Capable of delivering massive currents in very little real estate, the LowPro L series is a family of highcurrent, high-density board power connectors that enable the design engineer to achieve significantly higher power densities and increased airflow in their power system designs. (read more)

Schuster Electronics offers the new High Density Screw Machined D-Subs from Norcomp. These connectors combine the reduced footprint of the current High Density D-Sub products (65% space reduction) with the robust performance of a solid pin screw machined contact. (read more)

The 40-566 provides a competitive, scalable & robust solution for simultaneously routing up to four higher power signal pairs (2-pole solutions available to 165x4 in a BRIC4 & 385x4 in a BRIC8). This model comprises a flexible architecture, enabling multiple independent matrices via isolation switching. Partially populated versions are available upon request, minimizing costs. (read more)

The Conax High Density (HD) assembly consists of stainless steel tubing swaged over bundled 24 AWG solid Teflon-coated thermocouple grade wires and/or copper wires. HD assemblies provide continuous wire feedthrough for thermocouples, RTDs and low voltage instrumentation, allowing multiple conductors/wires to pass through a single port. (read more)

V-Infinity, a division of CUI Inc, introduces a series of high density, medically approved open frame switching power supplies. The VMS-160 series outputs 160W with 400 LFM forced air cooling or 100W under convection-cooled conditions. This translates to a power density of 18 W/in³ in a 1U, industry standard, 2" x 4" footprint.... (read more)

Ramtron introduces the first 4Mb F-RAM memory, manufactured on Texas Instruments' proven 130 nanometer process with Ramtron's advanced F-RAM cell architecture.

• Highest-density F-RAM product to date
• Cost-effective alternative to MRAM, BBSRAM, and NVSRAM
  

A 2Mb F-RAM is also available. (read more)

A high density, instrumentation connector series for submerged applications where size and cost are major drivers in selection. The plugs are designed to be molded to cables. (read more)

CKT has designed the CKT2170 Series specifically for high-volume interconnection testing of high-density printed wiring devices such as ceramic substrates, chip-carriers, multi-chip modules, liquid crystal displays, etc. (read more)

Versatile New PC/104 High-Density Analog Signal Conditioner Provides 32 Channels and up to 256 Inputs.

The high-density Model 104-AIM-32A Kit provides 32 single-ended or 16 differential inputs with flexible gain for use with factory configured options such as conditioning for Thermocouples, RTDs, Bridge type load cells and strain gages, and 4-20mA inputs with fault detection. (read more)

High Density D-Sub Surface Mount (read more)