20-3063 is an electronic grade potting and encapsulating compound. This is a low cost epoxy system designed for applications requiring a low viscosity. 20-3063 has an easy one to one mix ratio by weight or volume. The resin is pigmented black and the catalyst white for a visual indication that the products have been properly mixed together. (read more)

Epoxies etc...'s 50-2369 FR is the fastest self extinguishing Thermally Conductive Polyurethane Potting Compound available on the market today. Offering a unique combination of properties seldom seen in a Thermally Conductive Potting Compound, 50-2369 FR provides a quick heat dissipating system in a polyurethane chemistry, while also passing UL's 94 V-O self extinguishing test. (read more)

Epoxies, Etc… Develops NewUV Curable Adhesive & Potting Compound (read more)

20-2353 is a low durometer (Shore A 50) potting, casting, and encapsulating compound. This two part system is engineered to provide low stress on electronic components and to resist moisture. 20-2353 provides excellent hydrolytic stability, low moisture permeability, a low glass transition temperature, and low stress on sensitive components. (read more)

50-2366 FR is a new thermally conductive polyurethane potting compound. This flexible system is designed for low stress on sensitive components during and after cure. 50-2366 FR polyurethane resin system is formulated for applications requiring low exotherm, low shrinkage, and excellent electrical properties. (read more)

RUDOLPH BROS. & CO. OFFERS A NEW LOW COST TWO COMPONENT, ROOM TEMPERATURE CURE SEMI-FLEXIBLE EPOXY POTTING AND ENCAPSULTAING SYSTEM (read more)

Epoxies, Etc's new electronic grade 20-2620 is a two component Polyurethane compound designed for applications requiring "water like" clarity. This room temperature curing system provides excellent environmental protection and will not yellow over time. (read more)

Rudolph Bros. & Co. offers an extensive line of polyurethane potting and encapsulating systems which are Low Cost, Easy to Handle and Non-MBOCA Non-TDI based products. (read more)

Master Bond has developed, a two component sealing, potting, encapsulation and casting epoxy EP110F6. It exhibits superior resistance to thermal cycling and shock and passes the Navy "Hex Bar" test, MILI-16923C. EP110F6 resists a wide range of chemicals, elongation is 102%, Shore D hardness is 65, resistivity >1015 ohm-cm, CTE is 80-90 in/in x 10-8/C and dielectric strength >440 volts/mil. (read more)

20-2305 - This two component urethane series are low durometer (25-90 Shore A), potting, casting, and encapsulating compounds. They are unfilled materials engineered to provide excellent hydrolytic stability and low moisture permeability. They have outstanding thermal cycling properties, low glass transition temperatures and low embedment stress to sensitive electronic components. (read more)