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Product Categories for encapsulation resin
Electrical Resins and Electronic Compounds -
(311 companies)
Electrical resins and electronic compounds includes adhesives, greases, pads, stock shapes, tapes, encapsulants, potting compounds, thermal interface materials, and electrically conductive substances used in electrical, electronics, and semiconductor applications.
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Encapsulants and Potting Compounds -
(174 companies)
Encapsulants and potting compounds are resins or adhesives that are used to encapsulate circuit boards and semiconductors, fill containers of electronic components, and infiltrate electrical coils. They provide environmental protection, electrical insulation and other specialized characteristics
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Conductive Adhesives and Compounds -
(114 companies)
Conductive adhesives and compounds provide an electrically and/or thermally conductive path between components.
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Thermal Compounds and Thermal Interface Materials -
(116 companies)
Thermal compounds and thermal interface materials form a thermally conductive layer on a substrate, between components or within a finished product.
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Polymer Concrete and Mortar -
(84 companies)
Polymer concrete and mortar are binders, compounds, and aggregate mixtures that use epoxy, polyester, vinyl ester or other polymer resin bonds. They cure or set through chemical reactions, thermoset bonds, and multiple component binder systems
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Thermal Insulation and Fireproofing Materials -
(507 companies)
Thermal insulation and fireproofing materials reduce the flow of heat through the thickness of the material. They are typically fiber-based or foam structures prepared from thermally-stable materials.
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Electrical Insulation and Dielectric Materials -
(180 companies)
Electrical insulation and dielectric materials surround and protect electrical conductors such as wires and cables. They also prevent unwanted current flow or leakage.
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Chemical Additives and Agents -
(1224 companies)
Chemical additives and agents include a wide range of materials added to polymer resins, paints and coatings, or adhesives to modify specific processing or end-use properties
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Materials Processing Services -
(190 companies)
Materials processing services providers manufacture mechanically or thermally process metals, ceramics, polymers, glasses or other materials on a contract basis.
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Conformal Coatings -
(93 companies)
Conformal coatings encapsulate circuit boards and their electronic components in order to prevent the ingress of moisture, fungus, dust and other environmental contaminants.
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Specialty Cement, Concrete and Mortar -
(197 companies)
Specialty cement, concrete and mortar contain specialized binders such as K silicate, calcium aluminate, sulfur, and oxysulfate or polymer resins. They cure or set through film drying (air setting), chemical reactions, thermoset bonds, hydraulic bonds, hot melting, and multiple component binder systems
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Sealing and Impregnation Services -
(33 companies)
Sealing and impregnation services use uses vacuum, pressure, vacuum and pressure (VPI), and/or wicking-action techniques to drive resins or coating materials into parts and seal pores
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Molding Machines -
(242 companies)
Molding machines form thermoplastic resin, thermoset polymers, or MIM compounds into finished shapes
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Processing Services -
(1046 companies)
Chemical and material processing services modify or produce chemicals, powders, foods, minerals, rubber, plastics, adhesives, and other bulk materials on a contractual, toll or fee basis. Common processes include compounding, distillation, drying, formulation, mixing, blending, purification, extraction, synthesis, and powder milling.
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Dielectric Ceramics and Substrates -
(126 companies)
Dielectric ceramics and substrates are electrical insulators with dielectric strength, dielectric constant and loss tangent values tailored for specific device applications.
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Product Announcements for encapsulation resin
Product Announcements: 1 - 10 of 738
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Envax Products, Inc.
VE Series Vacuum Encapsulator
The primary cause of bubbles and voids in potting, encapsulation and resin-casting operations is entrapped air. The simplest way to eliminate the problem is to cast in a vacuum. The Envax VE Series Vacuum Encapsulator is designed as a complete solution for may potting, encapsulation and resin-casting applications.
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Master Bond, Inc.
High Performance Sealing & Encapsulation Compound
Master Bond EP30D-7LV is a flexible, two component, moderate viscosity, epoxy resin for sealing, potting and encapsulation. Its excellent electrical insulation properties and high dielectric strength>400 volts/mil, make it an ideal flexible compound for sealing capacitors and other electrical components; especially when resistance to vibration mechanical shock and thermal cycling.
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Browse Rubber Adhesives and Sealants Datasheets for Master Bond, Inc.
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Res-Kem Corp.
Resin Traps/Media Traps for Water Treatment
Resin Traps and Media Traps for Water Treatment Systems. Resin traps/media traps are protection devices that prevent a complete loss of ion exchange resin, activated carbon, filter media, greensand, sand, or multimedia from an underdrain, lateral or strainer failure. Resin traps save your downstream product, process, equipment and/or pumps from damage and contamination.
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Browse Ion Exchange Equipment Datasheets for Res-Kem Corp.
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Master Bond, Inc.
