Light weight Master Bond adhesive EP30BN offers enhanced thermal management of heat generating components. The Boron Nitride Compound Provides excellent heat dissipation within aerospace and microelectronic assemblies. It features, a high thermal conductivity, low specific gravity, volume resistivity 10¹⁴ ohm cm and dielectric constant of 4.2 at 1 KHZ. (read more)

RTVS 3-95-1 is a low viscosity, thermally conductive RTV silicone compound, which is UL recognized. (read more)

Aremco offers a broad line of electrically and thermally conductive materials which provide solutions to a variety of electrical, electronic and thermal design problems throughout industry… (read more)

Epoxies etc...'s 50-2369 FR is the fastest self extinguishing Thermally Conductive Polyurethane Potting Compound available on the market today. Offering a unique combination of properties seldom seen in a Thermally Conductive Potting Compound, 50-2369 FR provides a quick heat dissipating system in a polyurethane chemistry, while also passing UL's 94 V-O self extinguishing test. (read more)

50-2366 FR is a new thermally conductive polyurethane potting compound. This flexible system is designed for low stress on sensitive components during and after cure. 50-2366 FR polyurethane resin system is formulated for applications requiring low exotherm, low shrinkage, and excellent electrical properties. (read more)

Emerson & Cuming's Ablefilm 506 is a flexible thermally conductive film adhesive designed for bonding materials with severely mismatches CTEs. Components joined with Ablefilm 506 adhesive film may be de-bonded easily by heating the component to 125°C and sliding a thin blade between the bonded surfaces. (read more)

Master Bond has introduced a two component epoxy adhesive for high temperature heat transfer applications called EP21ANHT. It provides an exceptionally high thermal conductivity, for use in high temperature heat management applications where service temperatures reach up to 205°C. It also forms strong bonds, 1800 psi in shear, and offers good chemical resistance. (read more)

Aremco-Bond ^tm 805, a new high temperature, thermally conductive epoxy system developed by Aremco Products, Inc., is now for bonding and tooling applications to 300 ^oC (572 ^oF). (read more)

VICTREX PEEK Polymer Offers a New Level of Cost Savings, Quality and Performance for the Food Processing Industry

Food and beverage processing equipment and machinery incorporating VICTREX® PEEK™ polymer, VICOTE® Coatings and APTIV™ films are rapidly gaining industry-wide acceptance due to an exceptional combination of physical and mechanical properties. (read more)

Light Fabrications supplies thermally conductive adhesives cut and engineered to your exact specifications. (read more)