Epoxies etc...'s 50-2369 FR is the fastest self extinguishing Thermally Conductive Polyurethane Potting Compound available on the market today. Offering a unique combination of properties seldom seen in a Thermally Conductive Potting Compound, 50-2369 FR provides a quick heat dissipating system in a polyurethane chemistry, while also passing UL's 94 V-O self extinguishing test. (read more)

All Seals, Inc. distributes Electrical Resins and Electronic Compounds from 3M, Epoxies Etc., Adhesive Systems, and Dow Corning. (read more)

20-2353 is a low durometer (Shore A 50) potting, casting, and encapsulating compound. This two part system is engineered to provide low stress on electronic components and to resist moisture. 20-2353 provides excellent hydrolytic stability, low moisture permeability, a low glass transition temperature, and low stress on sensitive components. (read more)

50-2366 FR is a new thermally conductive polyurethane potting compound. This flexible system is designed for low stress on sensitive components during and after cure. 50-2366 FR polyurethane resin system is formulated for applications requiring low exotherm, low shrinkage, and excellent electrical properties. (read more)

Master Bond has developed, a two component sealing, potting, encapsulation and casting epoxy EP110F6. It exhibits superior resistance to thermal cycling and shock and passes the Navy "Hex Bar" test, MILI-16923C. EP110F6 resists a wide range of chemicals, elongation is 102%, Shore D hardness is 65, resistivity >1015 ohm-cm, CTE is 80-90 in/in x 10-8/C and dielectric strength >440 volts/mil. (read more)

Rudolph Bros. & Co. offers an extensive line of polyurethane potting and encapsulating systems which are Low Cost, Easy to Handle and Non-MBOCA Non-TDI based products. (read more)

20-2305 - This two component urethane series are low durometer (25-90 Shore A), potting, casting, and encapsulating compounds. They are unfilled materials engineered to provide excellent hydrolytic stability and low moisture permeability. They have outstanding thermal cycling properties, low glass transition temperatures and low embedment stress to sensitive electronic components. (read more)

20‑3650 is an easy to use, one to one ratio, electronic grade epoxy potting, casting, and encapsulating system. This system exhibits excellent physical, thermal, and electrical insulation properties. 20-3650 is D.O.T. non-hazardous, easy to mix, and will cure at room temperature or with mild heat. (read more)

RUDOLPH BROS. & CO. OFFERS A NEW LOW COST TWO COMPONENT, ROOM TEMPERATURE CURE SEMI-FLEXIBLE EPOXY POTTING AND ENCAPSULTAING SYSTEM (read more)

EP110F6 is a high performance epoxy sealing, potting, encapsulation and casting compound.It is a two component (1 to 2 mix ratio by weight) and cures upon exposure to elevated temperatures. It exhibits superior electrical insulation properties and outstanding resistance to thermal cycling and shock. Most importantly, it passes the Navy "Hex Bar" test, MILI-16923C, cycles from -55°C to +155°C. (read more)