Encapsulants and potting compounds are resins or adhesives that are used to encapsulate circuit boards and semiconductors, fill containers of electronic components, and infiltrate electrical coils. They provide environmental protection, electrical insulation and other specialized characteristics.

Thermal compounds and thermal interface materials form a thermally conductive layer on a substrate, between components or within a finished product.

Electrical resins and electronic compounds includes adhesives, greases, pads, stock shapes, tapes, encapsulants, potting compounds, thermal interface materials, and electrically conductive substances used in electrical, electronics, and semiconductor applications.

Thermal insulation and fireproofing materials reduce the flow of heat through the thickness of the material. They are typically fiber-based or foam structures prepared from thermally-stable materials.

Electrical insulation and dielectric materials surround and protect electrical conductors such as wires and cables. They also prevent unwanted current flow or leakage.

Dielectric ceramics and substrates are electrical insulators with dielectric strength, dielectric constant and loss tangent values tailored for specific device applications.

EMI and RFI shielding includes coatings, gaskets, enclosures, sealants, resins and other products or materials that block out electromagnetic interference (EMI) and radio frequency (RF) interference.

Thermosets and thermoset materials are crosslinked polymeric resins that are cured or set using heat or heat and pressure. They generally have a higher resistance to heat than thermoplastics.