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About Encapsulants and Potting Compounds
Encapsulants and potting compounds are resins or adhesives that are used to encapsulate circuit boards and semiconductors, fill containers of electronic components, and infiltrate electrical coils. They provide environmental protection, electrical insulation and other specialized characteristics. Encapsulants and potting compounds belong to a broader category of electrical resins and electronic compounds that includes adhesives, greases, gels, pads, stock shapes, gaskets, tapes, and thermal interface materials. Most potting compounds are based on polymeric resins or adhesives; however, materials based on ceramic or inorganic cements are often used in high temperature applications. Some encapsulants and potting compounds are designed to form a thermally conductive layer between components or within a finished product. These thermally conductive products are used between a heat-generating electrical device and a heat sink to improve heat dissipation.
There are many types of encapsulants and potting compounds. Common potting compounds and casting resins are used to fill compartments or pockets that contain electronic components. Encapsulants seal or cover circuits; typically, encapsulant layers are less than 100 mils thick. Molding compounds are suitable for fabrication processes such as injection, compression, and blow molding; film extrusion; reaction injection molding (RIM); and resin transfer molding (RTM). Gap filling or underfill compounds are used to fill in gaps or spaces between two surfaces to be bonded or sealed. Glob top or daub-type compounds are used to insulate semiconductor dies or other electronic components on printed circuit boards (PCB) without encapsulating the entire assembly. Low viscosity resins or varnishes are used to impregnate coils or coat wires. Adhesives and die bonding encapsulants and potting compounds are thermal interface materials that are used to join components.
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Encapsulants and Potting Compounds and Services Directory: Products Directory > Chemicals Adhesives Materials > Industrial Adhesives Suppliers > Encapsulants and Potting Compounds |
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Potting Compounds Review - Engineers Edge Potting compounds may also be referred to as encapsulants. |
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UV-curable chemistry, adhesives, coatings, potting compounds in developing and manufacturing UV-curable formulations for applications including adhesives, coatings, potting compounds, sealants and encapsulants. See Tangent Industries, Inc. Information |