Custom Potting and Encapsulation Compounds
EP110F6 is a high performance epoxy sealing, potting, encapsulation and casting compound.It is a two component (1 to 2 mix ratio by weight) and cures upon exposure to elevated temperatures. It exhibits superior electrical insulation properties and outstanding resistance to thermal cycling and shock. Most importantly, it passes the Navy "Hex Bar" test, MILI-16923C, cycles from -55°C to +155°C.
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Browse Encapsulants and Potting Compounds Datasheets for Master Bond, Inc.
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Associated Polymer Labs, Inc.
Thermal Plastic Resin Fingerprinting System
"Fingerprint" the resin properties that will work for your company. APL's unique thermal plastic resin fingerprinting system utilizes a three step process to ensure a positive identification of the new resin system. This can save time, valuable resources and money.
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Res-Kem Corp.
Ion Exchange Resins
Res-Kem Corp. is a stocking distributor for:
- Dow - Dowex
- Purolite
- Sybron Bayer - Ionac & Lewatit
- Thermax - Tulsion
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Protavic America, Inc.
Potting Resins
Protavic encapsulation resins are designed to perform in the most difficult environments. Our epoxies, urethanes, silicone and hybrids formulations are engineered to meet your needs. Please review the partial listing below for some of our best sellers.
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Browse Electrical Resins and Electronic Compounds Datasheets for Protavic America, Inc.
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Mitsui Chemicals America, Inc.
ADMER® Adhesive Resin
An adhesive resin, ADMER® is used in multilayer packaging
systems in the food industry and in plastic fuel tanks (PFT), fuel lines, fuel
filler pipes, and connectors in the automotive industry. It is also used in
industrial and medical applications.
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Mitsui Chemicals America, Inc.
MILEX™ Phenolic Resin
The MILEX™ Family of products is primarily used as binders in brake pad and clutch facing disc friction materials. This brake friction material enables superior performance at elevated temperatures, reduces brake noise, achieves good friction, lowers vibratory lurch and reduces system wear and tear.
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Solvay Advanced Polymers, LLC
Torlon® polyamide-imide resin
TORLON polyamide-imide offers the advantages of a thermoset, in that once cured, it provides unstoppable performance in some of the most severe service environments. But like a thermoplastic, it can be processed by standard methods such as injection molding, extrusion and compression molding.
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Other Topics You Might Be Interested In
Low coefficient of thermal expansion (CTE) epoxies play an important role in the engineering and construction of electronic circuit boards as well as having great adhesive properties for other...
( Read More)
Tools & Useful Links for encapsulation resin
Tools & Useful Links: 1 - 2 of 2
Engineering Web: encapsulation resin
1 - 10 of 48,733
Cookson Group Plaskon® 150.401 Encapsulation Resin
A second generation SMT-B family product. This material is the initial developmental, general purpose SMT-B encapsulation grade resin and has good adhesion to solder resist with no plasma or UV/Ozone ...
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Low-stress encapsulation resin for VLSI
Keywords: thermal expansion coefficient polymer mixture IC packaging encapsulation resin VLSI low-stress molding compound soft-elastomer-domain epoxy-resin matrix structure physical properties domain ...
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Printing encapsulation systems (PES) of advanced multichip module and COB device
Keywords: advanced multichip module COB device printing encapsulation system optimal encapsulation resin properties control of resin viscosity open lid storage thixotropic property index void-free ...
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The development of a new resin with high mechanical strength at a high ...
Keywords: reliability high mechanical strength fine pitch devices tape carrier package LCD driver ICs shearing stress thermal bonding LCD panels encapsulation resin high-temperature-resistant resin ...
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[No Title]
an encapsulation resin filled up in the reception concavity; and. a stopper resin layer formed on the top face of the base member for covering at least boundaries of the electric conductive pattern ...
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Light-emitting diode with low thermal resistance invention
... with an encapsulation resin. 39. The light-emitting diode structure of claim 38, further comprising a transparent cover plate or a lens covering at least a portion of the encapsulation resin. 40. The ...
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Light-emitting diode with low thermal resistance invention
A housing sitting on top of the first and second leads may provide a recessed volume that is filled with an encapsulation resin or a transparent resin and further covered by a transparent cover plate ...
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Slica fine particles invention
... resin, therefore, it is difficult to mold the semiconductor-encapsulation resin. [0007] To suppress the enhancement viscosity by adding the fumed silica particles to the resin at high content the use ...
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Material Data Sheet SOD323 Eutectic
7439-96-5 0.25 0.0122 2482 Silicon 7440-21-3 0.09 0.0046 931 Silver 7440-22-4 0.06 0.003 620 Wires Gold Gold 7440-57-5 1.02 1.02 0.050 10204 Encapsulation Resin Filled epoxy - 14.26 58.91 0.699 142562 ...
See Zetex Inc. Information
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[No Title]
Substrate Material. Die Paste Material. Package Material. Die Paste Material. Encapsulation Resin. Encapsulation Resin. Package Structure. Die stage Structure. Die stage Dimension. Non Lead-free. Lead-free ...
See Fujitsu Limited Information
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