|
|
||
|
|
|||
|
Product Alerts
Keep current on the latest products, new suppliers, and technical articles of interest to you. (See Topics) |
| All | Products & Services | Part Number Search |
Engineering News
|
Application Notes | Material Properties | Patents | Standards |
Electrical resins and electronic compounds includes adhesives, greases, pads, stock shapes, tapes, encapsulants, potting compounds, thermal interface materials, and electrically conductive substances used in electrical, electronics, and semiconductor applications.
Thermal compounds and thermal interface materials form a thermally conductive layer on a substrate, between components or within a finished product.
Search by Specification | Learn MorePolymer and plastic composites are strengthened with fibers, fillers, particulates, powders and other matrix reinforcements to provide improved strength and/or stiffness. Examples of polymer and plastic composites include fiber reinforced plastics (FRPs), sheet molding compounds (SMCs), bulk molding compounds (BMCs), pre-preg materials, and fabricated composite parts
Search by Specification | Learn MoreGel elastomers are highly viscoelastic polymer gel materials that have excellent shock absorption and damping characteristics. They are available in a variety of material types and grades
Search by Specification | Learn MoreMolding compounds and resins are industrial plastics and polymers that are suitable for forming. They are available as pellets, liquids, and powders and are used in processes such as injection molding, compression molding, reaction injection molding (RIM), resin transfer molding (RTM), and blow molding
Search by Specification | Learn MoreConductive adhesives and compounds provide an electrically and/or thermally conductive path between components.
Search by Specification | Learn MoreEncapsulants and potting compounds are resins or adhesives that are used to encapsulate circuit boards and semiconductors, fill containers of electronic components, and infiltrate electrical coils. They provide environmental protection, electrical insulation and other specialized characteristics.
Search by Specification | Learn MoreMaterial testing services test, analyze, and certify a wide range of materials for purity, chemical compatibility, and environmental impact.
Search by Specification | Learn MoreCasting resins are pourable plastic or elastomer compounds used to cast parts, make molds or form a structure in place.
Search by Specification | Learn MoreConformal coatings encapsulate circuit boards and their electronic components in order to prevent the ingress of moisture, fungus, dust and other environmental contaminants.
Search by Specification | Learn MoreSpecialty adhesives, sealants and compounds are specialized and/or proprietary products with unique chemistries, cure technologies and/or compositions.
Search by Specification | Learn MoreAnaerobic adhesives and sealants cure in the absence of air or oxygen.
Search by Specification | Learn MorePolyurethane adhesives and sealants provide excellent flexibility, impact resistance, and durability. They are available in one-part or two-part adhesive systems.
Search by Specification | Learn MoreIndustrial adhesives are organic or inorganic chemical compounds for joining components. This category covers all adhesive types.
Search by Specification | Learn MoreDrains and drain systems are used to capture and remove water to prevent accidents, flooding or other hazardous conditions.
Search by Specification | Learn More|
|
|||||
Electrical Resins and Electronic Compounds All Seals, Inc.
Potting Resins Protavic America, Inc.
