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The Engineering Toolbar
The Ultimate Resource for Engineering and Technical Research. (Learn More) |
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Protavic resins are used to protect, insulate and dissipate heat and to conceal circuitry, components and devices. These formulations were designed to satisfy the requirements of many demanding potting, encapsulating and casting applications in the electronic, electrical, automotive and aerospace industries. (read more)
Thermal compounds and thermal interface materials form a thermally conductive layer on a substrate, between components or within a finished product
Conductive adhesives and compounds provide an electrically and/or thermally conductive path between components
Search by Specification | Learn MoreEpoxy adhesives are chemical compounds for joining components. They require clean surfaces and are valued for their toughness and resistance to chemical and environmental damage
Search by Specification | Learn MoreEncapsulants and potting compounds are resins or adhesives that are used to encapsulate circuit boards and semiconductors, fill containers of electronic components, and infiltrate electrical coils. They provide environmental protection, electrical insulation and other specialized characteristics.
Search by Specification | Learn MoreThermosets and thermoset materials are crosslinked polymeric resins that are cured or set using heat or heat and pressure. They generally have a higher resistance to heat than thermoplastics.
Search by Specification | Learn MorePlastics and plastic materials are organic, synthetic or processed polymers that are supplied as raw materials or stock shapes. They typically consist of thermoplastic or thermosetting resins and can be made into many forms.
Search by Specification | Learn MoreElectrical resins and electronic compounds includes adhesives, greases, pads, stock shapes, tapes, encapsulants, potting compounds, thermal interface materials, and electrically conductive substances used in electrical, electronics, and semiconductor applications
Search by Specification | Learn MoreFloor coatings are tough protective layers used in applications where heavy surface wear or corrosion is expected. Typical applications include warehouses, chemical plants, and manufacturing floors.
Learn MorePolymer concrete and mortar are binders, compounds, and aggregate mixtures that use epoxy, polyester, vinyl ester or other polymer resin bonds. They cure or set through chemical reactions, thermoset bonds, and multiple component binder systems
Search by Specification | Learn MoreIndustrial paints are pigmented liquids or powders that are used to protect and/or beautify substrates.
Search by Specification | Learn MoreMolding compounds and resins are industrial plastics and polymers that are suitable for forming. They are available as pellets, liquids, and powders and are used in processes such as injection molding, compression molding, reaction injection molding (RIM), resin transfer molding (RTM), and blow molding.
Search by Specification | Learn MoreIndustrial adhesives are organic or inorganic chemical compounds for joining components. This category covers all adhesive types.
Search by Specification | Learn MoreSpecialty adhesives, sealants and compounds are specialized and/or proprietary products with unique chemistries, cure technologies and/or compositions.
Search by Specification | Learn MoreCasting resins are pourable plastic or elastomer compounds used to cast parts, make molds or form a structure in place.
Search by Specification | Learn MoreIndustrial coatings are thin films deposited upon materials to add or enhance desired properties, such as color, conductivity, corrosion resistance, etc.
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Thermal Products Protavic America, Inc.
Fast “5 Minute” Curing Heat Dissipative Epoxy Master Bond, Inc.
Very soft thermal conductive gel TAICA Corporation (formerly Geltec Co., Ltd.)
