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Product Categories for underfill dielectric
Dielectric Ceramics and Substrates -
(128 companies)
Dielectric ceramics and substrates are electrical insulators with dielectric strength, dielectric constant and loss tangent values tailored for specific device applications
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Electrical Insulation and Dielectric Materials -
(183 companies)
Electrical insulation and dielectric materials surround and protect electrical conductors such as wires and cables. They also prevent unwanted current flow or leakage
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Electrical Resins and Electronic Compounds -
(323 companies)
Electrical resins and electronic compounds includes adhesives, greases, pads, stock shapes, tapes, encapsulants, potting compounds, thermal interface materials, and electrically conductive substances used in electrical, electronics, and semiconductor applications.
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Encapsulants and Potting Compounds -
(176 companies)
Encapsulants and potting compounds are resins or adhesives that are used to encapsulate circuit boards and semiconductors, fill containers of electronic components, and infiltrate electrical coils. They provide environmental protection, electrical insulation and other specialized characteristics.
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Thermal Compounds and Thermal Interface Materials -
(118 companies)
Thermal compounds and thermal interface materials form a thermally conductive layer on a substrate, between components or within a finished product.
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Thermal Insulation and Fireproofing Materials -
(512 companies)
Thermal insulation and fireproofing materials reduce the flow of heat through the thickness of the material. They are typically fiber-based or foam structures prepared from thermally-stable materials.
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Thermosets and Thermoset Materials -
(301 companies)
Thermosets and thermoset materials are crosslinked polymeric resins that are cured or set using heat or heat and pressure. They generally have a higher resistance to heat than thermoplastics.
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EMI and RFI Shielding -
(297 companies)
EMI and RFI shielding includes coatings, gaskets, enclosures, sealants, resins and other products or materials that block out electromagnetic interference (EMI) and radio frequency (RF) interference.
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Dielectric Greases and Insulating Fluids -
(55 companies)
Dielectric greases and insulating fluids are insulating oils, greases, transformer oils and fluids that have a high dielectric strength and are used in transformers, capacitors, EDM machining, and other electrical device applications
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Conformal Coatings -
(98 companies)
Conformal coatings encapsulate circuit boards and their electronic components in order to prevent the ingress of moisture, fungus, dust and other environmental contaminants.
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Thin Film Coating Services -
(170 companies)
Thin film coating services apply very thin layers of specialized materials to part surfaces. They perform processes such chemical vapor deposition (CVD), physical vapor deposition (PVD), ion implantation, electrochemical deposition (ECD), plasma etching, rapid thermal processing (RTP), and titanium nitride coating.
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Coating Services -
(1316 companies)
Coating services coat or plate the surfaces of manufactured components. Coating processes include ceramic, coil, dip, dry lubricant, phosphate, powder, rubber, thin film, titanium, and selective coating. Coating services also perform chemical finishing, galvanizing, hardfacing, painting, thermal spraying, and screen printing.
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Industrial Coatings -
(1518 companies)
Industrial coatings are thin films deposited upon materials to add or enhance desired properties, such as color, conductivity, corrosion resistance, etc.
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RF and Microwave Laminates -
(21 companies)
RF and microwave laminates are used as substrates for radio frequency (RF) and microwave communication systems and electronics. They are designed to meet the demanding performance standards for higher-frequency applications.
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Hipot Testers -
(100 companies)
Hipot testers are electrical safety test devices that perform a variety of electrical compliance tests.
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Product Announcements for underfill dielectric
Product Announcements: 1 - 10 of 510
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New England Wire Technologies Corporation
NEWcel® Foamed Dielectrics
Air is a near perfect dielectric medium allowing a signal to propagate through it at approximately the speed of light. However, an air dielectric is impractical for use as a cable insulation as it provides no structural integrity.
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Browse Coaxial Cables and Triaxial Cables Datasheets for New England Wire Technologies Corporation
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GFS Chemicals, Inc.
Battery Dielectric & Energy Storage Chemicals
GFS Chemicals has provided bulk quantities to battery manufacturers for years. We are involved in scale-up processes in novel/emerging battery materials & can readily support inquiries from experimental, gram size samples all the way up to metric ton quantities. We are involved in R&D associated with hydrogen storage for fuel cell applications and offer relevant materials.
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ARC Technologies, Inc.
