X-ray instruments and X-ray systems use penetrating X-rays or gamma radiation to capture images of the internal structure of a part or finished product

X-ray diffraction instruments are used to measure crystal structure, grain size, texture and/or residual stress of materials and compounds through interaction of the X-ray beam with a sample

X-ray fluorescence spectrometers (XRFs) use a spectroscopic technique that is commonly used with solids, in which X-rays are used to excite a sample and generate secondary X-rays. 

Machine vision systems are used for automated inspection and measurement in production environments.

TLD (Thermoluminescent dosimeters) and film badges are used to detect radiation at levels that can be harmful to humans

Non-destructive testing (NDT) material testers are devices, machines and equipment that are used to determine residual stress, alloy type, hardness, microstructure, elasticity, heat treatment and other material conditions without permanently altering or destroying the material being examined.

Wafer and thin film instrumentation includes quartz crystal microbalance (QCM) monitors, ellipsometers, RHEED systems, imaging stations, CD-SEMs, ion mills, and C-V systems specifically designed for wafer metrology or in-situ monitoring of thin film parameters during thin film or semiconductors wafer processing

Imaging plates, films and chemicals include offset printer plates, photographic or image setter film, developers, fixers and other supplies for printing, graphics, radiographic and IR imaging

Metal sheet is metal or alloy stock supplied or available in the form of sheet or foil. Metal sheet has a thickness between 0.006" and 0.250", and is 24" (609.6 mm) or more in width.

Semiconductor metrology instruments are designed for wafer and thin film in-line inspection after semiconductor processing. They include capacitance gages, C-V systems, electron beam probes, ellipsometers, interferometers, I-V system, magnetometers, optical systems, profilometers, reflectometers, resistance probes, RHEED systems, and X-ray diffractometers.  

Densitometers measure the optical, photographic or area density of a material. They are used in a wide range of applications, from film processing to medical scans

Non-destructive testing (NDT) equipment is used to detect, inspect, and measure flaws, bond integrity, and other material conditions without permanently altering or destroying the examined part or product.

NDT supplies and accessories are components, ancillary equipment, standards, and consumable materials used in non-destructive testing (NDT).

Frame grabbers are image processing computer boards that capture and store image data for industrial applications such as quality control.

Thickness gages are used to make precise dimensional measurements on a wide variety of coatings and materials including steel, plastic, glass, rubber, ceramics, paint, electroplated layers, enamels, etc