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Epoxies, Etc... has developed a single component electrically conductive epoxy adhesive. This versatile conductive adhesive exhibits excellent mechanical integrity and thermal stability with no chemical corrosion at elevated temperature exposure during wire bonding and soldering. (read more)
40‑3900 is a two component epoxy adhesive filled with pure silver. This electrically conductive epoxy resin formulation offers the maximum in continuity of conductivity with an electrical resistivity value of less than 1x10‑4 ohm‑cm. 40‑3900 is also well known for its' wide operating temperature range, ‑50 to + 170oC. (read more)
RFC-2869 Mod 2 is one-part, silver filled, electrically conductive epoxy adhesive. When cured, this adhesive will have very high thermal and electrical conductive properties. In addition, it bonds very well to many substrates. (read more)
Thermal Cure Epoxy is a specially blended high molecular weight coating which provides outstanding corrosion resistance in most environments. (read more)
Aremco-Bond tm 805, a new high temperature, thermally conductive epoxy system developed by Aremco Products, Inc., is now for bonding and tooling applications to 300 oC (572 oF). (read more)
Epoxies, Etc... has developed 50-3150 FR to meet the stringent non-burning requirements of UL94 V-O. 50-3150 FR Black Epoxy with Catalyst 190 and Catalyst 105 are listed with Underwriter's Laboratory for passing UL94 V-O. This system offers excellent heat transfer, low shrinkage, and outstanding insulation properties. (read more)
Epoxies, Etc... develops a one component electronic grade epoxy adhesive. 50-3122 has a unique combination of properties. This adhesive provides both high shear and high peel strength. It is also able to maintain exceptionally strong bonds over a wide temperature range of -60 to +205 C. (read more)
Aremco offers a broad line of electrically and thermally conductive materials which provide solutions to a variety of electrical, electronic and thermal design problems throughout industry… (read more)
Light weight Master Bond adhesive EP30BN offers enhanced thermal management of heat generating components. The Boron Nitride Compound Provides excellent heat dissipation within aerospace and microelectronic assemblies. It features, a high thermal conductivity, low specific gravity, volume resistivity 1014 ohm cm and dielectric constant of 4.2 at 1 KHZ. (read more)
Epoxies etc...'s 50-2369 FR is the fastest self extinguishing Thermally Conductive Polyurethane Potting Compound available on the market today. Offering a unique combination of properties seldom seen in a Thermally Conductive Potting Compound, 50-2369 FR provides a quick heat dissipating system in a polyurethane chemistry, while also passing UL's 94 V-O self extinguishing test. (read more)
| Part # | Distributor | Manufacturer | Product Category | Description |
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| 00Z1602 | Newark | ITW Chemtronics | All Supplier Direct Ship | Adhesive Compound; Chemical Solution:2-Part Conductive Epoxy & Hardener; Features:Excellent Electrical Conductivity And High Thermal Conductivity, High Strength Bonding And Repairs ,Quick Solderless Electronic Connections Rohs Compliant: Yes |
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Thermal conductivity - Wikipedia, the free encyclopedia Thermal grease 0.7 - 3 Thermal epoxy 1 - 7 Thermal conductivity From Wikipedia, the free encyclopedia |
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Arctic Silver, Inc. - Arctic Alumina Thermal Adhesive Arctic Alumina Thermal Adhesive IS NOT intended to be used between a CPU and the CPU heatsink. |
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AI Technology, Inc. - Home 3.3: Thermal Interface Materials & Insulated Metal Substrates See AI Technology, Inc. Information |
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Thermal Conductivity of some common Materials Thermal Conductivity of some common Materials |
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High thermal conductive compounds invention High thermal conductive compounds -> Monitor Keywords |
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High thermal conductive compounds invention High thermal conductive compounds Title: High thermal conductive compounds The High thermal conductive compounds -> Monitor Keywords |
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LUXEON Thermal Design Guide Series Resistance Thermal Count 0.0625" thick) is adequate when operating at 25?C. Thermal Modeling T Die The purpose of thermal modeling is to See Philips Lumileds Lighting Company Information |
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Thermal Management Silver Conductive Epoxy Thermally Conductive Epoxy 1 Part Thermally Conductive RTV Silicone See M G Chemicals Ltd. Information |
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Thermal Finishes (1) THERMAL FINISHES 1. Acknowledgement: Much of the raw data was originally accumulated by NASA-GSFC |
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Thermal Adhesive Compound Manufacturers. Thermal... Key Words: Thermal Adhesive, Epoxy, Glue, Injection, Lamination, Conductive, Manufacturer, Pressure, Sensitive |