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Product Categories for epoxy molding compound
Molding Compounds and Resins -
(219 companies)
Molding compounds and resins are industrial plastics and polymers that are suitable for forming. They are available as pellets, liquids, and powders and are used in processes such as injection molding, compression molding, reaction injection molding (RIM), resin transfer molding (RTM), and blow molding
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Epoxy Adhesives -
(375 companies)
Epoxy adhesives are chemical compounds for joining components. They require clean surfaces and are valued for their toughness and resistance to chemical and environmental damage
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Encapsulants and Potting Compounds -
(174 companies)
Encapsulants and potting compounds are resins or adhesives that are used to encapsulate circuit boards and semiconductors, fill containers of electronic components, and infiltrate electrical coils. They provide environmental protection, electrical insulation and other specialized characteristics
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Electrical Resins and Electronic Compounds -
(311 companies)
Electrical resins and electronic compounds includes adhesives, greases, pads, stock shapes, tapes, encapsulants, potting compounds, thermal interface materials, and electrically conductive substances used in electrical, electronics, and semiconductor applications
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Thermal Compounds and Thermal Interface Materials -
(116 companies)
Thermal compounds and thermal interface materials form a thermally conductive layer on a substrate, between components or within a finished product
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Mold Releases and Release Agents -
(132 companies)
Mold releases and release agents are film forming lubricating oils, solid lubricants, waxes, fluids or coatings that prevent other materials from sticking or adhering to an underlying surface
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Resins and Compounds -
(1826 companies)
Resins and compounds are pellets, liquid resins, bulk molding compounds, or other unfinished materials that are ready for shape fabrication or bond formation
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Plastics and Plastic Materials -
(765 companies)
Plastics and plastic materials are organic, synthetic or processed polymers that are supplied as raw materials or stock shapes. They typically consist of thermoplastic or thermosetting resins and can be made into many forms.
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Thermosets and Thermoset Materials -
(298 companies)
Thermosets and thermoset materials are crosslinked polymeric resins that are cured or set using heat or heat and pressure. They generally have a higher resistance to heat than thermoplastics.
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Electrical Insulation and Dielectric Materials -
(180 companies)
Electrical insulation and dielectric materials surround and protect electrical conductors such as wires and cables. They also prevent unwanted current flow or leakage.
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Conductive Adhesives and Compounds -
(114 companies)
Conductive adhesives and compounds provide an electrically and/or thermally conductive path between components
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Polymer and Plastic Composites -
(203 companies)
Polymer and plastic composites are strengthened with fibers, fillers, particulates, powders and other matrix reinforcements to provide improved strength and/or stiffness. Examples of polymer and plastic composites include fiber reinforced plastics (FRPs), sheet molding compounds (SMCs), bulk molding compounds (BMCs), pre-preg materials, and fabricated composite parts
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Polymer Concrete and Mortar -
(84 companies)
Polymer concrete and mortar are binders, compounds, and aggregate mixtures that use epoxy, polyester, vinyl ester or other polymer resin bonds. They cure or set through chemical reactions, thermoset bonds, and multiple component binder systems
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Industrial Paints -
(495 companies)
Industrial paints are pigmented liquids or powders that are used to protect and/or beautify substrates.
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Elastomers and Rubber Materials -
(471 companies)
Elastomers and rubber materials are characterized by their high degree of flexibility and elasticity (high reversible elongation or resilience).
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Product Announcements for epoxy molding compound
Product Announcements: 1 - 10 of 2332
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Rudolph Bros. & Co.
Epoxy Adhesives
Rudolph Bros. & Co. supplies Epoxy adhesives which are preferred throughout the world for high-strength structural bonding of metals, thermoplastics, thermosetting composites, and metal-to-plastic substrates with differing coefficients of thermal expansion.
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Epoxies Etc...
UL94 V-O Listed Epoxies
Epoxies, Etc... has developed 50-3150 FR to meet the stringent non-burning requirements of UL94 V-O. 50-3150 FR Black Epoxy with Catalyst 190 and Catalyst 105 are listed with Underwriter's Laboratory for passing UL94 V-O. This system offers excellent heat transfer, low shrinkage, and outstanding insulation properties.
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Epoxies Etc...
UL 94 VO Flame Retardant Epoxies
Epoxies, Etc... has two Flame Retardant epoxies listed with Underwriters Laboratory (UL). The 20-3651\40 FR and 50-3150 FR Epoxy Potting Compounds have been tested and passed UL 94 VO.
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Epoxies Etc...
Chemical Resistant Epoxy Potting Compounds
Epoxies, Etc has developed new chemical resistant epoxies. 20-3004 LV & HV are two component chemical resistance epoxy systems. They were developed for potting, coating, and adhesive applications requiring superior chemical resistance. They exhibit outstanding bonds to a variety of substrates.
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ITW Polymer Technologies - Insulcast Division
Insulcast 116FR - Epoxy Potting & Casting Compound
Insulcast 116 FR is an epoxy potting and casting compound designed for production use.
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Epoxies Etc...
