Vanpro manufactures wafer carriers that support automated semiconductor handling equipment. (read more)

Today's technology companies continue to demand extremely thin silicon wafers and die for their complex applications. The Syagrus Systems team has over 12 years of silicon wafer thinning and wafer backgrinding experience. (read more)

The Lapmaster line of Accupol Lapping & Polishing Wafer Thinning Jig Fixtures are designed to control precision thickness and parallelism of thin, fragile components made of semiconductor, compound semiconductor and electro-optics materials. (read more)

Mill-Max offers socket carriers for use with DC-DC converters. Rather than being soldered directly to the circuit board, DC-DC converters are often socketed to permit easy field replacement and repair. A socket carrier is a simple way to provide a low profile socket for a DC-DC converter. (read more)

Hermann, MO- Laser Light Technologies, Inc developed a range of approaches in laser micromachining photovoltaic panels and solar cells. These include isolation scribing, silicon wafer resizing, micromachining arrays of tapered and v-shaped grooves, laser drilling of via holes using fundamental and frequency multiplied YAG lasers and XY precision stages. (read more)

Insaco, Inc has become recognized as a worldwide leader in custom machined ceramic and sapphire parts for the semiconductor industry. Through this experience, Insaco is now able to offer multiple hole wafer carriers in sapphire for GaAs and other semiconductors. (read more)

Etched Foil Heaters for the Semiconductor & Wafers industries from Thermal Circuits. In the early 1980's, Thermal Circuits introduced HTB etched foil element heaters to the Semiconductor industry to heat acid in portable wafer processing baths. It replaced hot plates that only heated from the bottom. (read more)

Proforma^TM AutoScan 200 - Fully automated wafer characterization system for measuring thickness, TTV, bow, warp, bulk resistivity, site and global flatness. The Proforma AutoScan 200 features pick and place robotics, laser cassette scanning, auto-sensing cassette stands for wafers 75 - 200 mm diameter, and a modular design for easy upgrades. (read more)

Syagrus Systems' fully automated wafer dicing systems consistently meet the tight requirements expected in our industry and demanded by our customers. At Syagrus Systems they know that a good wafer dicing process sets the pace for all remaining operations. (read more)

Proforma 200SA - Semi-automated, full wafer surface scanning for thickness, TTV, bow, warp, site and global flatness. The Proforma 200SA can be used for all wafer materials and accommodates diameters 75 - 300 mm. (read more)