Semiconductors (metalloids) or semiconductor materials are used to fabricate microelectronic and optoelectronic devices such as transistors, photodetectors or solar cells

Metal-oxide semiconductor field-effect transistors (MOSFETs) are electronic devices with a built-in capacitor as the input and a conducting channel as the output. An electrode called a gate controls the width of the channel and determines how well the MOSFET conducts

Product and component testing services is the evaluation of a finished product or component through performance in electrical, life, environmental exposure, dynamic, ergonomic or other specialized tests.  Also testing to standards such as UL 489, CE or MIL-STD 810

Encapsulants and potting compounds are resins or adhesives that are used to encapsulate circuit boards and semiconductors, fill containers of electronic components, and infiltrate electrical coils. They provide environmental protection, electrical insulation and other specialized characteristics

Semiconductor foundry services suppliers design and manufacture semiconductor chips on a contract basis, in prototype to production quantities

Semiconductor cluster tools and equipment are used to process semiconductor wafers for the production of microelectronic components

Specialized or proprietary products and accessories related to the manufacture of electronic or semiconductor components

Vacuum chambers and components are specialized vessels that can maintain a high vacuum process environment for manufacturing thin films, microelectronics, optics and materials. 

IC sockets and interconnect components interface or connect a microelectronic semiconductor chip to a board or larger scale device

Electrical resins and electronic compounds includes adhesives, greases, pads, stock shapes, tapes, encapsulants, potting compounds, thermal interface materials, and electrically conductive substances used in electrical, electronics, and semiconductor applications

Environmental exposure (climatics) testing services use humidity, pressure, temperature, vibration, exposure to ultraviolet light (UV) and other climatic variables to test samples, parts and components, and finished products

Laser optics, heads and beam delivery components are used in laser cutting machines, laser welding and marking systems

Wafer and thin film instrumentation includes quartz crystal microbalance (QCM) monitors, ellipsometers, RHEED systems, imaging stations, CD-SEMs, ion mills, and C-V systems specifically designed for wafer metrology or in-situ monitoring of thin film parameters during thin film or semiconductors wafer processing

Error correction chips are semiconductor ICs that are used to check and to correct data transmission errors

CPU chips or central processing unit chips are used in digital computers and are the semiconductor component where most calculations take place