Electrically Conductive Epoxy
40‑3900 is a two component epoxy adhesive filled with pure silver. This electrically conductive epoxy resin formulation offers the maximum in continuity of conductivity with an electrical resistivity value of less than 1x10‑4 ohm‑cm. 40‑3900 is also well known for its' wide operating temperature range, ‑50 to + 170oC.
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Epoxies Etc...
Clear Flexible Epoxy Doming Resin
Epoxies, Etc's innovative new Deco-Coat 2550 Resin System is a two component, low viscosity, flexible epoxy decorative coating. This versatile coating is a liquid resin that is safe and easy to use. It does not contain any solvents or offensive odors. This unique coating cures at room temperature to form a "bubble free", flexible coating...
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Rudolph Bros. & Co.
Tooling Epoxy
Rudolph Bros. & Co. has been selling epoxies for industrial tooling applications for more than 30 years. Their hands-on experience in the tooling market has allowed Rudolph Bros. to become one of the leading suppliers of epoxy tooling systems.
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Paramount PDS
Prototype and Low Volume Injection Molding...
Evolving from a service in support of product development engineering, Paramount PDS now offers a variety of injection molding services, providing significant lead-time reductions in runs from 1 to 100,000 pieces. Arburg presses ranging from 28 Ton (1.25 oz) to 176 Ton (13.2 oz). Overmolding, insert molding, and multi-shot molding. Materials from commodity grades to engineering resins.
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Master Bond, Inc.
New Ultra-Fast Curing Epoxy Adhesive
Master Bond has introduced an ultra-fast curing, high temperature resistant epoxy adhesive called EP65HT-1. It is formulated to set up in 3-5 minutes in 10 to 20 gm. masses at room temperatures. It has shear strengths approaching 3,000psi, Tg over 125C, an operating range of -60F to +400F, a volume resistivity >1014 ohm-cm, a dielectric constant of 3.9 and tensile modulus is 480,000psi.
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Other Topics You Might Be Interested In
The Potting or Encapsulation of electronic components is a common engineering design tool to protect products from environmental exposure. Potting involves the covering or embedding of an electronic...
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In order to meet the fast changing demands of the market, today’s packaging technology must demonstrate everincreasing performance, cost effectiveness and reliability. When a semiconductor package is...
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Definition: Light Emitting Diodes (LEDs) are compound semiconductor devices that convert electricity to light when biased in the forward direction. Because of its small size, ruggedness, fast...
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Tools & Useful Links for epoxy molding compound
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Engineering Web: epoxy molding compound
1 - 10 of 1,228,800
Overview - Epoxy Molding Compound
Common Name: Overview - Epoxy Molding Compound Grade: Categories: Epoxy, Thermoset, Polymer Material Category Name: polymer Trade Name: Manufactured by Keywords: Plastics, Polymers Material Notes. ...
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FMSC - Freeman 1010 Epoxy Molding Compound
... Epoxy Molding Compound. Castable 1/2" Thickness. 60 Min. Gel Time | 77 D Shore Hardness. . This medium density epoxy is a two component "clay-like" material that can be rolled out to a uniform ...
See Freeman Manufacturing & Supply Co. Information
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Cookson Group Plaskon® 7060 Epoxy Molding Compound
Test specimens were transfer molded and post cured 4 hours at 175°C.. A reduced-stress epoxy molding compound for the encapsulation of a variety of semiconductor devices ranging from small lead count ...
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Cookson Group Plaskon® AMC2 (132.203) Epoxy Molding Compound
Test specimens were transfer molded and post cured 4 hours at 175°C.. An epoxy molding compound specifically formulated for packaging stress-sensitive devices in DIPs, SOICs, PLCCs and small QFPs. ...
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Cookson Group Plaskon® SMT-B-1? Epoxy Molding Compound for PBGAs
... epoxy molding compound optimized specifically for grid arrays (BGA/LGA). It is formulated with a unique resin system that minimizes warpage and enables trouble-free molding onto laminated substrates. ...
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Cookson Group Plaskon® AMC-2RC Low Stress Epoxy Molding Compound
This material is an epoxy molding compound specifically formulated for encapsulation of stress sensitive electronic devices including DIPs, SOICs, SSOPs and PLCCs. It can be used in conventional or ...
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Cookson Group Plaskon® PPF-165 Conventional Epoxy Molding Compound
Material Notes. This material is a conventional epoxy molding compound specifically formulated for semiconductor devices which are molded with preplated leadframes. It increases semiconductor ...
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KMC�p���J�^���O* (Page 2)
... the long term reliability of semiconductor devices encapsulated with Shin-Etsu epoxy. molding compounds based on this technology has been drastically improved.. Y Properties of the Molding Compound vs ...
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EngNet - Chemical > Resins > Compound Epoxy Molding
Advanced Search | Help on Searching . Compound Epoxy Molding. 4 companies found - showing 1 to 4. Cangwu Shunfeng Titanium Dioxide Co. Ltd.. Mogalakwena Engineering ...
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Cookson Group Plaskon® LS-16 Low Stress Epoxy Molding Compound
... Epoxy Molding Compound Grade: LS-16 Categories: Epoxy, Adhesive, Thermoset, Polymer Material Category Name: polymer Trade Name: Plaskon® Manufactured by Cookson Group Keywords: Material Notes. This ...
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