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Product Alerts
Keep current on the latest products, new suppliers, and technical articles of interest to you. (See Topics) |
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Engineering News
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Application Notes | Material Properties | Patents | Standards |
Protavic resins are used to protect, insulate and dissipate heat and to conceal circuitry, components and devices. These formulations were designed to satisfy the requirements of many demanding potting, encapsulating and casting applications in the electronic, electrical, automotive and aerospace industries. (read more)
Thermal compounds and thermal interface materials form a thermally conductive layer on a substrate, between components or within a finished product
Encapsulants and potting compounds are resins or adhesives that are used to encapsulate circuit boards and semiconductors, fill containers of electronic components, and infiltrate electrical coils. They provide environmental protection, electrical insulation and other specialized characteristics.
Search by Specification | Learn MoreElectrical resins and electronic compounds includes adhesives, greases, pads, stock shapes, tapes, encapsulants, potting compounds, thermal interface materials, and electrically conductive substances used in electrical, electronics, and semiconductor applications
Search by Specification | Learn MoreThermosets and thermoset materials are crosslinked polymeric resins that are cured or set using heat or heat and pressure. They generally have a higher resistance to heat than thermoplastics.
Search by Specification | Learn MoreEMI and RFI shielding includes coatings, gaskets, enclosures, sealants, resins and other products or materials that block out electromagnetic interference (EMI) and radio frequency (RF) interference.
Search by Specification | Learn MoreConductive adhesives and compounds provide an electrically and/or thermally conductive path between components
Search by Specification | Learn MoreThermal insulation and fireproofing materials reduce the flow of heat through the thickness of the material. They are typically fiber-based or foam structures prepared from thermally-stable materials
Search by Specification | Learn MoreTempering valves and thermally actuated valves contain a thermal sensing component that opens or closes in response to temperature changes
Learn MoreDisplay filters and films are designed to filter, enhanced and/or protect monitors or flat panel displays (FPD).
Search by Specification | Learn MoreLaminates and laminated materials are made by bonding together two or more layers of material into a finished product. Laminates and laminated materials vary from flexible foil film laminates to rigid circuit board materials.
Search by Specification | Learn MoreIndustrial adhesives are organic or inorganic chemical compounds for joining components. This category covers all adhesive types.
Search by Specification | Learn MoreEpoxy adhesives are chemical compounds for joining components. They require clean surfaces and are valued for their toughness and resistance to chemical and environmental damage.
Search by Specification | Learn MoreSpecialty fibers, fabrics and textiles are based upon a unique composition, weave, or technology, and are designed for specialized applications.
Search by Specification | Learn MoreSpecialty adhesives, sealants and compounds are specialized and/or proprietary products with unique chemistries, cure technologies and/or compositions.
Search by Specification | Learn MoreIndustrial tape is used for adhesive bonding, thread sealing, masking, packaging, wrapping, electrical insulation, ESD control and other specialized applications.
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Thermal Compounds and Thermal Interface Materials Thermal Solutions International, Inc.
Thermal Interface Materials Thermal Solutions International, Inc.
Thermal Products Protavic America, Inc.
Laminated Cushion Pad (RoHS) Uni-Home Industry Corporation
Light Weight Thermally Conductive EP30BN Master Bond, Inc.
PYROID® HT Pyrolytic Graphite - Thermal Spreaders MINTEQ® International Inc, Pyrogenics Group
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Epoxies etc...'s 50-2369 FR is the fastest self extinguishing Thermally Conductive Polyurethane Potting Compound available on the market today. Offering a unique combination of properties seldom seen in a Thermally Conductive Potting Compound, 50-2369 FR provides a quick heat dissipating system in a polyurethane chemistry, while also passing UL's 94 V-O self extinguishing test. (read more)
Aremco offers a broad line of electrically and thermally conductive materials which provide solutions to a variety of electrical, electronic and thermal design problems throughout industry… (read more)
Uni-Home's High Thermally Conductive Soft Pad is an ideal heat conductive material products for many electrical appliances. With its low hardness, it serves as excellent shock reduction material and filler. (read more)
50-2366 FR is a new thermally conductive polyurethane potting compound. This flexible system is designed for low stress on sensitive components during and after cure. 50-2366 FR polyurethane resin system is formulated for applications requiring low exotherm, low shrinkage, and excellent electrical properties. (read more)
Light weight Master Bond adhesive EP30BN offers enhanced thermal management of heat generating components. The Boron Nitride Compound Provides excellent heat dissipation within aerospace and microelectronic assemblies. It features, a high thermal conductivity, low specific gravity, volume resistivity 1014 ohm cm and dielectric constant of 4.2 at 1 KHZ. (read more)
RTVS 3-95-1 is a low viscosity, thermally conductive RTV silicone compound, which is UL recognized. (read more)
Master Bond has introduced a two component epoxy adhesive for high temperature heat transfer applications called EP21ANHT. It provides an exceptionally high thermal conductivity, for use in high temperature heat management applications where service temperatures reach up to 205°C. It also forms strong bonds, 1800 psi in shear, and offers good chemical resistance. (read more)
Aremco-Bond tm 805, a new high temperature, thermally conductive epoxy system developed by Aremco Products, Inc., is now for bonding and tooling applications to 300 oC (572 oF). (read more)
Pyro-Ducttm 597-C, a new silver-filled, high temperature, electrically and thermally conductive coating developed by Aremco Products, Inc., is now used to produce electronic and high vacuum components for applications to 1700 oF (927 oC). (read more)
Re-workable Underfill. This product offers 100% cross linking at 80-100c and can be removed between 280-300c. (read more)
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Underfill film having thermally conductive sheet Title: Underfill film having thermally conductive sheet Document Number: US7416923 Publication Type: uspatent Abstract: An underfill film for an |
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K.R. Anderson, Inc. - Thermally Conductive Browsing: Thermally Conductive Manufacturers See K.R. Anderson, Inc. Profile & Catalog |
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High thermally conductive and high reliability under-fill High thermally conductive and high reliability under-fill |
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Cost-effective epoxy is thermally conductive: News from Master... cost effective, rapid curing, thermally conductive, one part epoxy EP3RR-1, has been introduced by Master Bond of Hackensack, New Jersey, USA, for |
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Thermally Conductive Adhesives have color-coded chemistry.,... Thermally Conductive Adhesives have color-coded chemistry. Thermally Conductive Adhesives have color-coded chemistry. |
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Thermally Conductive Epoxy suits heat exchange applications.,... Thermally Conductive Epoxy suits heat exchange applications. Thermally Conductive Epoxy suits heat exchange applications. |
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Master Bond Thermally Conductive Selector Guide MASTER BOND THERMALLY CONDUCTIVE APPLICATION SELECTOR GUIDE See Master Bond, Inc. Profile & Catalog |
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Thermal characterization of thermally conductive underfill for... Thermal characterization of thermally conductive underfill for a flip-chip package using novel temperature sensing technique |
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News Releases LORD Corporation Develops Thermally-Conductive Flip Chip Underfill Technology |
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Wong R. Bollampally, C.P. Wong, "Comparative Study of Thermally Conductive Fillers for Use in Liquid Encapsulants for Electronic Packaging," IEEE |