Master Bond has introduced a two component epoxy adhesive for high temperature heat transfer applications called EP21ANHT. It provides an exceptionally high thermal conductivity, for use in high temperature heat management applications where service temperatures reach up to 205°C. It also forms strong bonds, 1800 psi in shear, and offers good chemical resistance. (read more)

Aremco offers a broad line of electrically and thermally conductive materials which provide solutions to a variety of electrical, electronic and thermal design problems throughout industry… (read more)

RTVS 3-95-1 is a low viscosity, thermally conductive RTV silicone compound, which is UL recognized. (read more)

Light weight Master Bond adhesive EP30BN offers enhanced thermal management of heat generating components. The Boron Nitride Compound Provides excellent heat dissipation within aerospace and microelectronic assemblies. It features, a high thermal conductivity, low specific gravity, volume resistivity 10¹⁴ ohm cm and dielectric constant of 4.2 at 1 KHZ. (read more)

Taking compact protectors to the next level, MCG's new PT 250 Series is the most advanced non-modular protector available anywhere. It's UL 1449, 2nd Ed. Listed, including requirements of Feb. 9, 2007, and shows the real UL logo, not the mark of a compliant lab. (read more)

Aremco-Bond ^tm 805, a new high temperature, thermally conductive epoxy system developed by Aremco Products, Inc., is now for bonding and tooling applications to 300 ^oC (572 ^oF). (read more)

Light Fabrications supplies thermally conductive adhesives cut and engineered to your exact specifications. (read more)

Henkel Corporation has improved Loctite^® 4204™ Prism^® Instant Adhesive, a surface insensitive cyanoacrylate that is toughened with elastomers to deliver enhanced flexibility and improved heat/humidity resistance. Thermally resistant Loctite^® 4204™ Prism^® provides excellent hot strength and heat aging properties up to 250°F. (read more)

Master Bond UV10DCTK is a UV or heat curable modified epoxy resin system for high performance surface mount applications. It has been developed to solve a quality control problem with shadowed areas in UV curing systems. Having an alternative thermal curing mechanism, i.e. heat cure, greatly enhances the utility of UV curing technology by extending its applicability to opaque assemblies. (read more)

Epoxies etc...'s 50-2369 FR is the fastest self extinguishing Thermally Conductive Polyurethane Potting Compound available on the market today. Offering a unique combination of properties seldom seen in a Thermally Conductive Potting Compound, 50-2369 FR provides a quick heat dissipating system in a polyurethane chemistry, while also passing UL's 94 V-O self extinguishing test. (read more)