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Ul Recognized Encapsulant/Adhesive - Electronics Grade, Polyurethane, Room Temperature Repairable, Antistatic, Clear Adhesive/Encapsulant (read more)
Electrical resins and electronic compounds includes adhesives, greases, pads, stock shapes, tapes, encapsulants, potting compounds, thermal interface materials, and electrically conductive substances used in electrical, electronics, and semiconductor applications
Encapsulants and potting compounds are resins or adhesives that are used to encapsulate circuit boards and semiconductors, fill containers of electronic components, and infiltrate electrical coils. They provide environmental protection, electrical insulation and other specialized characteristics
Search by Specification | Learn MoreThermal compounds and thermal interface materials form a thermally conductive layer on a substrate, between components or within a finished product.
Search by Specification | Learn MoreThermal insulation and fireproofing materials reduce the flow of heat through the thickness of the material. They are typically fiber-based or foam structures prepared from thermally-stable materials.
Search by Specification | Learn MoreElectrical insulation and dielectric materials surround and protect electrical conductors such as wires and cables. They also prevent unwanted current flow or leakage.
Learn MoreDielectric ceramics and substrates are electrical insulators with dielectric strength, dielectric constant and loss tangent values tailored for specific device applications.
Search by Specification | Learn MoreEMI and RFI shielding includes coatings, gaskets, enclosures, sealants, resins and other products or materials that block out electromagnetic interference (EMI) and radio frequency (RF) interference.
Search by Specification | Learn MoreThermosets and thermoset materials are crosslinked polymeric resins that are cured or set using heat or heat and pressure. They generally have a higher resistance to heat than thermoplastics.
Search by Specification | Learn MoreIndustrial adhesives are organic or inorganic chemical compounds for joining components. This category covers all adhesive types
Search by Specification | Learn MoreAdhesive tapes and films temporarily or permanently join materials together
Search by Specification | Learn MorePolyurethane adhesives and sealants provide excellent flexibility, impact resistance, and durability. They are available in one-part or two-part adhesive systems
Search by Specification | Learn MoreSilicone adhesives and silicone sealants have a high degree of flexibility and very high temperature resistance
Search by Specification | Learn MoreAcrylic adhesives and acrylate adhesives provide excellent environmental resistance and fast-setting times when compared to other resins systems. They are created by p olymerizing acrylic or methylacrylic acids through a reaction with a suitable catalyst
Search by Specification | Learn MoreRubber adhesives and rubber sealants are highly flexible, natural or synthetic materials that are used to join components or fill gaps between seams or on surfaces
Search by Specification | Learn MoreSpecialty adhesives, sealants and compounds are specialized and/or proprietary products with unique chemistries, cure technologies and/or compositions
Search by Specification | Learn More|
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Electrical Resins and Electronic Compounds All Seals, Inc.
PROTAVIC® ACH 30200 Protavic America, Inc.
Potting Resins Protavic America, Inc.
One-Part Electrically Conductive Epoxy E.V. Roberts
Thermally Conductive Polyurethane Potting Compound Epoxies Etc...
Green Electronics: Understanding EPEAT SABIC Innovative Plastics
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Re-workable Underfill. This product offers 100% cross linking at 80-100c and can be removed between 280-300c. (read more)
MCL Industries 25 years of converting experience makes them your unique source for information on standard materials, custom co-extrusions and multi-layer laminations. (read more)
THE WOODLANDS, TX, June 13- 2007 -- Huntsman Advanced Materials today launched a new portfolio of structural adhesives optimized to provide industrial engineers with an expanded range of cost-effective materials for bringing complex thermoplastic, composite and metal-based designs to life.
Contact E.V. Roberts to place an order or request a quote for these materials. (read more)
DEACOM Integrated Accounting and ERP Software for Adhesive and Sealant Manufacturers (read more)
Adchem has been a pioneering supplier of fully coated and dry edge adhesive tapes systems to the medical industry for over 25 years. Their Medical Adhesives Unit offers extensive knowledge in adhesive applications combined with expertise in medical product development and manufacturing and understanding of GMP regulation requirements. (read more)
Permabond UV Light Curable Adhesives are single part, solvent-free, cure on demand adhesives suitable for a wide range of applications. Upon exposure to UV light of the proper intensity and spectral output, these products rapidly cure to form excellent bonds to a wide variety of substrates such as metals, glass and most plastics. (read more)
Do you have a need for pressure sensitive adhesive(PSA)? You're not alone! Adhesives are used with a range of materials and designs that meet the specifications of engineers working in diverse industries. So, how do you determine the best choice for your project? It's not an easy decision to make, but it may well be a critical component of your bottom-line success. (read more)
Valtech Corporation unveils a new line of heat release adhesive systems for temporary bonding applications. The AD4000 series of products were designed to allow temporary bonding in a requiring complete removal of the adhesive from the bonded materials.
Debonding require 90C (194F) heat and takes only 30-60 seconds and is complete leaving no adhesive residues on the bonded materials. (read more)
TAKELAC™ is a line of high performance laminates and adhesives available in solvent based and solvent free grades used for different types of retort packaging applications as well as for solar cell backing and PDP mesh filter. (read more)
High Strength Acrylic Adhesives are available on Silicone Foam and Closed Cell Silicone Foam for Gaskets and Pads that need to adhere to powder coated metal surfaces and certain low surface energy plastics. (read more)
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3M US: Underfill Adhesive - Electronic Bonding 3M? Underfill Adhesive 3M? Capillary Underfill UF-6800, a unique, two-part epoxy adhesive, is reworkable, which reduces See 3M Information |
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Electronics | Hysol® Underfills | CSP and... Electronics » Hysol® Underfills » CSP and DCA Underfill Encapsulants » Loctite® 3515 Underfill Encapsulant Adhesive See Henkel Corporation Profile & Catalog |
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Underfill Material is formulated for flip chip packaging.,... Underfill Material is formulated for flip chip packaging. Underfill Material is formulated for flip chip packaging. |
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Heat-Activated Adhesive offers unlimited working time., Devcon Heat-Activated Adhesive offers unlimited working time. Heat-Activated Adhesive offers unlimited working time. |
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Speedline Technologies - ACCEL, CAMALOT, MPM, and ELECTROVERT Select a Process to Search Adhesive Deposition Cleaning Dispensing Encapsulation Flip Chip Fuel Cells Lead-Free MEMS Reflow Soldering Software |
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GPD Global Fluid Dispensing Systems Home Page No Flow Underfill Potting (Solder Mask) Capillary Underfill Cavity Fill Encapsulation See GPD Global Information |
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Method and apparatus for forming an underfill adhesive layer US PATENT: Method and apparatus for forming an underfill adhesive layer |
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Method and apparatus for forming an underfill adhesive layer US PATENT: Method and apparatus for forming an underfill adhesive layer |
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Manufacturing Science and Technology: Technologies Adhesive Bonding PDF format (95 kb) Understanding and controlling the factors that See Sandia National Laboratories Information |
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SMTA - The Surface Mount Technology Association the results of verifying the bonding reliability of the new underfill adhesive by applying it to a package used for servers, namely, a Flip Chip Ball See Surface Mount Technology Association (SMTA) Information |