Molding compounds and resins are industrial plastics and polymers that are suitable for forming. They are available as pellets, liquids, and powders and are used in processes such as injection molding, compression molding, reaction injection molding (RIM), resin transfer molding (RTM), and blow molding

Casting resins are pourable plastic or elastomer compounds used to cast parts, make molds or form a structure in place

Plastics and plastic materials are organic, synthetic or processed polymers that are supplied as raw materials or stock shapes. They typically consist of thermoplastic or thermosetting resins and can be made into many forms

Specialty polymers and resins are proprietary polymers, resins, monomers and intermediates. This category includes plastics and elastomers that are based on proprietary curing technologies or chemistries, or that are designed for specialized applications

Resins and compounds are pellets, liquid resins, bulk molding compounds, or other unfinished materials that are ready for shape fabrication or bond formation

Thermosets and thermoset materials are crosslinked polymeric resins that are cured or set using heat or heat and pressure. They generally have a higher resistance to heat than thermoplastics

Electrical resins and electronic compounds includes adhesives, greases, pads, stock shapes, tapes, encapsulants, potting compounds, thermal interface materials, and electrically conductive substances used in electrical, electronics, and semiconductor applications.

Laminating adhesives and composite resins are cured using heat and/or heat and pressure

Polymer concrete and mortar are binders, compounds, and aggregate mixtures that use epoxy, polyester, vinyl ester or other polymer resin bonds. They cure or set through chemical reactions, thermoset bonds, and multiple component binder systems

Fabricated plastic parts and semi-finished shapes include molded, cast, extruded and machined parts made from any polymeric materials.

Leveling resins, filling compounds and liquid shims are used to level surfaces, fill cavities, and shim or set machinery. They often have filling and sealing properties

Hot melt adhesives are solvent-free chemical compounds that are used to join materials. They can be repeatedly softened by heat and hardened or set by cooling, allowing parts to be removed or repositioned during assembly.

Encapsulants and potting compounds are resins or adhesives that are used to encapsulate circuit boards and semiconductors, fill containers of electronic components, and infiltrate electrical coils. They provide environmental protection, electrical insulation and other specialized characteristics

Conductive adhesives and compounds provide an electrically and/or thermally conductive path between components.

Thermal compounds and thermal interface materials form a thermally conductive layer on a substrate, between components or within a finished product.