Aremco offers a broad line of electrically and thermally conductive materials which provide solutions to a variety of electrical, electronic and thermal design problems throughout industry… (read more)

Master Bond has introduced a two component epoxy adhesive for high temperature heat transfer applications called EP21ANHT. It provides an exceptionally high thermal conductivity, for use in high temperature heat management applications where service temperatures reach up to 205°C. It also forms strong bonds, 1800 psi in shear, and offers good chemical resistance. (read more)

Uni-Home's High Thermally Conductive Soft Pad is an ideal heat conductive material products for many electrical appliances. With its low hardness, it serves as excellent shock reduction material and filler. (read more)

RTVS 3-95-1 is a low viscosity, thermally conductive RTV silicone compound, which is UL recognized. (read more)

Light weight Master Bond adhesive EP30BN offers enhanced thermal management of heat generating components. The Boron Nitride Compound Provides excellent heat dissipation within aerospace and microelectronic assemblies. It features, a high thermal conductivity, low specific gravity, volume resistivity 10¹⁴ ohm cm and dielectric constant of 4.2 at 1 KHZ. (read more)

Aremco-Bond ^tm 805, a new high temperature, thermally conductive epoxy system developed by Aremco Products, Inc., is now for bonding and tooling applications to 300 ^oC (572 ^oF). (read more)

Master Bond Supreme10HTFS is a, 2 minute, rapid curing and electrically conductive silver filled epoxy. It features tensile shear strengths of 1,200 psi, T-peel strengths in excess of 5 pli, and volume resistivity less than 10^-3 ohm-cm. Service temperatures are from 4°K up to 205°C with superior resistance to impact, thermal shock, vibration ,creep and corrosion. (read more)

Epoxies etc...'s 50-2369 FR is the fastest self extinguishing Thermally Conductive Polyurethane Potting Compound available on the market today. Offering a unique combination of properties seldom seen in a Thermally Conductive Potting Compound, 50-2369 FR provides a quick heat dissipating system in a polyurethane chemistry, while also passing UL's 94 V-O self extinguishing test. (read more)

50-2366 FR is a new thermally conductive polyurethane potting compound. This flexible system is designed for low stress on sensitive components during and after cure. 50-2366 FR polyurethane resin system is formulated for applications requiring low exotherm, low shrinkage, and excellent electrical properties. (read more)

3M™ Thermally Conductive Adhesive Transfer Tape 8810 is designed to provide a preferential heat-transfer path between heat-generating components and heat sinks or other cooling devices (e.g., fans, heat spreaders or heat pipes).

• This tape is a tacky pressure sensitive transfer adhesive loaded with thermally conductive ceramic fillers that do not require a heat cure cycl... (read more)