Electrical Insulation and Dielectric Materials
ARC Technologies designs and manufactures a wide range dielectric microwave absorbers for commercial and military applications. These products act as light weight, broadband attenuators for high frequency electromagnetic energy. Typical frequency range is 650MHz to 40GHz. Far-field attenuation of -20dB or greater is possible over a wide frequency range.
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Optarius
Broadband Dielectric Mirrors - from OPTARIUS
Optarius offers a range of Broadband Dielectric Mirrors. These dielectric mirrors are excellent high reflectors for broadband use. They operate over a wide spectral range and provide more than 99% reflectance at 45 degrees angle of incidence.
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Browse Flat Mirrors Datasheets for Optarius
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Cascade Optical Corp.
Dielectric Mirrors
Standard high reflectors with R >99.95% over 0°±45° are available at any wavelength from 190nm to 12m.m. The Damage threshold is in the GW/cm2 range for 10nS pulses with 30Hz repetition rate, or in MW/cm2 CW range from 350 nm to 2.1 m m.
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CRYSTEX Composites LLC
Custom Dielectric Ceramics and Substrates....
CRYSTEX Composites LLC manufactures Mykroy/Mycalex glass bonded mica custom dielectric ceramics and substrates to match your specifications....
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Cascade Optical Corp.
Dielectric Broadband Mirrors
Typical performance: R > 99% @ 400-700 nm @ 0°±45°, or R > 99% @ 700-1000 nm @ 0°±45°, or R > 99% from 1100 to 1600 nm @ 0°±45°.
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High Voltage Power Solutions, Inc.
Dielectric Strength Tester
The HVPSI Dielectric Strength Tester provides a wide range of voltage (0 to 14 kVDC) for checking leakage currents in a myriad of applications
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Cellotape, Inc.
Electrical Insulation and Dielectric Materials
Cellotape manufactures custom electrical insulation and dielectric materials to match your specifications.
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Cascade Optical Corp.
Metal-Dielectric Mirrors
Cascade Optical Coating, Inc.'s protected and enhanced Aluminum, Silver, and Gold mirror coatings meet and exceed all requirements of MIL-M-13508 when deposited on glass, ceramics, crystals, Ni-plated Al and Be, diamond turned Aluminum, and some polymers and polycarbonates.
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Tools & Useful Links for underfill dielectric
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Engineering Web: underfill dielectric
1 - 10 of 952
Stratified underfill in an ic package invention
Low-k dielectric materials may have CTE values of about 8 ppm/C., the flip chip package with an underfill generates high stress on the low-k layers
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Underfill characterization for low-k dielectric / Cu...
Underfill characterization for low-k dielectric / Cu interconnect IC flip-chip package reliability
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Moisture Transport and its Effects on Fracture Strength and...
Moisture Transport and its Effects on Fracture Strength and Dielectric Constant of Underfill Materials
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IMAPS - Abstract Preview
Effect of Moisture on Dielectric Properties of CSP Board-Level Underfill Keywords: Underfill, Moisture Resistance, Dielectric Properties
See International Microelectrics and Packaging Society Information
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IMAPS - Abstract Preview
of WLCSP was investigated in relation to the 1st dielectric layer modulus, 1st dielectric layer thickness and chip thickness by using Omega-CSP. The
See International Microelectrics and Packaging Society Information
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Competing for the Future: A Historical Review of NIST ATP...
Wafer-Scale Applied Reworkable Fluxing Underfill for Direct Chip Attach Wafer-Scale Applied Reworkable Fluxing Underfill for Direct Chip Attach
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Amkor: Flip Chip Packaging Low K Devices FlipChip LowK
See Amkor Technology, Inc. Information
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Amkor: CSPnl Wafer Level Packaging WL-CSP WLCSP Wafer Level...
The technology used for CSPnl? results in robust packages that do not require underfill in their applications.
See Amkor Technology, Inc. Information
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MRS Website : Symposium N: Microelectronics and Microsystems...
AGING ON THE DIELECTRIC PROPERTIES OF EPOXY MOLDING COMPOUNDS. Patrice Gonon, Alain Sylvestre, Lab for Electrostatics and Dielectric Materials,
See Materials Research Society Information
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Intel Technology Journal
For example, reduced wettability of lead-free solder with die copper bumps can pose challenges to the downstream underfill process.
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