Optically bonding an LCD, OLED or Plasma display improves both optical performance and durability. Providing a durable adhesion between the flat screen and the overlay improves the displays' ability to resist shock, vibration and moisture. (read more)

Ultra-Temp^tm 516, a new high temperature ceramic-based adhesive manufactured by Aremco Products, Inc., is now used to bond zirconia ceramics used in applications to 4400 ^oF. (read more)

Optically bonding an LCD, OLED or Plasma display improves optical performance and the display's ability to resist shock, vibration and moisture. An appropriate adhesive that matches the index of refraction of the flat panel and the overlay can remove all the air gaps, thus reducing the number of internal reflecting surfaces that can lead to degradation of optical performance. (read more)

Master Bond developed a UV curable urethane compound, UV21. Offering a fast curing alternative to conventional moisture curing silicone materials used for in-place seals, gaskets, bonding and protective coatings, its chemical resistance, strength & degree of flexibility exceeds those of RTV silicones while its electrical insulation properties withstand protracted exposure to moisture (read more)

Bond-Rite Self Testing Clamps and Static Bond Indicating Systems

provide local indication of proper bonding for applications where interlock is not practical or required. (read more)

The Guardian 1050 Ground Bond Tester provides up to 45A for high current testing to even the most stringent standards. The front panel of the Guardian instrument includes a digital display and user-friendly control allowing test parameters and limits to be set easily without the high voltage activated. (read more)

The Sentry 50 Plus Ground Bond Tester provides up to 30A for high current testing to even the most stringent standards. The front panel of the Sentry instrument includes a digital display and user-friendly control allowing test parameters and limits to be set easily without the high voltage activated. (read more)

BONDiT C-52 bonds Ryton PPS (polyphenyl sulfide) to beryllium copper in molding operations for military application. RELTEK adhesion promoter C-52 has demonstrated excellent versatility in promoting adhesion between polyethylene, polypropylene and polyester, and now adhesion with PPS while withstanding high temperature molding processes and protecting the metal substrate from corrosion. (read more)

Bonds a wide-variety of substrates including PVC, ABS, and polycarbonate Convenient two-component, no-mix system for rapid production applications (read more)

The new Vitrek V5 combines AC Hipot to 5KV, DC Hipot to 6KV, insulation resistance to 10 gig-ohms and high current ground bond measurement up to 42 Amps and a built-in 8 channel HV Scanner. (read more)