Electrical resins and electronic compounds includes adhesives, greases, pads, stock shapes, tapes, encapsulants, potting compounds, thermal interface materials, and electrically conductive substances used in electrical, electronics, and semiconductor applications.

Electrical insulation and dielectric materials surround and protect electrical conductors such as wires and cables. They also prevent unwanted current flow or leakage.

Encapsulants and potting compounds are resins or adhesives that are used to encapsulate circuit boards and semiconductors, fill containers of electronic components, and infiltrate electrical coils. They provide environmental protection, electrical insulation and other specialized characteristics

Thermal insulation and fireproofing materials reduce the flow of heat through the thickness of the material. They are typically fiber-based or foam structures prepared from thermally-stable materials

Thermoplastics and thermoplastic materials soften when heated and harden when cooled. They can withstand many heating and cooling cycles and are often suitable for recycling

RF and microwave laminates are used as substrates for radio frequency (RF) and microwave communication systems and electronics. They are designed to meet the demanding performance standards for higher-frequency applications.

Adhesive tapes and films temporarily or permanently join materials together.

Double coated tapes are coated with adhesive on both sides of the backing or carrier. Transfer tapes consist of a thin adhesive film without a carrier or backing.

Industrial tape is used for adhesive bonding, thread sealing, masking, packaging, wrapping, electrical insulation, ESD control and other specialized applications.

Packaging tapes and films are used to seal or wrap boxes, bottles or other packages.

Molding compounds and resins are industrial plastics and polymers that are suitable for forming. They are available as pellets, liquids, and powders and are used in processes such as injection molding, compression molding, reaction injection molding (RIM), resin transfer molding (RTM), and blow molding

Heat treating services perform thermal treatments to modify the properties of metals and metal alloys. Common processes include annealing, austempering, case hardening, conventional hardening, homogenizing, hot isostatic pressing (HIP), martempering, normalizing, precipitation hardening, shot peening, solution treating, spheroidizing, stabilizing, and stress relieving

Thermal compounds and thermal interface materials form a thermally conductive layer on a substrate, between components or within a finished product.

Heat exchangers are commonly used in a wide variety of industrial, chemical, and electronics processes to transfer energy and provide required heating or cooling

Casting resins are pourable plastic or elastomer compounds used to cast parts, make molds or form a structure in place