Materials processing services providers manufacture mechanically or thermally process metals, ceramics, polymers, glasses or other materials on a contract basis

Encapsulants and potting compounds are resins or adhesives that are used to encapsulate circuit boards and semiconductors, fill containers of electronic components, and infiltrate electrical coils. They provide environmental protection, electrical insulation and other specialized characteristics.

Thermal compounds and thermal interface materials form a thermally conductive layer on a substrate, between components or within a finished product

Electrical insulation and dielectric materials surround and protect electrical conductors such as wires and cables. They also prevent unwanted current flow or leakage

Electrical resins and electronic compounds includes adhesives, greases, pads, stock shapes, tapes, encapsulants, potting compounds, thermal interface materials, and electrically conductive substances used in electrical, electronics, and semiconductor applications

Thermal insulation and fireproofing materials reduce the flow of heat through the thickness of the material. They are typically fiber-based or foam structures prepared from thermally-stable materials

Dielectric ceramics and substrates are electrical insulators with dielectric strength, dielectric constant and loss tangent values tailored for specific device applications.

Conductive adhesives and compounds provide an electrically and/or thermally conductive path between components.

Chemical and material processing services modify or produce chemicals, powders, foods, minerals, rubber, plastics, adhesives, and other bulk materials on a contractual, toll or fee basis. Common processes include compounding, distillation, drying, formulation, mixing, blending, purification, extraction, synthesis, and powder milling

Nanoparticle and powder processing services perform milling, crushing, classifying, screening, grading, atomizing, coating, or production of metal or chemical powders and nanomaterials on a contractual basis.

Form, fill, and seal machines are packaging equipment that uses flexible, heat-sealable, plastic film to form packages that can be filled with a product and then sealed, and cut.

Conformal coatings encapsulate circuit boards and their electronic components in order to prevent the ingress of moisture, fungus, dust and other environmental contaminants.

Chemical additives and agents include a wide range of materials added to polymer resins, paints and coatings, or adhesives to modify specific processing or end-use properties

Glass fabrication services is the manufacturing of glass parts and assemblies using blowing, casting, extrusion, drawing, pressing, heat shrinking or other fabrication processes.  

Integrated circuit packaging is the final stage of semiconductor device fabrication in which the bare die or bare boards are placed inside of a protective packaging that provides connectors or pins for connecting to other devices.