Conductive adhesives and compounds provide an electrically and/or thermally conductive path between components

Thermal compounds and thermal interface materials form a thermally conductive layer on a substrate, between components or within a finished product

Thermoplastics and thermoplastic materials soften when heated and harden when cooled. They can withstand many heating and cooling cycles and are often suitable for recycling

Encapsulants and potting compounds are resins or adhesives that are used to encapsulate circuit boards and semiconductors, fill containers of electronic components, and infiltrate electrical coils. They provide environmental protection, electrical insulation and other specialized characteristics.

Electrical resins and electronic compounds includes adhesives, greases, pads, stock shapes, tapes, encapsulants, potting compounds, thermal interface materials, and electrically conductive substances used in electrical, electronics, and semiconductor applications

Plastics and plastic materials are organic, synthetic or processed polymers that are supplied as raw materials or stock shapes. They typically consist of thermoplastic or thermosetting resins and can be made into many forms

Industrial adhesives are organic or inorganic chemical compounds for joining components. This category covers all adhesive types.

Epoxy adhesives are chemical compounds for joining components. They require clean surfaces and are valued for their toughness and resistance to chemical and environmental damage.

Specialty adhesives, sealants and compounds are specialized and/or proprietary products with unique chemistries, cure technologies and/or compositions.

Elastomers and rubber materials are characterized by their high degree of flexibility and elasticity (high reversible elongation or resilience).

Polyurethane adhesives and sealants provide excellent flexibility, impact resistance, and durability. They are available in one-part or two-part adhesive systems.

Silicone adhesives and silicone sealants have a high degree of flexibility and very high temperature resistance.

Rubber adhesives and rubber sealants are highly flexible, natural or synthetic materials that are used to join components or fill gaps between seams or on surfaces.

Hot melt adhesives are solvent-free chemical compounds that are used to join materials. They can be repeatedly softened by heat and hardened or set by cooling, allowing parts to be removed or repositioned during assembly.

Resins and compounds are pellets, liquid resins, bulk molding compounds, or other unfinished materials that are ready for shape fabrication or bond formation.