Extracting maximum power from minimum space inevitably means that the electronic componentry develops higher and higher temperatures. To protect these components, heat needs to be dissipated quickly and reliably. This is where aluminum nitride ceramic Alunit® sets new standards. (read more)

AlNimax™ Aluminum Nitride is a high purity, fully dense ceramic material that features excellent plasma resistance and superior thermal properties. These characteristics provide improved component life and reliable performance for silicon wafer processing. Manufacturing process flexibilty allows the integration of features such as refractory metal layers, electrical terminations and embos... (read more)

Thick film on aluminum nitride and alumina provide preferred heating elements resulting in temperature uniformity, quick response and stable physical properties. (read more)

Free up PCB real estate and reduce overall impedance of the power distribution system with FARADFLEX®, Oak- Mitsui's revolutionary ultra thin polymer film substrate capacitor plane for PCB fabrication. Oak-Mitsui's licensed Buried Capacitance™ technology eliminates the need for some discrete capacitors. (read more)

BN300 Substrate for IC has high performance due to low warpage and high heat resistance due to high flexural modulus, low CTE and high Tg (300). (read more)

Problem:

A customer pioneering in the life sciences industry contacted Insaco for a quote on Aluminum Nitride machining for their developmental part requiring excellent hardness and good thermal conductivity. However, they weren't sure the Aluminum Nitride was the most efficient choice. (read more)

Panels Act As Rain Screen Reducing Substrate Moisture

Moisture build-up, rotting interior walls and mold growth can now be significantly reduced when using Nichiha fiber cement brick, stone and block panels. (read more)

The ims ANX series of thick film high power chip terminations on aluminum nitride is ideal for most applications requiring high power dissipation in a small size package. AlN is an ideal replacement for BeO as it has very high power dissipation with no potential environmetal hazards. (read more)

The ims APX series of thick film high power chip resistors on aluminum nitride is ideal for most applications requiring high power dissipation in a small size package. AlN is an ideal replacement for BeO as it has very high power dissipation with no potential environmetal hazards. (read more)

Precision Parts in CVD Silicon Carbide A customer pioneering in the life sciences industry contacted Insaco for a quote on Aluminum Nitride machining for their developmental part requiring excellent hardness and good thermal conductivity. However, they weren't sure the Aluminum Nitride was the most efficient choice. (read more)