Epoxies etc...'s 50-2369 FR is the fastest self extinguishing Thermally Conductive Polyurethane Potting Compound available on the market today. Offering a unique combination of properties seldom seen in a Thermally Conductive Potting Compound, 50-2369 FR provides a quick heat dissipating system in a polyurethane chemistry, while also passing UL's 94 V-O self extinguishing test. (read more)

50-2366 FR is a new thermally conductive polyurethane potting compound. This flexible system is designed for low stress on sensitive components during and after cure. 50-2366 FR polyurethane resin system is formulated for applications requiring low exotherm, low shrinkage, and excellent electrical properties. (read more)

Although Epoxies, Etc... offers a complete standard product line, we also custom formulate Potting and Encapsulating Compounds for specific customer requirements. (read more)

Rudolph Bros. & Co. offers an extensive line of polyurethane potting and encapsulating systems which are Low Cost, Easy to Handle and Non-MBOCA Non-TDI based products. (read more)

Sauereisen Thermal Potting Cement No. 11 is primarily used where high electrical insulation and thermal conductivity are desired. No. 11 is a chemical-setting cement ideal for potting applications subject to high temperature and thermal shock. (read more)

20-2353 is a low durometer (Shore A 50) potting, casting, and encapsulating compound. This two part system is engineered to provide low stress on electronic components and to resist moisture. 20-2353 provides excellent hydrolytic stability, low moisture permeability, a low glass transition temperature, and low stress on sensitive components. (read more)

20-3063 is an electronic grade potting and encapsulating compound. This is a low cost epoxy system designed for applications requiring a low viscosity. 20-3063 has an easy one to one mix ratio by weight or volume. The resin is pigmented black and the catalyst white for a visual indication that the products have been properly mixed together. (read more)

Design more durable, vibration resistant, moisture proof electronic assemblies at a savings of up to 80% with Epoxies, etc… revolutionary breakthrough potting compound. The new 20-2353 solves the problem of electronic components that require protection against moisture, thermal shock, vibration and very low temperatures. (read more)

Master Bond has developed, a two component sealing, potting, encapsulation and casting epoxy EP110F6. It exhibits superior resistance to thermal cycling and shock and passes the Navy "Hex Bar" test, MILI-16923C. EP110F6 resists a wide range of chemicals, elongation is 102%, Shore D hardness is 65, resistivity >1015 ohm-cm, CTE is 80-90 in/in x 10-8/C and dielectric strength >440 volts/mil. (read more)

20‑3650 is an easy to use, one to one ratio, electronic grade epoxy potting, casting, and encapsulating system. This system exhibits excellent physical, thermal, and electrical insulation properties. 20-3650 is D.O.T. non-hazardous, easy to mix, and will cure at room temperature or with mild heat. (read more)