The Proforma 300 TM wafer thickness gage can be used to measure thickness, bow and TTV on all wafer materials including: silicon,gallium-arsenide,indium phosphide and germanium without recalibrating or electrically grounding the wafer. (read more)

Proforma 300/G - Manual, non-contact measurement of wafer thickness, TTV and bow. Portable and easy to set-up, the Proforma 300/G measures all wafer materials including Silicon, Gallium-Arsenide, Indium-Phosphide and wafers mounted to sapphire or tape. (read more)

Today's technology companies continue to demand extremely thin silicon wafers and die for their complex applications. The Syagrus Systems team has over 12 years of silicon wafer thinning and wafer backgrinding experience. (read more)

The new CHRocodile IT from Precitec Optronik offers highly accurate distance and thickness measurements with a single probe for semiconductor wafers and multi-layered thin film. Non-contact scanning with just one measuring point can measure a wafer precisely to a thickness of 1 mm in all production environments. (read more)

With thickness and topographical measurement speeds up to 1000 measurements per second, CHR 150 E is the low cost, high performance solution to non-contact inspection problems. (read more)

Proforma 200SA - Semi-automated, full wafer surface scanning for thickness, TTV, bow, warp, site and global flatness. The Proforma 200SA can be used for all wafer materials and accommodates diameters 75 - 300 mm. (read more)

Proforma^TM AutoScan 200 - Fully automated wafer characterization system for measuring thickness, TTV, bow, warp, bulk resistivity, site and global flatness. The Proforma AutoScan 200 features pick and place robotics, laser cassette scanning, auto-sensing cassette stands for wafers 75 - 200 mm diameter, and a modular design for easy upgrades. (read more)

The Lapmaster line of Accupol Lapping & Polishing Wafer Thinning Jig Fixtures are designed to control precision thickness and parallelism of thin, fragile components made of semiconductor, compound semiconductor and electro-optics materials. (read more)

The Proforma 300SA is a semi-automated tool for measuring wafer bow, warp, flatness and stress. (read more)

PHASCOPE® PMP10: Measure Copper Coating Thickness better with Eddy Current User-friendly, reproducible, accurate measurement of copper thicknesses using the phase-sensitive eddy-current method. (read more)