Semiconductor metrology instruments are designed for wafer and thin film in-line inspection after semiconductor processing. They include capacitance gages, C-V systems, electron beam probes, ellipsometers, interferometers, I-V system, magnetometers, optical systems, profilometers, reflectometers, resistance probes, RHEED systems, and X-ray diffractometers.  

Wafer and thin film instrumentation includes quartz crystal microbalance (QCM) monitors, ellipsometers, RHEED systems, imaging stations, CD-SEMs, ion mills, and C-V systems specifically designed for wafer metrology or in-situ monitoring of thin film parameters during thin film or semiconductors wafer processing

Temperature instruments use contact or noncontact methods to measure temperature. Products include dial, digital, industrial and laboratory thermometers; temperature probes, indicators, and sensors; RTD elements and transmitters; and thermistors, thermocouples, thermopiles, and thermal switches. 

Semiconductors (metalloids) or semiconductor materials are used to fabricate microelectronic and optoelectronic devices such as transistors, photodetectors or solar cells.

Finishing compounds are used to improve surface finish or flatness. They often consist of fine abrasives in slurry, bar, powder or paste forms.

Electroceramics are ceramic materials that have been specially formulated for specific electrical, electro-magnetic, or optical properties. They include dielectric ceramics, electrostrictive ceramics, ferrite ceramics, garnets (ferromagnets), and piezoelectric ceramics.

Abrasives and abrasive products are used to remove surface materials such as metal, ceramics, glass, plastics, and paint. Abrasives and abrasive products include discs, belts, blast machines and sandblasters, as well as sheets, rolls, and hand pads.

Thin film equipment uses vacuum processing for the modification of surfaces using CVD, PVD, plasma etching, and thermal oxidation or ion implantation.

Feedthroughs transmit electrical current, fluids, optical signals, or mechanical motion through the walls of a pressurized or vacuum system through a hermetic seal.

Superabrasives and diamond wheels consist of grinding wheels, abrasive saw blades, wheel dressers, single point tools and other products utilizing diamond or cubic boron nitride (CBN) abrasive grain.

Vacuum manipulators include components for moving or positioning wafers or items in vacuum chambers or systems such as mounting devices, load locks, wobble sticks or wafer robots

Sapphire materials and components consist of a single-crystal, ceramic form of aluminum oxide. They have superior hardness, mechanical and optical properties, and are used in jewel bearings, lasing rods, wear parts, wafer substrates and optics

Semiconductor cluster tools and equipment are used to process semiconductor wafers for the production of microelectronic components

Semiconductor foundry services suppliers design and manufacture semiconductor chips on a contract basis, in prototype to production quantities.

Cut-off wheels and abrasive saw blades are used to cut bars, stock, pipes and other materials that are made of metal, concrete, or masonry.