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Encapsulants and potting compounds are resins or adhesives that are used to encapsulate circuit boards and semiconductors, fill containers of electronic components, and infiltrate electrical coils. They provide environmental protection, electrical insulation and other specialized characteristics. Encapsulants and potting compounds belong to a broader category of electrical resins and electronic compounds that includes adhesives, greases, gels, pads, stock shapes, gaskets, tapes, and thermal interface materials. Most potting compounds are based on polymeric resins or adhesives; however, materials based on ceramic or inorganic cements are often used in high temperature applications. Some encapsulants and potting compounds are designed to form a thermally conductive layer between components or within a finished product. These thermally conductive products are used between a heat-generating electrical device and a heat sink to improve heat dissipation.

There are many types of encapsulants and potting compounds. Common potting compounds and casting resins are used to fill compartments or pockets that contain electronic components. Encapsulants seal or cover circuits; typically, encapsulant layers are less than 100 mils thick. Molding compounds are suitable for fabrication processes such as injection, compression, and blow molding; film extrusion; reaction injection molding (RIM); and resin transfer molding (RTM). Gap filling or underfill compounds are used to fill in gaps or spaces between two surfaces to be bonded or sealed. Glob top or daub-type compounds are used to insulate semiconductor dies or other electronic components on printed circuit boards (PCB) without encapsulating the entire assembly. Low viscosity resins or varnishes are used to impregnate coils or coat wires. Adhesives and die bonding compounds are thermal interface materials that are used to join components.


Products & Services Related to Encapsulants and Potting Compounds
Anaerobic Adhesives and Anaerobic Sealants
Anaerobic adhesives and sealants cure in the absence of air or oxygen.
Electrical Resins and Electronic Compounds
Electrical resins and electronic compounds includes adhesives, greases, pads, stock shapes, tapes, encapsulants, potting compounds, thermal interface materials, and electrically conductive substances used in electrical, electronics, and semiconductor applications.
Hot Melt Adhesives
Hot melt adhesives are solvent-free chemical compounds that are used to join materials. They can be repeatedly softened by heat and hardened or set by cooling, allowing parts to be removed or repositioned during assembly.
Plastic and Rubber Balls
Plastic and rubber balls are sphere shapes that are used as check or ball valves, bearings, and in other applications.
Plastics and Plastic Materials
Plastics and plastic materials are organic, synthetic or processed polymers that are supplied as raw materials or stock shapes. They typically consist of thermoplastic or thermosetting resins and can be made into many forms.
Rubber Adhesives and Sealants
Rubber adhesives and rubber sealants are highly flexible, natural or synthetic materials that are used to join components or fill gaps between seams or on surfaces.
Thermal Compounds and Thermal Interface Materials
Thermal compounds and thermal interface materials form a thermally conductive layer on a substrate, between components or within a finished product.

Other Topics You Might Be Interested In
Low coefficient of thermal expansion (CTE) epoxies play an important role in the engineering and construction of electronic circuit boards as well as having great adhesive properties for other... (Read More)
Many electronic components and assemblies require a potting compound for protection against moisture, thermal shock, vibration and very low temperatures. Most of the potting & encapsulating compounds... (Read More)
Today’s electronic designs are smaller in size and deliver more power, which requires that they run at higher temperatures. In order to maintain long life and high reliability, they must be able to... (Read More)

Engineering Web: Encapsulants and Potting Compounds
Pages: 1 - 5 of 15620
Encapsulants and Potting Compounds
... encapsulants.htm. Potting Compounds Review Potting compounds are used in electrical and electronics applications to capture or encapsulate the associated device or assembly. Potting compounds maybe ...
See Engineers Edge Information
Potting compounds come in smaller volumes: News from ACC Silicones
News Release from: ACC Silicones | Subject: Silicone encapsulants and potting compounds Edited by the Electronicstalk Editorial Team on 10 November 2006. Potting compounds come. in smaller volumes. ...
High Performance Polymer Encapsulants and Potting Compounds from Noelle ...
A two component (A + B) high performance, mineral filled, room temperature curing, potting compound that features a moderate set up time and has electrical grade insulation properties, unusually high ...
PolySciences, Inc. Product: Microelectronic Encapsulants, Adhesives, Potting ...
... Encapsulants, Adhesives, Potting Compounds, Coatings and Dams. Polysciences, Inc. produces a unique array of microelectronic grade encapsulants, adhesives, coatings and potting compounds. These ultra ...
See Polysciences Inc. Information
Potting Compounds
Potting Compounds ...

Part Numbers for Encapsulants and Potting Compounds

Part # Distributor Manufacturer Product Category Description
20-2100   Epoxies Etc... Encapsulants and Potting Compounds Customizable, high performance two component flexible urethane system
20-3200   Epoxies Etc... Encapsulants and Potting Compounds Customizable, very low viscosity potting, casting, and encapsulating resin
20-2300   Epoxies Etc... Encapsulants and Potting Compounds Customizable, low viscosity two component urethane potting elastomer
20-3042   Epoxies Etc... Encapsulants and Potting Compounds Customizable, general purpose rigid epoxy encapsulant
UV cure 60-7107   Epoxies Etc... Encapsulants and Potting Compounds Filled UV curable encapsulant with a low CTE

More >>
See more product announcements for Encapsulants  and Potting Compounds
Custom Potting and Encapsulation Compounds

Custom Potting and Encapsulation Compounds
Master Bond, Inc.


2850FT Low CTE, Thermally Conductive Encapsulant

2850FT Low CTE, Thermally Conductive Encapsulant
Emerson & Cuming


UL 94 VO Flame Retardant Epoxies

UL 94 VO Flame Retardant Epoxies
Epoxies Etc...


11 See more product announcements for Encapsulants and Potting Compounds

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