RFC-2869 Mod 2 is one-part, silver filled, electrically conductive epoxy adhesive. When cured, this adhesive will have very high thermal and electrical conductive properties. In addition, it bonds very well to many substrates. (read more)

40‑3900 is a two component epoxy adhesive filled with pure silver. This electrically conductive epoxy resin formulation offers the maximum in continuity of conductivity with an electrical resistivity value of less than 1x10^‑4 ohm‑cm. 40‑3900 is also well known for its' wide operating temperature range, ‑50 to + 170^oC. (read more)

Although Epoxies, Etc... offers a complete standard product line, we also custom formulate electrically conductive adhesives and resins for specific customer requirements. (read more)

50-2366 FR is a new thermally conductive polyurethane potting compound. This flexible system is designed for low stress on sensitive components during and after cure. 50-2366 FR polyurethane resin system is formulated for applications requiring low exotherm, low shrinkage, and excellent electrical properties. (read more)

Pyro-Duct^tm 597-C, a new silver-filled, high temperature, electrically and thermally conductive coating developed by Aremco Products, Inc., is now used to produce electronic and high vacuum components for applications to 1700 ^oF (927 ^oC). (read more)

Master Bond Supreme10HTFS is a, 2 minute, rapid curing and electrically conductive silver filled epoxy. It features tensile shear strengths of 1,200 psi, T-peel strengths in excess of 5 pli, and volume resistivity less than 10^-3 ohm-cm. Service temperatures are from 4°K up to 205°C with superior resistance to impact, thermal shock, vibration ,creep and corrosion. (read more)

Light weight Master Bond adhesive EP30BN offers enhanced thermal management of heat generating components. The Boron Nitride Compound Provides excellent heat dissipation within aerospace and microelectronic assemblies. It features, a high thermal conductivity, low specific gravity, volume resistivity 10¹⁴ ohm cm and dielectric constant of 4.2 at 1 KHZ. (read more)

Master Bond has introduced a two component epoxy adhesive for high temperature heat transfer applications called EP21ANHT. It provides an exceptionally high thermal conductivity, for use in high temperature heat management applications where service temperatures reach up to 205°C. It also forms strong bonds, 1800 psi in shear, and offers good chemical resistance. (read more)

Aremco-Bond ^tm 805, a new high temperature, thermally conductive epoxy system developed by Aremco Products, Inc., is now for bonding and tooling applications to 300 ^oC (572 ^oF). (read more)

Resin Traps and Media Traps for Water Treatment Systems. Resin traps/media traps are protection devices that prevent a complete loss of ion exchange resin, activated carbon, filter media, greensand, sand, or multimedia from an underdrain, lateral or strainer failure. Resin traps save your downstream product, process, equipment and/or pumps from damage and contamination. (read more)