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The Engineering Toolbar
The Ultimate Resource for Engineering and Technical Research. (Learn More) |
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Protavic's new generation of polymer termination products offer improved flexibility and cosmetics. The BCE-30375M offer the latest in NME & BME termination technology. (read more)
Encapsulants and potting compounds are resins or adhesives that are used to encapsulate circuit boards and semiconductors, fill containers of electronic components, and infiltrate electrical coils. They provide environmental protection, electrical insulation and other specialized characteristics.
Thermal compounds and thermal interface materials form a thermally conductive layer on a substrate, between components or within a finished product.
Search by Specification | Learn MoreConductive adhesives and compounds provide an electrically and/or thermally conductive path between components
Search by Specification | Learn MoreElectrical resins and electronic compounds includes adhesives, greases, pads, stock shapes, tapes, encapsulants, potting compounds, thermal interface materials, and electrically conductive substances used in electrical, electronics, and semiconductor applications
Search by Specification | Learn MoreElectrical insulation and dielectric materials surround and protect electrical conductors such as wires and cables. They also prevent unwanted current flow or leakage.
Learn MoreSuperconductors and superconducting materials conduct electricity without resistance
Learn MoreThermal insulation and fireproofing materials reduce the flow of heat through the thickness of the material. They are typically fiber-based or foam structures prepared from thermally-stable materials.
Search by Specification | Learn MoreSpecialty fibers, fabrics and textiles are based upon a unique composition, weave, or technology, and are designed for specialized applications.
Search by Specification | Learn MoreConformal coatings encapsulate circuit boards and their electronic components in order to prevent the ingress of moisture, fungus, dust and other environmental contaminants.
Search by Specification | Learn MoreRF and microwave laminates are used as substrates for radio frequency (RF) and microwave communication systems and electronics. They are designed to meet the demanding performance standards for higher-frequency applications.
Search by Specification | Learn MoreLaminates and laminated materials are made by bonding together two or more layers of material into a finished product. Laminates and laminated materials vary from flexible foil film laminates to rigid circuit board materials.
Search by Specification | Learn MoreDisplay filters and films are designed to filter, enhanced and/or protect monitors or flat panel displays (FPD).
Search by Specification | Learn MorePrinted circuit boards and materials have copper-clad surfaces for the fabrication of electronic and electrical circuitry on printed circuit boards (PCBs), printed wiring boards (PWB) and flexible circuits. Laminates and laminated materials are used to produce rigid boards. Tapes and films are used to produce flexible circuits and membrane switches.
Search by Specification | Learn MoreSafety gloves are protective garments worn that are worn over the hands for protection against dangerous or harmful environments.
Search by Specification | Learn MoreFoams and foam materials are industrial products made from low density elastomers, plastics, and other materials with various structures and porosities.
Search by Specification | Learn More|
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Adhesive and Encapsulant Protavic America, Inc.
Flame Retardant PNU 46201 Protavic America, Inc.
Potting Compound Epoxies Etc...
Clear Potting and Encapsulating Compound Epoxies Etc...
Encapsulants Ellsworth Adhesives
Thermally Conductive UL 94 V-O Potting Compound Epoxies Etc...
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Re-workable Underfill. This product offers 100% cross linking at 80-100c and can be removed between 280-300c. (read more)
Aremco offers a broad line of electrically and thermally conductive materials which provide solutions to a variety of electrical, electronic and thermal design problems throughout industry… (read more)
40‑3900 is a two component epoxy adhesive filled with pure silver. This electrically conductive epoxy resin formulation offers the maximum in continuity of conductivity with an electrical resistivity value of less than 1x10‑4 ohm‑cm. 40‑3900 is also well known for its' wide operating temperature range, ‑50 to + 170oC. (read more)
RFC-2869 Mod 2 is one-part, silver filled, electrically conductive epoxy adhesive. When cured, this adhesive will have very high thermal and electrical conductive properties. In addition, it bonds very well to many substrates. (read more)
Epoxies, Etc... has developed a single component electrically conductive epoxy adhesive. This versatile conductive adhesive exhibits excellent mechanical integrity and thermal stability with no chemical corrosion at elevated temperature exposure during wire bonding and soldering. (read more)
Pyro-Ducttm 597-C, a new silver-filled, high temperature, electrically and thermally conductive coating developed by Aremco Products, Inc., is now used to produce electronic and high vacuum components for applications to 1700 oF (927 oC). (read more)
The products listed on Protavic America's website are electrically conductive adhesives, paints, inks and coatings. Protavic has designed these material to provide the best-in-class performance for electrical conductivity and productivity. (read more)
maestro™ lets vision system engineers rapidly design, install, and start-up any machine vision solution while reducing time, materials, and costs using only two universal maestro™ modules for all installations. maestro™ is comprised of two modules. (read more)
Although Epoxies, Etc... offers a complete standard product line, we also custom formulate electrically conductive adhesives and resins for specific customer requirements. (read more)
Acrolab's Isoplatens can be designed for electric, oil and steam heating platens (the standard Isoplaten is electrically heated)and provide high levels of thermal stability to press platen applications. (read more)
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K.R. Anderson, Inc. - Electrically Conductive Browsing: Electrically Conductive Manufacturers See K.R. Anderson, Inc. Profile & Catalog |
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Flip-chip device having underfill in controlled gap invention Flip-chip device having underfill in controlled gap -> Monitor Keywords Flip-chip device having underfill in controlled gap |
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Flip chip package and method of conducting heat therefrom... Flip chip package and method of conducting heat therefrom -> Monitor Keywords Flip chip package and method of conducting heat therefrom |
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Flexible Epoxy Adhesive is electrically conductive., Tra-Con,... It creates electrically and thermally conducting bonds and coatings between materials such as metals, ceramics, glass, and plastic insulates. |
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(Cover Story) Semiconductor Packaging Technologies Advance DNA... its NanoChip system this year to scientists and genomics laboratories that are conducting research into single nucleotide polymorphism (SNP) scoring. |
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Electrically conductive adhesive - PatentStorm Class 438/119 - Electrically conductive adhesive See PatentStorm Information |
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IMAPS - International Microelectronics And Packaging Society The underfill ensures that balls do not crack or electrically create opens in the IC-pad to bump to substrate-pad connections when materials with See International Microelectrics and Packaging Society Information |
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MRS Website : Symposium Y a via through the silicon wafer, dielectric isolation of the via metal from the substrate, and filling or coating the via with a conducting material. See Materials Research Society Information |
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MRS Website : Symposium V See Materials Research Society Information |
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MULTI-PHYSICS INVESTIGATION ON THE FAILURE MECHANISM |