Taking compact protectors to the next level, MCG's new PT 250 Series is the most advanced non-modular protector available anywhere. It's UL 1449, 2nd Ed. Listed, including requirements of Feb. 9, 2007, and shows the real UL logo, not the mark of a compliant lab. (read more)

Aremco offers a broad line of electrically and thermally conductive materials which provide solutions to a variety of electrical, electronic and thermal design problems throughout industry… (read more)

Epoxies etc...'s 50-2369 FR is the fastest self extinguishing Thermally Conductive Polyurethane Potting Compound available on the market today. Offering a unique combination of properties seldom seen in a Thermally Conductive Potting Compound, 50-2369 FR provides a quick heat dissipating system in a polyurethane chemistry, while also passing UL's 94 V-O self extinguishing test. (read more)

50-2366 FR is a new thermally conductive polyurethane potting compound. This flexible system is designed for low stress on sensitive components during and after cure. 50-2366 FR polyurethane resin system is formulated for applications requiring low exotherm, low shrinkage, and excellent electrical properties. (read more)

Thermally Activated Pressure Relief Devices (PRD) - Ideal for Composite Cylinders (read more)

34mm size tmov ( thermally protected mov) with TUV and PSE approvals,which can effectively avoid the firing or other troubles of MOV caused by failure of degradation and transient over voltage. (read more)

World Products Inc. TVZ series is a two or three-leaded Thermally Protected Metal Oxide Varistor available from authorized distributor TLC Electronics, Inc. (read more)

The Ferraz Shawmut Thermally Protected MOV has been developed to assist in minimizing the failure characteristics of Metal-Oxide-Varistors. The TPMOV is a completely fail-safe device. It is composed of a voltage clamping device and a disconnecting apparatus. (read more)

Master Bond has introduced a two component epoxy adhesive for high temperature heat transfer applications called EP21ANHT. It provides an exceptionally high thermal conductivity, for use in high temperature heat management applications where service temperatures reach up to 205°C. It also forms strong bonds, 1800 psi in shear, and offers good chemical resistance. (read more)

Light weight Master Bond adhesive EP30BN offers enhanced thermal management of heat generating components. The Boron Nitride Compound Provides excellent heat dissipation within aerospace and microelectronic assemblies. It features, a high thermal conductivity, low specific gravity, volume resistivity 10¹⁴ ohm cm and dielectric constant of 4.2 at 1 KHZ. (read more)