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Product Categories for gold embrittlement
Precious Metals and Alloys -
(78 companies)
Precious metals and alloys such as silver, gold, platinum and palladium alloys are extremely resistant to corrosion and oxidation
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Plating and Anodizing Equipment -
(117 companies)
Plating and anodizing equipment is used to apply a finish to a products to increase its durability or to resist corrosion.
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Plating Services -
(565 companies)
Plating services apply a thin coating of metal to the surface of a substrate in order to improve conductivity, prevent rust and corrosion, and facilitate soldering. There are two basic plating techniques: electroplating and electroless plating.
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Braze and Brazing Alloys -
(106 companies)
Braze and brazing alloys join metals or other materials without extensive fusion of the substrates. Brazes have a higher melting point (>800° F) than solders and cause little or no metal vaporization, gain growth, stress corrosion, or distortion.
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Electrical Contact and Electrode Materials -
(237 companies)
Electrical contact and electrode materials are soft, high conductivity, oxidation resistant materials used in circuit breakers, relays, and for EDM applications.
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Electrical Contacts and Contact Materials -
(88 companies)
Electrical contacts and contact materials are soft, high-conductivity, oxidation- resistant materials that are used in circuit breakers, relays, switches, and electrical discharge machining (EDM) applications. They often have a second phase in order to provide anti-welding and/or arc resistance.
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Refining and Recovery Services -
(37 companies)
Refining and recovery services include the purification and treatment of oils, fuels, metals and other materials.
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Filler Alloys and Consumables -
(431 companies)
Filler metal alloys and consumables used in welding, brazing or soldering include items in rod sheet, wire spool, coated stick, weld stud, powder, preform or paste forms.
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IC Sockets and Interconnect Components -
(464 companies)
IC sockets and interconnect components interface or connect a microelectronic semiconductor chip to a board or larger scale device.
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Metal Wire and Strand -
(165 companies)
Metal wire and strand has a round, flat, or shaped cross section. Products are usually less than 0.375" in diameter.
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Metal Rod and Bar Stock -
(540 companies)
Metal rod and bar stock are metals and alloys in the form of round bars or rod, square bars, rectangular or flat bars, hexagons, and other bar stock shapes.
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Solder -
(162 companies)
Solders include low melting point metal alloys usually in wire, powder, preform or paste forms. Solders are metal alloys with low melting points that are used to join metals together.
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Lead, Tin and Low Melting Alloys (White Metals) -
(70 companies)
Lead, tin and low melting alloys (white metals) are non-ferrous alloys used in the manufacture of solder, semiconductor, battery and decorative products.
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Electronic and IC Packaging Services -
(89 companies)
Integrated circuit packaging is the final stage of semiconductor device fabrication in which the bare die or bare boards are placed inside of a protective packaging that provides connectors or pins for connecting to other devices.
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Fluxes -
(116 companies)
Fluxes are a chemical composition used in soldering, brazing and welding that cleans the metal surface, assists with heat transfer and helps remove surface metal oxides.
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Product Announcements for gold embrittlement
Product Announcements: 1 - 10 of 661
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Team Metal Finishing
Gold Plating
Gold plating offers good corrosion resistance, good solderability, and when alloyed with cobalt, it has very good wear resistance. Gold is commonly used in electrical switch contacts, connector pins and barrels, and other applications where intermittent electrical contact occurs.
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Bunting Magnetics Co.
Gold Series Cylinder
Bunting Magnetics' new Gold Series Rotary Hot Stamping Cylinders (Patent Pending) provide unmatched operational economy and foil transfer performance. They combine high heat tolerance with rapid heat transfer and fast on-press setups.
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J. Walter Inc.
Gold Matrix Cleaner/Degreaser
Gold Matrix™ is a non-hazardous alkaline cleaner that uses advanced surfactants to deliver outstanding cleaning. Perfect for heavy duty cleaning in an industrial setting, Gold Matrix™ can be used in all types of cleaning equipment suitable for water-based cleaning solutions.
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CAS Data Loggers
New ADwin-Gold II
The new ADwin-Gold-II real-time data acquisition system offers 10x the performance of previous ADwin-Gold systems along with higher measurement resolution and integrated 10/100 BaseT Ethernet. It's ideal for demanding industrial, portable or stand-alone real-time measurement and control applications.
