Significantly increased dry-running capability! Our SiC-X bearings can run dry for extended periods — even hours! Unique materials and manufacturing techniques of our specially treated SiC-X bearings provide a coefficient of friction 1/4 that of SiC. (read more)

Proforma^TM AutoScan 200 - Fully automated wafer characterization system for measuring thickness, TTV, bow, warp, bulk resistivity, site and global flatness. The Proforma AutoScan 200 features pick and place robotics, laser cassette scanning, auto-sensing cassette stands for wafers 75 - 200 mm diameter, and a modular design for easy upgrades. (read more)

Proforma 200SA - Semi-automated, full wafer surface scanning for thickness, TTV, bow, warp, site and global flatness. The Proforma 200SA can be used for all wafer materials and accommodates diameters 75 - 300 mm. (read more)

The BlackStar™ fiber laser system offers the best in silicon wafer dicing. (read more)

These UV, Gallium Nitride (GaN) and Silicon Carbide (SiC), sensors are intended for use in the spectral region of 200 nm to 400 nm where maximum quantum efficiency is required at these wavelengths. (read more)

Today's technology companies continue to demand extremely thin silicon wafers and die for their complex applications. The Syagrus Systems team has over 12 years of silicon wafer thinning and wafer backgrinding experience. (read more)

Hermann, MO- Laser Light Technologies, Inc developed a range of approaches in laser micromachining photovoltaic panels and solar cells. These include isolation scribing, silicon wafer resizing, micromachining arrays of tapered and v-shaped grooves, laser drilling of via holes using fundamental and frequency multiplied YAG lasers and XY precision stages. (read more)

Etched Foil Heaters for the Semiconductor & Wafers industries from Thermal Circuits. In the early 1980's, Thermal Circuits introduced HTB etched foil element heaters to the Semiconductor industry to heat acid in portable wafer processing baths. It replaced hot plates that only heated from the bottom. (read more)

The Proforma 300 TM wafer thickness gage can be used to measure thickness, bow and TTV on all wafer materials including: silicon,gallium-arsenide,indium phosphide and germanium without recalibrating or electrically grounding the wafer. (read more)

Proforma 300/G - Manual, non-contact measurement of wafer thickness, TTV and bow. Portable and easy to set-up, the Proforma 300/G measures all wafer materials including Silicon, Gallium-Arsenide, Indium-Phosphide and wafers mounted to sapphire or tape. (read more)