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Electrical resins and electronic compounds includes adhesives, greases, pads, stock shapes, tapes, encapsulants, potting compounds, thermal interface materials, and electrically conductive substances used in electrical, electronics, and semiconductor applications
Electrical insulation and dielectric materials surround and protect electrical conductors such as wires and cables. They also prevent unwanted current flow or leakage
Learn MoreEncapsulants and potting compounds are resins or adhesives that are used to encapsulate circuit boards and semiconductors, fill containers of electronic components, and infiltrate electrical coils. They provide environmental protection, electrical insulation and other specialized characteristics
Search by Specification | Learn MoreConductive adhesives and compounds provide an electrically and/or thermally conductive path between components.
Search by Specification | Learn MoreThermal compounds and thermal interface materials form a thermally conductive layer on a substrate, between components or within a finished product.
Search by Specification | Learn MoreDielectric ceramics and substrates are electrical insulators with dielectric strength, dielectric constant and loss tangent values tailored for specific device applications
Search by Specification | Learn MoreSpecialty tapes and films use proprietary or patented technologies and constructions, and are designed for specific industries and specialized applications.
Search by Specification | Learn MoreIntegrated circuit packaging is the final stage of semiconductor device fabrication in which the bare die or bare boards are placed inside of a protective packaging that provides connectors or pins for connecting to other devices
Learn MoreProduct and component testing services is the evaluation of a finished product or component through performance in electrical, life, environmental exposure, dynamic, ergonomic or other specialized tests. Also testing to standards such as UL 489, CE or MIL-STD 810
Search by Specification | Learn MoreIndustrial tape is used for adhesive bonding, thread sealing, masking, packaging, wrapping, electrical insulation, ESD control and other specialized applications
Search by Specification | Learn MoreAdhesive tapes and films temporarily or permanently join materials together.
Search by Specification | Learn MoreDouble coated tapes are coated with adhesive on both sides of the backing or carrier. Transfer tapes consist of a thin adhesive film without a carrier or backing.
Search by Specification | Learn MoreNon-destructive testing (NDT) services use test methods to examine an object, material or system without impairing its future usefulness.
Search by Specification | Learn MoreSolders include low melting point metal alloys usually in wire, powder, preform or paste forms. Solders are metal alloys with low melting points that are used to join metals together.
Search by Specification | Learn MoreMetal wire and strand has a round, flat, or shaped cross section. Products are usually less than 0.375" in diameter.
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Potting Resins Protavic America, Inc.
Electrical Resins and Electronic Compounds All Seals, Inc.
Adhesives for Electronics Brochure Permabond
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Aluminum Die Casting from Kurt Manufacturing. Kurt is a recognized leader in the manufacturing of aluminum die-castings. Kurt Die Cast Quality System is registered to ISO 9001/2000. Our 90,000 square foot facility houses 20 cold chamber die cast machines; trim tools, finishing services and in-house machining and assembly operations. (read more)
Kurt is a recognized leader in the manufacturing of aluminum die-castings. (read more)
Ultrasonically Weld Non-ferrous and Dissimilar Metals
Sonobond Ultrasonics' SonoWeld® and SpliceRite™ ultrasonic metal welders weld without heat, current or consumables. They create solid-state metallurgical bonds quickly, efficiently and cleanly with repeatable accuracy. Long-lasting, quick-change steel taper lock tips perform up to 100,000 durable, dependable... (read more)
Die casting has a well-established reputation as an efficient, economical process that offers designers a variety of advantages for creating parts and components. These benefits often make die casting the obvious choice when selecting a manufacturing process for a particular part. (read more)
Can-Do has die cutting capabilities for a variety of adhesive materials. These materials can include fabrics, foils, foams, and other substrates with adhesive backing. (read more)
Hitachi Metals' unique cold die steel, SLD-MAGIC™ has revolutionized the metal forming and tooling industry. In keeping with its stated business objectives, Hitachi Metals has developed a cost reducing, eco-friendly alternative to existing cold die steels that actually extends the life of cold press and forging dies. (read more)
Precision die cut adhesives tailored to your application for automated assembly. (read more)
Aluminum die castings are lightweight and can withstand the highest operating temperatures of all die cast alloys. Ideal for demanding environments, they offer high strength and rigidity along with good corrosion resistance and heat dissipation. (read more)
Globally, Dynacast has produced billions of zinc die cast components from one hundredth of a gram to one kilogram, using a combination of our proprietary multi-slide and conventional hot chamber die casting technologies. (read more)
Cooper Crouse-Hinds® Zinc Die Cast Fittings are available for use with EMT, Rigid and IMC Conduit, Liquidtight Conduit, Armored Cable or Flexible Metallic Conduit. (read more)
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TDK - Factory Automation The flip chip GGI die attach process provides up to a 70% form factor size reduction and superior electrical high frequency performance compared to See TDK Corp. Of America Information |
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SMART Group FINETECH GmbH & Co - Die & Flip Chip Bonder and Rework Equipment |
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AN-1061_re_Die Attach & Bonding.p65 Application Note AN-1061 Bare Die: Die Attach and Wire Bonding Guidance for setting up assembly processes By Richard Clark Table of Contents Page See International Rectifier Information |
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TOSHIBA MICROWAVE POWER GaAs FET APPLICATION NOTES Recommended... 2. A heater stage for die attaching, a wire bonder, tweezers and the operators should be grounded to avoid damage due to electrostatic discharge. |
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IMAPS - Corporate Bulletin :: Hesse & Knipps, Inc. Debuts New Heavy Wire Bonder at APEX Booth #1871 (full story) See International Microelectrics and Packaging Society Information |
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IMAPS 2004 - Technical Program, Wednesday, November 17, 2004 WA1 High Heat Flux Management and Direct Die Attach Solder TIMS Chair: Dave Saums, DS&A LLC 8 am - 9:25 am See International Microelectrics and Packaging Society Information |
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Advanced-Chip-to-Wafer Technology : Enabling Technology for... of this technology and the challenges facing the die- and the newly developed chip-to-wafer bonder. See Datacon North America, Inc. Information |
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Gearing up for flip chip pick face-down die out of a waffle pack and dip them into a dish of conductive adhesive on a micrometer-leveled pedestal on the bonder's |
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canon:About Canon | Canon Group Products BESTEM-D02Sp die bonder Top of Page IAMS Mass Spectrometer |
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Class 228: METAL FUSION BONDING ( Manual of U.S. Patent... . . . Drawing elongated member through die . . Of electrical device (e.g., semiconductor) |