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Thermal Compounds and Thermal Interface Materials

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About Thermal Compounds and Thermal Interface Materials

Thermal compounds and thermal interface materials form a thermally conductive layer on a substrate, either between components or within a finished product. Thermally conductive resins, tapes, adhesives, greases, and compounds are often used between a heat-generating electrical device and a heat sink to improve heat dissipation. Two-part or multi-component systems consist of resins or a resin and hardener, crosslinker, activator, or catalyst. Curing technologies use heat, heat and pressure, radiation, or ultraviolet (UV) light. Some UV systems employ a secondary curing mechanism to complete the curing of adhesive regions that are shielded from UV light. For example, electron beam (EB) technologies use radiation to penetrate materials that are opaque to UV light. Thermal compounds and thermal interface materials are used in a variety of industries, especially in the manufacture of electronic components and semiconductors.

There are a variety of thermal compounds and thermal interface materials. Potting compounds and casting resins are used to fill compartments or pockets that contain electronic components. Encapsulants seal or cover circuits; typically, encapsulant layers are less than 100 mils thick. Double-sided thermal interface tapes and pads, substrates, and shapes are often used as electrical insulators. Molding compounds are suitable for fabrication processes such as injection, compression, and blow molding; film extrusion; reaction injection molding (RIM); and resin transfer molding (RTM). Filled resins are composites that consist of a resin reinforced with fibers or particulates. Adhesives and die bonding compounds are thermal compounds and thermal interface materials that are used to join components. Typically, adhesives require a clean surface. Grease and oil compounds seal joints, openings, and fittings. Vacuum sealants have low vapor pressures to prevent outgassing. 

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Products & Services Related to Thermal Compounds and Thermal Interface Materials

Anaerobic Adhesives and Anaerobic Sealants
Anaerobic adhesives and anaerobic sealants cure in the absence of air or oxygen.
Casting Resins
Casting resins are pourable plastic or elastomer compounds used to cast parts, make molds or form a structure in place.
Cyanoacrylate Adhesives
Cyanoacrylate adhesives are one-part acrylate adhesives that cure instantly on contact with mated surfaces through a reaction with surface moisture. Cyanoacrylates are often called super glues. 
Electrical Resins and Electronic Compounds
Electrical resins and electronic compounds includes adhesives, greases, pads, stock shapes, tapes, encapsulants, potting compounds, thermal interface materials, and electrically conductive substances used in electrical, electronics, and semiconductor applications.
Hot Melt Adhesives
Hot melt adhesives are solvent-free chemical compounds that are used to join materials. They can be repeatedly softened by heat and hardened or set by cooling, allowing parts to be removed or repositioned during assembly.
Polymers and Plastic Materials
Polymers and plastic materials are organic, synthetic or processed polymers that are supplied as raw materials or stock shapes. They typically consist of thermoplastic or thermosetting resins and can be made into many forms.
Rubber Adhesives and Sealants
Rubber adhesives and sealants are highly flexible, natural or synthetic materials that are used to join components or fill gaps between seams or on surfaces.

Engineering Web: Thermal Compounds and Thermal Interface Materials

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