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Fusite
Gold and Nickel Plating Capabilities
Fusite Engineered Products is equipped with both Gold and Nickel plating operations. The company's capabilities include electroless and electrolytic nickel plating as well as hard and soft gold plating.
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Cymbet Corporation
Cymbet Enerchip™ Wins Gold Award
Cymbet Enerchip™ Wins Best of Sensors Expo 2008 Gold Award: Elk River, Minn. USA– June 23, 2008 – Cymbet Corporation today announced that it has been awarded a Sensors' "Best of Sensors Expo 2008" Gold award. Cymbet won the award for its EnerChip™ Solid State Thin-Film Batteries and their applications in power bridging, permanent power and energy harvesting ...
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Printronix, Inc.
Gold Series Ribbons
Gold Series Ribbons are formulated for high yield, dark, high definition bar code and text printing. These ribbons increase printing productivity with fewer ribbon changes resulting in reduced overall cost of printing operations.
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Fiberguide Industries, Inc.
Gold Coated Fiber
Optical fibers are typically manufactured from a preform consisting of a silica core which may be doped silica or pure silica and a cladding classically of silica having a lower refractive index than the core. An additional layer or coating/buffer is added to prevent the ingress of moisture and other contaminants which would lead to very early failure of the fiber, and preserves the initial ten...
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SF Cable Inc.
RCA Coupler Female to Female Gold Plated
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Servometer - PMG, LLC
NEW! SOLID GOLD ELECTROFORMS
Electroforms can be manufactured in an infinite number of shapes and forms to fit into specific applications.
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Tools & Useful Links for gold embrittlement
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Engineering Web: gold embrittlement
1 - 10 of 8,263
Gold Embrittlement Expert
Gold Embrittlement Experts. The following experts are available as gold embrittlement consultants and gold embrittlement expert witnesses. All are peer-reviewed and acknowledged experts in their ...
See Intota Information
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Electronics Interconnection Free Downloads: www.npl.co.uk/ei Critical Pad ...
... gold embrittlement. Gold embrittlement is known to occur at 5% weight of gold in SnPb 60/40 solder, but it is the volume % of gold that is more usually required for gold embrittlement. The method to ...
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Circuit engineering - Gold Embrittlement in solder joints
... 0.0984 mil] or greater gold thickness.. Before soldering to any gold plated surface, you must first remove the gold to conform to IPC-610. This is due to gold embrittlement of the solder connection ...
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Gold embrittlement of solder joints in wafer level chip scale package on printed...
... In this study, the effect of gold amount on the gold embrittlement of solder balls in wafer level chip scale package (WLCSP) CSP 80 is investigated. Firstly, precisely controlled amounts of gold were ...
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SMT Magazine Reacts to Chinese Electronics Assembly Market Growth
... Gold will alloy readily with tin/lead, but the alloy can become weak if the gold concentration exceeds a small percentage. This is what is known as gold embrittlement. The embrittlement of the ...
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Evaluation of reliability and metallurgical integrity of wire bonds and lead ...
... with solder joint embrittlement becomes a concern with thick gold plating. In order to better understand the effect of the gold plating thickness on wire bondability and solder joint embrittlement, an ...
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Considerations for Soldering Accelerometers in LCC-8 Packages onto Printed ...
... is gold embrittlement. The LCC-8 castellation (contact area) has tungsten as a base material, nickel as the middle layer, and gold as the top layer.. A mass of more than 2.5% gold inside the solder ...
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[No Title]
Method and structure to reduce risk of gold embrittlement in solder joints. Kejun Zeng, Coppell, Tex. (US). Assigned to Texas Instruments Incorporated, Dallas, Tex. (US). Filed on Dec. 13, 2005, as ...
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Embrittlement Expert
gold embrittlement. . platinum embrittlement. . metal embrittlement. . hydrogen embrittlement. . radiation embrittlement. . temper embrittlement. . alkali metal. . gold. . ...
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Effect of burn-in on shear strength of 63Sn-37Pb solder joints on an Au/Ni/Cu ...
... "gold embrittlement" and cited as a reason for failure of solder joints. It has been reported that gold embrittlement occurs in solder joints containing in excess of 4% Au by weight.1 In this work, it ...
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