Aremco-Bond ^tm 805, a new high temperature, thermally conductive epoxy system developed by Aremco Products, Inc., is now for bonding and tooling applications to 300 ^oC (572 ^oF). (read more)

Light weight Master Bond adhesive EP30BN offers enhanced thermal management of heat generating components. The Boron Nitride Compound Provides excellent heat dissipation within aerospace and microelectronic assemblies. It features, a high thermal conductivity, low specific gravity, volume resistivity 10¹⁴ ohm cm and dielectric constant of 4.2 at 1 KHZ. (read more)

Aremco offers a broad line of electrically and thermally conductive materials which provide solutions to a variety of electrical, electronic and thermal design problems throughout industry… (read more)

Epoxies etc...'s 50-2369 FR is the fastest self extinguishing Thermally Conductive Polyurethane Potting Compound available on the market today. Offering a unique combination of properties seldom seen in a Thermally Conductive Potting Compound, 50-2369 FR provides a quick heat dissipating system in a polyurethane chemistry, while also passing UL's 94 V-O self extinguishing test. (read more)

Epoxies, Etc... has developed a single component electrically conductive epoxy adhesive. This versatile conductive adhesive exhibits excellent mechanical integrity and thermal stability with no chemical corrosion at elevated temperature exposure during wire bonding and soldering. (read more)

40‑3900 is a two component epoxy adhesive filled with pure silver. This electrically conductive epoxy resin formulation offers the maximum in continuity of conductivity with an electrical resistivity value of less than 1x10^‑4 ohm‑cm. 40‑3900 is also well known for its' wide operating temperature range, ‑50 to + 170^oC. (read more)

50-2366 FR is a new thermally conductive polyurethane potting compound. This flexible system is designed for low stress on sensitive components during and after cure. 50-2366 FR polyurethane resin system is formulated for applications requiring low exotherm, low shrinkage, and excellent electrical properties. (read more)

RFC-2869 Mod 2 is one-part, silver filled, electrically conductive epoxy adhesive. When cured, this adhesive will have very high thermal and electrical conductive properties. In addition, it bonds very well to many substrates. (read more)

Master Bond has introduced a two component epoxy adhesive for high temperature heat transfer applications called EP21ANHT. It provides an exceptionally high thermal conductivity, for use in high temperature heat management applications where service temperatures reach up to 205°C. It also forms strong bonds, 1800 psi in shear, and offers good chemical resistance. (read more)

RTVS 3-95-1 is a low viscosity, thermally conductive RTV silicone compound, which is UL recognized. (read more)