Foam bonding tapes are specialized tapes designed for adhesive joining of foam materials

Conductive adhesives and compounds provide an electrically and/or thermally conductive path between components.

Electrical resins and electronic compounds includes adhesives, greases, pads, stock shapes, tapes, encapsulants, potting compounds, thermal interface materials, and electrically conductive substances used in electrical, electronics, and semiconductor applications.

Encapsulants and potting compounds are resins or adhesives that are used to encapsulate circuit boards and semiconductors, fill containers of electronic components, and infiltrate electrical coils. They provide environmental protection, electrical insulation and other specialized characteristics.

In the forging process, metal is shaped by pressing, pounding, or squeezing under very high pressure, to form parts called forgings.  Forging processes include cold forging or heading, impression or closed die, open die, and seamless rolled ring

Integrated circuit packaging is the final stage of semiconductor device fabrication in which the bare die or bare boards are placed inside of a protective packaging that provides connectors or pins for connecting to other devices

Thermal compounds and thermal interface materials form a thermally conductive layer on a substrate, between components or within a finished product.

Specialty tapes and films use proprietary or patented technologies and constructions, and are designed for specific industries and specialized applications.

Double coated tapes are coated with adhesive on both sides of the backing or carrier. Transfer tapes consist of a thin adhesive film without a carrier or backing.

Industrial tape is used for adhesive bonding, thread sealing, masking, packaging, wrapping, electrical insulation, ESD control and other specialized applications

Electrical insulation and dielectric materials surround and protect electrical conductors such as wires and cables. They also prevent unwanted current flow or leakage.

Metal wire and strand has a round, flat, or shaped cross section. Products are usually less than 0.375" in diameter.

IC sockets and interconnect components interface or connect a microelectronic semiconductor chip to a board or larger scale device.

Mold releases and release agents are film forming lubricating oils, solid lubricants, waxes, fluids or coatings that prevent other materials from sticking or adhering to an underlying surface.

Adhesive tapes and films temporarily or permanently join materials together.