Aremco-Bond ^tm 805, a new high temperature, thermally conductive epoxy system developed by Aremco Products, Inc., is now for bonding and tooling applications to 300 ^oC (572 ^oF). (read more)

Epoxies, Etc... has developed 50-3150 FR to meet the stringent non-burning requirements of UL94 V-O. 50-3150 FR Black Epoxy with Catalyst 190 and Catalyst 105 are listed with Underwriter's Laboratory for passing UL94 V-O. This system offers excellent heat transfer, low shrinkage, and outstanding insulation properties. (read more)

Epoxies etc...'s 50-2369 FR is the fastest self extinguishing Thermally Conductive Polyurethane Potting Compound available on the market today. Offering a unique combination of properties seldom seen in a Thermally Conductive Potting Compound, 50-2369 FR provides a quick heat dissipating system in a polyurethane chemistry, while also passing UL's 94 V-O self extinguishing test. (read more)

Aremco offers a broad line of electrically and thermally conductive materials which provide solutions to a variety of electrical, electronic and thermal design problems throughout industry… (read more)

50-2366 FR is a new thermally conductive polyurethane potting compound. This flexible system is designed for low stress on sensitive components during and after cure. 50-2366 FR polyurethane resin system is formulated for applications requiring low exotherm, low shrinkage, and excellent electrical properties. (read more)

Epoxies, Etc... develops a one component electronic grade epoxy adhesive. 50-3122 has a unique combination of properties. This adhesive provides both high shear and high peel strength. It is also able to maintain exceptionally strong bonds over a wide temperature range of -60 to +205 C. (read more)

Light weight Master Bond adhesive EP30BN offers enhanced thermal management of heat generating components. The Boron Nitride Compound Provides excellent heat dissipation within aerospace and microelectronic assemblies. It features, a high thermal conductivity, low specific gravity, volume resistivity 10¹⁴ ohm cm and dielectric constant of 4.2 at 1 KHZ. (read more)

Master Bond has introduced a two component epoxy adhesive for high temperature heat transfer applications called EP21ANHT. It provides an exceptionally high thermal conductivity, for use in high temperature heat management applications where service temperatures reach up to 205°C. It also forms strong bonds, 1800 psi in shear, and offers good chemical resistance. (read more)

Taking compact protectors to the next level, MCG's new PT 250 Series is the most advanced non-modular protector available anywhere. It's UL 1449, 2nd Ed. Listed, including requirements of Feb. 9, 2007, and shows the real UL logo, not the mark of a compliant lab. (read more)

Epoxies, Etc... has two Flame Retardant epoxies listed with Underwriters Laboratory (UL). The 20-3651\40 FR and 50-3150 FR Epoxy Potting Compounds have been tested and passed UL 94 VO. (read more)