One-Part Electrically Conductive Epoxy E.V. Roberts
|
VEP manufactures a variety of Copper Liquid cooled heat sink assembly kits that work with SCR devices from 33mm to 100mm. Bolt holes centers vary from 2.75" to 7.5". These items are stocked and come with the shortest lead times in the industry. All liquid cooled heat sink kits come with nickel plated copper chill blocks, the recommended clamps and SCR locating pins already installed. (read more)
Omron's G3PB Solid State Contactor for three-phase loads now offers improved heat sink construction and increased 480 VAC operating voltage. The heat sink design allows the G3PB to save panel space and helps the relay to operate cooler for a long service life. It also allows for industry mounting and can be used in place of mercury contactors and relays. (read more)
The Modular Heat Sink Assembly provides a modern, economical, labor saving, replacement of diodes, SCR or IGBT modules for traditional ceramic capsule (hockey puc) or stud assemblies. (read more)
In order to minimize overall utility costs for both fuel and electric consumption, Cycle-Therm supplies a proprietary heat sink media known as Cell Stone® ULTRA. Cell Stone® ULTRA is manufactured of Silica-based 2300 F° refractory material. (read more)
Pressurex® Pressure Film Records Surface Pressure on a Heat Sink.... (read more)
CARLO GAVAZZI's new addition to the RJ Series Solitrons can now switch two or three phases, and are ideally suited to replace electromechanical contactors or mercury contactors in high switching frequency applications. (read more)
TSI Group, Inc. manufactures custom heat sinks to match your specifications. (read more)
VICTREX PEEK Polymer Offers a New Level of Performance, Reliability and Cost Savings to the Textile Machinery Industry
From bearings, bushings, and sleeves to yarn guides, wear strips, and coated rollers, components made with VICTREX PEEK polymer, VICOTE Coatings and APTIV films help keep textile machinery running at peak productivity levels. (read more)
A bonded fin heat sink removes the design limiting fin extrusion ratio found in extruded heat sinks. Typical extrusion fin ratios at VEP are generally from 4:1 up to 16:1. However, VEP currently produces a bonded fin heat sink with a ratio of 44:1.Ratios higher than 44:1 are possible as well. (read more)
Heat sinks function by efficiently transferring thermal energy from an object at high temperature to a second object at a lower temperature with a much greater heat capacity There are many things to consider when dealing with extruded heat sinks, including to extrusion considerations such as, cost, tolerances, extrudablitiy, manufacturing considerations and heat sink design. (read more)
| Part # | Distributor | Manufacturer | Product Category | Description |
|---|---|---|---|---|
| 23M9201 | Newark | Cinch | Aluminum Electrolytic | Enclosure, Le W/O Heat Sink; Width, External:189.2Mm; Depth, External:172.7Mm; Material:Glass Filled Polymer; Colour:Black; Standard:Ip67; Temp, Op. Max:+85(Degree C); Temp, Op. Min:-40(Degree C); Approval Category:Sae-J1455, Rohs Compliant: Yes |
| 02J1442 | Newark | Bourns | Fans, Axial | Inductor; Inductor Type:Standard; Series:Cm322522; Inductance:15Uh; Inductance Tolerance:+/-10%; Dc Resistance Max:2.8Ohm; Dc Current Rating:120Ma; Self Resonant Frequency:30Mhz; Package/Case:1210; Q Factor:30; Core Material:Polymer Rohs Compliant: Yes |
| 25M3701 | Newark | Molex | Fans, Axial | Header; No. Of Contacts:14; Pitch Spacing:3Mm; No. Of Rows:2; Series:Micro-Fit; Connector Body Material:Polymer; Mounting Type:Pc Board; Terminal Type:Surface Mount |
| 69C9751 | Newark | Igus | Fans, Axial | Trunking, 1M; Colour:Black; Height, External:35Mm; Length / Height, External:1M; Length / Height, Internal:25Mm; Material:Glass Reinforced Polymer; Width, External Imperial:41Mm; Width, Internal:25Mm Rohs Compliant: Na |
|
Physical Review E |
|
|
Light-emitting diode - Wikipedia, the free encyclopedia necessary to shed excess heat in order to maintain reliability, so more complex packages adapted for efficient heat dissipation are becoming common. |
|
|
Entropy - Wikipedia, the free encyclopedia Entropy is a function of a quantity of heat which shows the possibility of conversion of that heat into work. |
|
|
Electrochemistry Dictionary conducting polymer current source (supply) |
|
|
OCWorkbench Lifestyle forum AMD 790GX, MCP7A, NVIDIA GeForce... |
|
|
PC Case Gear, Quality case accessories and components DTEK nVidia Uni-sink Normally $39.00 ASUS Silent 84 Normally $59.00 |
|
|
Hardness The tests determine the depth which such a ball or cone will sink into the metal, under a given load, within a specific period of time. |
|
|
EDN Access 10.12.95 Choosing a heat sink: some tips and... Heat-sink types include stamped, extruded, bonded, and convoluted-fin heat sinks and fan sinks. |
|
|
ePanorama Cool Innovations - heat sinks Rate this link |
|
|
Chomerics - HEAT TRANSFER 1) heat transfer within the semiconductor component package; 2) heat transfer from the package to a heat dissipater (the initial heat sink); |