Encapsulants and potting compounds are resins or adhesives that are used to encapsulate circuit boards and semiconductors, fill containers of electronic components, and infiltrate electrical coils. They provide environmental protection, electrical insulation and other specialized characteristics

Electrical resins and electronic compounds includes adhesives, greases, pads, stock shapes, tapes, encapsulants, potting compounds, thermal interface materials, and electrically conductive substances used in electrical, electronics, and semiconductor applications

Thermal compounds and thermal interface materials form a thermally conductive layer on a substrate, between components or within a finished product.

Electrical insulation and dielectric materials surround and protect electrical conductors such as wires and cables. They also prevent unwanted current flow or leakage.

Conformal coatings encapsulate circuit boards and their electronic components in order to prevent the ingress of moisture, fungus, dust and other environmental contaminants.

Conductive adhesives and compounds provide an electrically and/or thermally conductive path between components.

Materials processing services providers manufacture mechanically or thermally process metals, ceramics, polymers, glasses or other materials on a contract basis.

Glass fabrication services is the manufacturing of glass parts and assemblies using blowing, casting, extrusion, drawing, pressing, heat shrinking or other fabrication processes.  

Integrated circuit packaging is the final stage of semiconductor device fabrication in which the bare die or bare boards are placed inside of a protective packaging that provides connectors or pins for connecting to other devices

Chemical additives and agents include a wide range of materials added to polymer resins, paints and coatings, or adhesives to modify specific processing or end-use properties.

Form, fill, and seal machines are packaging equipment that uses flexible, heat-sealable, plastic film to form packages that can be filled with a product and then sealed, and cut.

Sealing and impregnation services use uses vacuum, pressure, vacuum and pressure (VPI), and/or wicking-action techniques to drive resins or coating materials into parts and seal pores.

Process development services can develop new processes, run process research and development (R&D) programs, perform optimization studies, improve current processing methods and provide other assistance in process development activities.

Nanoparticle and powder processing services perform milling, crushing, classifying, screening, grading, atomizing, coating, or production of metal or chemical powders and nanomaterials on a contractual basis.

Dielectric ceramics and substrates are electrical insulators with dielectric strength, dielectric constant and loss tangent values tailored for specific device applications.