speed of light in a material, and transmission. Molding compounds and resins are used in many industries and applications. Some products are used in aerospace, automotive, laminating marine, military, photonics, optical, or tooling applications. Others are designed for use with electrical power products, high voltage applications, semiconductors, or integrated circuit (IC) packaging. Materials that are suitable for medical, pharmaceutical and food processing applications meet requirements established by the Food and Drug Administration (FDA) and the U.S. Department of Agriculture (USDA). Original equipment manufacturers (OEMs) and repair, maintenance and overhaul (MRO) organizations also use specialty adhesives, sealants and compounds.
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Products & Services Related to Molding Compounds and Resins
Conformal Coatings
Conformal coatings encapsulate circuit boards and their electronic components in order to prevent the ingress of moisture, fungus, dust and other environmental contaminants.
Epoxy Adhesives
Epoxy adhesives are chemical compounds for joining components. They require clean surfaces and are valued for their toughness and resistance to chemical and environmental damage.
Gel Elastomers
Gel elastomers are highly viscoelastic polymer gel materials that have excellent shock absorption and damping characteristics. They are available in a variety of material types and grades.
Thermoplastics and Thermoplastic Materials
Thermoplastics and thermoplastic materials soften when heated and harden when cooled. They can withstand many heating and cooling cycles and are often suitable for recycling.
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Part Numbers for Molding Compounds and Resins
| Part # |
Distributor |
Manufacturer |
Product Category |
Description |
| KT-820 SL30 |
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Solvay Advanced Polymers, LLC
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Molding Compounds and Resins
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This compound can be injection molded into complex shapes |
| Ultramid® 8272G HS BK-102 |
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BASF Corporation
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Molding Compounds and Resins
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A 12% fiberglass filled, black, thermally modified, PA6 molding compound |
| 4601 |
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Solvay Advanced Polymers, LLC
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Molding Compounds and Resins
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Especially designed to provide superior mold ejection characteristics |
| AFA-6133 V0 Z |
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Solvay Advanced Polymers, LLC
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Molding Compounds and Resins
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PPA Polyphthalamide (PPA) Resin, 33% Glass Reinforced, Dry As Molded |
| AT-6130 HS |
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Solvay Advanced Polymers, LLC
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Molding Compounds and Resins
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PPA Polyphthalamide (PPA) Resin, 30% Glass Reinforced, Dry As Molded |
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