Encapsulants and potting compounds are resins or adhesives that are used to encapsulate circuit boards and semiconductors, fill containers of electronic components, and infiltrate electrical coils. They provide environmental protection, electrical insulation and other specialized characteristics.

Thermal compounds and thermal interface materials form a thermally conductive layer on a substrate, between components or within a finished product.

Electrical resins and electronic compounds includes adhesives, greases, pads, stock shapes, tapes, encapsulants, potting compounds, thermal interface materials, and electrically conductive substances used in electrical, electronics, and semiconductor applications.

Electrical insulation and dielectric materials surround and protect electrical conductors such as wires and cables. They also prevent unwanted current flow or leakage.

Thermal insulation and fireproofing materials reduce the flow of heat through the thickness of the material. They are typically fiber-based or foam structures prepared from thermally-stable materials.

Conductive adhesives and compounds provide an electrically and/or thermally conductive path between components.

Dielectric ceramics and substrates are electrical insulators with dielectric strength, dielectric constant and loss tangent values tailored for specific device applications.

Industrial sealants are liquid or viscous compounds used between surfaces to contain fluids, prevent leaks, and prevent infiltration of unwanted material. They may also include compounds for filling gaps or seams.

Elastomers and rubber materials are characterized by their high degree of flexibility and elasticity (high reversible elongation or resilience).

Gel elastomers are highly viscoelastic polymer gel materials that have excellent shock absorption and damping characteristics. They are available in a variety of material types and grades.